• Title/Summary/Keyword: Multilayered structure

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Thermomechanical Analysis of Functionally Gradient Al-$SiC_{p}$ Composite for Electronic Packaging (전자패키지용 경사조성 Al-$SiC_{p}$ 복합재료의 열 . 기계적 변형특성 해석)

  • 송대현;최낙봉;김애정;조경목;박익민
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2000.04a
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    • pp.175-183
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    • 2000
  • The internal residual stresses within the multilayered structure with shan interface induced by the difference in thermal expansion coefficient between the materials of adjacent layers often provide the source of failure such as delamination of interfaces and etc. Recent development of the multilayered structure with functionally graded interface would be the solution to prevent this kind of failure. However a systematic thermo-mechanical analysis is needed fur the customized structural design of multilayered structure. In this study, theoretical model for the thermo-mechanical analysis is developed for multilayered structures of the Al-$SiC_p$ functionally graded composite for electronic packaging. The evolution of curvature and internal stresses in response to temperature variations is presented for the different combinations of geometry. The resultant analytical solutions are used for the optimal design of the multilayered structures with functionally graded interface as well as with sharp interface.

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Fabrication of Multilayered Structures in Electrochemical Etching using a Copper Protective Layer (구리 보호층을 이용한 전해에칭에서의 다층구조 제작)

  • Shin, Hong-Shik
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.2
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    • pp.38-43
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    • 2019
  • Electrochemical etching is a popular process to apply metal patterning in various industries. In this study, the electrochemical etching using a patterned copper layer was proposed to fabricate multilayered structures. The process consists of electrodeposition, laser patterning, and electrochemical etching, and a repetition of this process enables the production of multilayered structures. In the fabrication of a multilayered structure, an etch factor that reflects the etched depth and pattern size should be considered. Hence, the etch factor in the electrochemical etching process using the copper layer was calculated. After the repetition process of electrochemical etching using copper layers, the surface characteristics of the workpiece were analyzed by EDS analysis and surface profilometer. As a result, multilayered structures with various shapes were successfully fabricated via electrochemical etching using copper layers.

Design of antireflection coationgs on the facets of a multilayered structure waveguide device (다층 구조 도파관 소자 단면에의 무반사 코팅 설계)

  • 김용곤;김부균;주흥로
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.21 no.7
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    • pp.1850-1860
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    • 1996
  • We present the results for the design ofantireflection (AR) coatings on facets of a multilayered structure waveguide device. The method, whose results agree very well with the reusults of the rigorous method in the case of a symmetric three layer structure deveice, is extended for the design of AR coatings on the facets of a multilayered structure waveguide device. the field profile in a multilayered structure waveguide necessary for the use of the extended method is obtained from the transfer matrix method. The virtual four layered structure method (VFLM) is proposed to reduce the time for the design ofAR coatings because the time for the design of AR coatings using the extended method increases as the number of layers increases. The optimum coating parameters and tolerance mapsfor two different six layered waveguide devices in Ref. [9] and [10] are obtained using the extendedmethod and the VFLM,and for the three different cases approximated as three layered waveguide devices to compare the results of each case. The results of the VFLM are similar to those of the extended methodcompared to those of the three layered structure waveguide. The main reason for the above results is that the field profile in the device calculated usingthe VFLM is similar to that calculated using the extended method compared to that for three layered structure wavegjide. We conclude that the extended method or VFLM should be used for the design of AR coatings on facets of a deice required for the facet reflectivity less than 10$^{-3}$ such as a semiconductor otical amplifier.

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Electrical Properties of the multilayered PZT(4060)/(6040) Thin Films (PZT(4060)/(6040) 다층 박막의 전기적 특성)

  • Nam, Sung-Pill;Lee, Sung-Gap;Bea, Seon-Gi;Lee, Young-Hie
    • Proceedings of the KIEE Conference
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    • 2007.07a
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    • pp.1301-1302
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    • 2007
  • The multilayered $Pb_{1.1}(Zr_{0.4}Ti_{0.6})O_{3}$/$Pb_{1.1}(Zr_{0.6}Ti_{0.4})O_{3}/Pb_{1.1}(Zr_{0.4}Ti_{0.6})O_{3}$[PZT(4060)/(6040)/(4060)] thin films were deposited by RF sputtering method on the Pt/TiO2/SiO2/Si substrate. We investigated the effects of deposition conditions on the structural and electrical properties of the multilayered PZT thin films. All the multilayered PZT thin films showed dense and homogeneous structure without the presence of the rosette structure. The dielectric properties such as dielectric constant, loss, remanent polarization of the multilayered PZT thin film were superior to those of single composition PZT(4060) and PZT(6040) films, and those values for the multilayered PZT(10/20/10) thin film were 903, 1.01% and $25.60{\mu}C/cm^2$. This study suggests that the design of the multilayered PZT thin films capacitor with tetragonal and rhombohedral phase should be an effective method to enhance the dielectric and ferroelectric performance in devices.

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Soil-structure interaction analysis of beams resting on multilayered geosynthetic-reinforced soil

  • Deb, Kousik
    • Interaction and multiscale mechanics
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    • v.5 no.4
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    • pp.369-383
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    • 2012
  • In this paper, soil-structure interaction analysis has been presented for beams resting on multilayered geosynthetic-reinforced granular fill-soft soil system. The soft soil and geosynthetic reinforcements are idealized as nonlinear springs and elastic membranes, respectively. The governing differential equations are solved by finite difference technique and the results are presented in non-dimensional form. It is observed from the study that use of geosynthetic reinforcement is not very effective for maximum settlement reduction in case of very rigid beam. Similarly the reinforcements are not effective for shear force reduction if the granular fill has very high shear modulus value. However, multilayered reinforced system is very effective for bending moment and differential settlement reduction.

