• Title/Summary/Keyword: Nano 입자

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Characteristics of Nano-structured SiO2:Zn Hollow Powders Prepared in the Micro Drop Fluidized Reactor (MDFR) Process (미세액적 유동반응기 공정에서 연속제조된 나노구조 SiO2:Zn 원환형 입자의 특성)

  • Yang, Si Woo;Kang, Yong;Kang, Ho
    • Korean Chemical Engineering Research
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    • v.56 no.4
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    • pp.585-591
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    • 2018
  • Characteristics of nano-structured $SiO_2:Zn$ hollow powders prepared in the micro drop fluidized reactor process were investigated with respect to bandgap energy and surface activity. The $SiO_2:Zn$ hollow powders were successfully prepared continuously in the one step process with reasonable production efficiency, with varying the amount of THAM (tris(hydroxymethyl)-aminomethane) additive and concentration of $Zn^{2+}$ ions. The doping of $Zn^{2+}$ ions into $SiO_2$ lattice led to the reduction of bandgap energy by forming the acceptor level of $Zn^{2+}$ below the conduction band of $Si^{4+}$ ions. The hollow shape also contributed to reduce the bandgap energy of $SiO_2:Zn$ powders. The doping of $Zn^{2+}$ ions into $SiO_2$ hollow powders could enhance the surface activity by forming SiO-H stretching and oxygen vacancies at the surface of $SiO_2:Zn$ powders.

Hydrogen production using CdS-TiO2 composite photocatalysts (CdS-TiO2 복합 광촉매계에 의한 수소제조)

  • Kim, Soo-Sun;Jang, Jum-Suk;So, Won-Wook;Kim, Kwang-Je;Moon, Sang-Jin
    • Transactions of the Korean hydrogen and new energy society
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    • v.11 no.4
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    • pp.161-169
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    • 2000
  • In the case of photocatalytic hydrogen production from water, the performance-property relationships of CdS-TiO2 film type composite catalysts were investigated. To control the physical properties of the primary particles, the mixture of CdS and TiO2 nano-sols prepared by the sol-gel method at room temperature was hydrothermally treated at 240oC for 12hr. The film electrodes were prepared by the casting method. The photocurrents measured by a photoelectrochemical method and the hydrogen production rates measured by a photochemical method were closely dependent on the physical properties such as crystalline form, primary particle size and CdS/TiO2 mole ratio, and these varied in the range of 1.2~2.6 mA/cm2 and $1.0{\sim}1.6{\times}10-3mol/hr$, respectively.

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A Study on the Low Speed Impact Response and Frictional Characteristics of Shear Thickening Fluid Impregnated Kevlar Fabrics (전단농화유체를 함침한 케블라 직물의 저속충격 거동 및 마찰특성 연구)

  • Lee, Bok-Won;Lee, Song-Hyun;Kim, Chun-Gon;Yoon, Byung-Il;Paik, Jong-Gyu
    • Composites Research
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    • v.21 no.2
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    • pp.15-24
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    • 2008
  • In this study, shear thickening fluid (STF) filled with rigid nano silica particles was impregnated in plain woven Kevlar fabrics to improve the impact resistance performance. The nano silica particles with an average diameter of 100nm, 300nm, and 500nm were used to make shear thickening fluid to estimate the effect of particle size on the impact behavior of STF impregnated Kevlar fabrics. The yam pull-out and frictional tests were conducted to estimate the effect of impregnated STF on the frictional characteristics. The test results showed that the friction forces were dramatically increased at the STF onset shear strain rates that were measured in preliminary rheology tests. The low speed impact tests were performed using the drop test machine. The results showed that the impregnated STF improved the impact resistance performance of the Kevlar fabrics in terms of the impact energy absorption and the deformation. It has been shown through tests that the impregnated STF affects the interfacial friction which contributes to improve the energy absorption in the Kevlar fabrics. Especially, the impregnation of the STF with the smaller particle size into the Kevlar fabrics showed the better performance in impact energy absorption.

Fabrication of Silica Nanoparticles by Recycling EMC Waste from Semiconductor Molding Process and Its Application to CMP Slurry (반도체 몰딩 공정에서 발생하는 EMC 폐기물의 재활용을 통한 실리카 나노입자의 제조 및 반도체용 CMP 슬러리로의 응용)

  • Ha-Yeong Kim;Yeon-Ryong Chu;Gyu-Sik Park;Jisu Lim;Chang-Min Yoon
    • Journal of the Korea Organic Resources Recycling Association
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    • v.32 no.1
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    • pp.21-29
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    • 2024
  • In this study, EMC(Epoxy molding compound) waste from the semiconductor molding process is recycled and synthesized into silica nanoparticles, which are then applied as abrasive materials contains CMP(Chemical mechanical polishing) slurry. Specifically, silanol precursor is extracted from EMC waste according to the ultra-sonication method, which provides heat and energy, using ammonia solution as an etchant. By employing as-extracted silanol via a facile sol-gel process, uniform silica nanoparticles(e-SiO2, experimentally synthesized SiO2) with a size of ca. 100nm are successfully synthesized. Through physical and chemical analysis, it was confirmed that e-SiO2 has similar properties compared to commercially available SiO2(c-SiO2, commercially SiO2). For practical CMP applications, CMP slurry is prepared using e-SiO2 as an abrasive and tested by polishing a semiconductor chip. As a result, the scratches that are roughly on the surface of the chip are successfully removed and turned into a smooth surface. Hence, the results present a recycling method of EMC waste into silica nanoparticles and the application to high-quality CMP slurry for the polishing process in semiconductor packaging.