• 제목/요약/키워드: Multilayered Structure

검색결과 170건 처리시간 0.034초

전자패키지용 경사조성 Al-$SiC_{p}$ 복합재료의 열 . 기계적 변형특성 해석 (Thermomechanical Analysis of Functionally Gradient Al-$SiC_{p}$ Composite for Electronic Packaging)

  • 송대현;최낙봉;김애정;조경목;박익민
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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    • pp.175-183
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    • 2000
  • The internal residual stresses within the multilayered structure with shan interface induced by the difference in thermal expansion coefficient between the materials of adjacent layers often provide the source of failure such as delamination of interfaces and etc. Recent development of the multilayered structure with functionally graded interface would be the solution to prevent this kind of failure. However a systematic thermo-mechanical analysis is needed fur the customized structural design of multilayered structure. In this study, theoretical model for the thermo-mechanical analysis is developed for multilayered structures of the Al-$SiC_p$ functionally graded composite for electronic packaging. The evolution of curvature and internal stresses in response to temperature variations is presented for the different combinations of geometry. The resultant analytical solutions are used for the optimal design of the multilayered structures with functionally graded interface as well as with sharp interface.

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구리 보호층을 이용한 전해에칭에서의 다층구조 제작 (Fabrication of Multilayered Structures in Electrochemical Etching using a Copper Protective Layer)

  • 신홍식
    • 한국기계가공학회지
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    • 제18권2호
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    • pp.38-43
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    • 2019
  • Electrochemical etching is a popular process to apply metal patterning in various industries. In this study, the electrochemical etching using a patterned copper layer was proposed to fabricate multilayered structures. The process consists of electrodeposition, laser patterning, and electrochemical etching, and a repetition of this process enables the production of multilayered structures. In the fabrication of a multilayered structure, an etch factor that reflects the etched depth and pattern size should be considered. Hence, the etch factor in the electrochemical etching process using the copper layer was calculated. After the repetition process of electrochemical etching using copper layers, the surface characteristics of the workpiece were analyzed by EDS analysis and surface profilometer. As a result, multilayered structures with various shapes were successfully fabricated via electrochemical etching using copper layers.

다층 구조 도파관 소자 단면에의 무반사 코팅 설계 (Design of antireflection coationgs on the facets of a multilayered structure waveguide device)

  • 김용곤;김부균;주흥로
    • 한국통신학회논문지
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    • 제21권7호
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    • pp.1850-1860
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    • 1996
  • We present the results for the design ofantireflection (AR) coatings on facets of a multilayered structure waveguide device. The method, whose results agree very well with the reusults of the rigorous method in the case of a symmetric three layer structure deveice, is extended for the design of AR coatings on the facets of a multilayered structure waveguide device. the field profile in a multilayered structure waveguide necessary for the use of the extended method is obtained from the transfer matrix method. The virtual four layered structure method (VFLM) is proposed to reduce the time for the design ofAR coatings because the time for the design of AR coatings using the extended method increases as the number of layers increases. The optimum coating parameters and tolerance mapsfor two different six layered waveguide devices in Ref. [9] and [10] are obtained using the extendedmethod and the VFLM,and for the three different cases approximated as three layered waveguide devices to compare the results of each case. The results of the VFLM are similar to those of the extended methodcompared to those of the three layered structure waveguide. The main reason for the above results is that the field profile in the device calculated usingthe VFLM is similar to that calculated using the extended method compared to that for three layered structure wavegjide. We conclude that the extended method or VFLM should be used for the design of AR coatings on facets of a deice required for the facet reflectivity less than 10$^{-3}$ such as a semiconductor otical amplifier.

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PZT(4060)/(6040) 다층 박막의 전기적 특성 (Electrical Properties of the multilayered PZT(4060)/(6040) Thin Films)