Thermomechanical Analysis of Functionally Gradient $Al-SiC_p$ Composite for Electronic Packaging (전자패키지용 경사조성 $Al-SiC_p$복합재료의 열.기계적 변형특성 해석)

  • 송대현;최낙봉;김애정;조경목;박익민
    • Composites Research
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    • v.13 no.6
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    • pp.23-29
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    • 2000
  • The internal residual stresses within the multilayered structure with sharp interface induced by the difference in thermal expansion coefficient between the materials of adjacent layers often provide the source of failure such as delamination of interfaces etc. Recent development of the multilayered structure with functionally graded interface would be the solution to prevent this kind of failure. However a systematic thermo-mechanical analysis is needed for the customized structural design of multilayered structure. In this study, theoretical model for the thermo-mechanical analysis is developed for multilayered structures of the $Al-SiC_p$ functionally graded composite for electronic packaging. The evolution of curvature and internal stresses in response to temperature variations is presented for the different combinations of geometry. The resultant analytical solutions are used for the optimal design of the multilayered structures with functionally graded interface as well as with sharp interface.

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Peridynamic Impact Fracture Analysis of Multilayered Glass with Nonlocal Ghost Interlayer Model (비국부 층간 결합 모델을 고려한 다중적층 유리의 페리다이나믹 충돌 파괴 해석)

  • Ha, Youn Doh;An, Tae Sick
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.31 no.6
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    • pp.373-380
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    • 2018
  • We present the peridynamic dynamic fracture analysis to solve impact fracturing of multilayered glass impacted by a high-velocity object. In the most practical multilayered glass structures, main layers are glued by thin elastic masking films. Thus, it is difficult and expensive to construct the numerical model for such a multilayered structure. In this paper, we employ efficient numerical modeling of multilayered structures with a nonlocal ghost interlayer model in which ghost particles are distributed between main layers and they are interacting with each other in peridynamic way. We also consider a simple nonlocal contact condition in peridynamic frameworks to solve impact and penetration of the high-velocity impactor to the multilayered structure. Finally we can confirm the fracture capabilities of the method using a multilayered glass model in which 7 glass layers and a single elastic backing layer are affixed by polyvinyl butyral films.

A study on interrelation between the structure of a Plant and the str neural network emulator and the learning rate (플랜트구조와 신경망에뮬레이터의 구조 및 학습시간과의 관계)

  • Pae, Chang-Han;Lee, Kwang-Won
    • Proceedings of the KIEE Conference
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    • 1997.07b
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    • pp.386-389
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    • 1997
  • Error-backpropagation has been used in the bulk of Practical applications for neural networks. While an emulator, a multilayered neural network, learns to identify the system's dynamic characteristics. There is, however, no concrete theoretical results about the structure of a plant and the structure of a multilayered neural network and the learning rate. The paper investigates the relation between structure of a plant and a multilayered network and learning rate. Simulation study shows that the plant signal with a short period and a fast sam time is preferable for learning of the network emulator.

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Multilayered viscoelastic beam loaded in torsion under strain-path control: A delamination analysis

  • Victor I. Rizov
    • Advances in materials Research
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    • v.13 no.2
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    • pp.87-102
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    • 2024
  • This paper is focused on the delamination analysis of a multilayered beam structure loaded in torsion under strain-path control. The beam under consideration has a rectangular cross-section. The layers of the beam are made of different viscoelastic materials which exhibit continuous inhomogeneity in longitudinal direction. Since the delamination is located inside the beam structure, the torsion moments in the two crack arms are obtained by modeling the beam as an internally static undetermined structure. The strain energy stored in the beam is analyzed in order to derive the strain energy release rate (SERR). Since the delamination is located inside the beam, the delamination has two tips. Thus, solutions of the SERR are obtained for both tips. The solutions are verified by analyzing the beam compliance. Delamination analysis with bending-torsion coupling is also performed. The solutions derived are timedependent due to two factors. First, the beam has viscoelastic behavior and, second, the angle of twist of the beam-free end induced by the external torsion moment changes with time according to a law that is fixed in advance.

Possibility of Magnetocapacitor for Multilayered Thin Films

  • Hong, Jong-Soo;Yoon, Sung-Wook;Kim, Chul-Sung;Shim, In-Bo
    • Journal of Magnetics
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    • v.17 no.2
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    • pp.78-82
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    • 2012
  • CoNiFe(CNF)/$BaTiO_3(BTO)$/CoNiFe(CNF) multilayered thin films were deposited on Pt/Ti/$SiO_2$/Si substrates by using pulsed laser deposition (PLD) system. We fabricated three different thin films of BTO, BTO/CNF and CNF/BTO/CNF for magneto-capacitor and studied their crystalline structure, surface and interface morphology, and magnetic and electrical properties. When three different structures of multilayered thin film were compared, magnetization of CNF/BTO/CNF thin films was decreased by magnetic and dielectric interaction. Also we confirmed that capacitance of CNF/BTO/CNF multilayered thin film was enhanced as being near tetragonal structure with increasing of c/a ratio because of atomic bonding at interface between BTO dielectric and CNF magnetic materials. Finally, we studied the change of the capacitance of CNF/BTO/CNF multilayered thin film with magnetic field for emergence of magnetocapacitance and suggested a possibility of enhanced capacitance.