  • 남성필;이성갑;배선기;이영희
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2007년도 제38회 하계학술대회
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    • pp.1301-1302
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    • 2007
  • The multilayered $Pb_{1.1}(Zr_{0.4}Ti_{0.6})O_{3}$/$Pb_{1.1}(Zr_{0.6}Ti_{0.4})O_{3}/Pb_{1.1}(Zr_{0.4}Ti_{0.6})O_{3}$[PZT(4060)/(6040)/(4060)] thin films were deposited by RF sputtering method on the Pt/TiO2/SiO2/Si substrate. We investigated the effects of deposition conditions on the structural and electrical properties of the multilayered PZT thin films. All the multilayered PZT thin films showed dense and homogeneous structure without the presence of the rosette structure. The dielectric properties such as dielectric constant, loss, remanent polarization of the multilayered PZT thin film were superior to those of single composition PZT(4060) and PZT(6040) films, and those values for the multilayered PZT(10/20/10) thin film were 903, 1.01% and $25.60{\mu}C/cm^2$. This study suggests that the design of the multilayered PZT thin films capacitor with tetragonal and rhombohedral phase should be an effective method to enhance the dielectric and ferroelectric performance in devices.

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Soil-structure interaction analysis of beams resting on multilayered geosynthetic-reinforced soil

  • Deb, Kousik
    • Interaction and multiscale mechanics
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    • 제5권4호
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    • pp.369-383
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    • 2012
  • In this paper, soil-structure interaction analysis has been presented for beams resting on multilayered geosynthetic-reinforced granular fill-soft soil system. The soft soil and geosynthetic reinforcements are idealized as nonlinear springs and elastic membranes, respectively. The governing differential equations are solved by finite difference technique and the results are presented in non-dimensional form. It is observed from the study that use of geosynthetic reinforcement is not very effective for maximum settlement reduction in case of very rigid beam. Similarly the reinforcements are not effective for shear force reduction if the granular fill has very high shear modulus value. However, multilayered reinforced system is very effective for bending moment and differential settlement reduction.

전자패키지용 경사조성 $Al-SiC_p$복합재료의 열.기계적 변형특성 해석 (Thermomechanical Analysis of Functionally Gradient $Al-SiC_p$ Composite for Electronic Packaging)

  • 송대현;최낙봉;김애정;조경목;박익민
    • Composites Research
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    • 제13권6호
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    • pp.23-29
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    • 2000
  • 층상구조재료가 갖는 약점으로는 구성재료층 간의 열.기계적 특성 차이로 인하여 내부응력이 발생되고 비틀림 변형이 유발되어 형상 제어가 매우 어려울 뿐만 아니라, 반복적인 열 하중으로 인해 열이력을 받을 경우 접합부에서의 파손이 생길 수 있다는 것이다. 최근 층상구조에서 조직 혹은 조성이 점차적으로 변하는 계면을 삽입한 경사조성재료는 열.기계적 변형특성 차이에 의한 재료의 손상을 최소화시킬 수 있으나, 용도에 적합한 구조설계를 위해서 열.기계적 해석이 필요하다. 본 연구에서는 전자패키징용 $Al-SiC_p$ 경사조성 복합재료의 기하학적 구조와 온도변화에 따른 곡면화 변형 및 내부응력분포를 해석하고자 하였다. 한편 층상구조 $Al-SiC_p$ 경사조성 복합재료의 열변형량을 측정하고 내부응력분포를 실험적으로 구하여, 이론적으로 계산한 결과와 비교하였다. 본 연구의 해석결과는 경사조성 층상구조재료의 최적구조 설계에 유용하게 적용할 수 있다.

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비국부 층간 결합 모델을 고려한 다중적층 유리의 페리다이나믹 충돌 파괴 해석 (Peridynamic Impact Fracture Analysis of Multilayered Glass with Nonlocal Ghost Interlayer Model)

  • 하윤도;안태식
    • 한국전산구조공학회논문집
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    • 제31권6호
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    • pp.373-380
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    • 2018
  • 본 논문에서는 다중적층 유리의 고속 충돌체에 의한 충돌/침투 파괴 현상을 해석하기 위해 페리다이나믹 동적 해석 기법을 적용한다. 대부분의 다중적층 유리 구조물들은 다수의 주요 유리층들이 상대적으로 매우 얇은 탄성 필름으로 접착되어서 만들어진다. 따라서 다중적층 구조물의 수치해석 모델을 구성하는 것은 까다롭고 비용이 많이 든다. 본 연구에서는 실제 절점을 대신하여 가상의 절점들을 주요층들 사이에 위치시키고 상호작용시키는 비국부 가상 층간구조 모델링을 도입하여 보다 효율적으로 다중적층 구조를 모델링하였다. 또한 고속 충돌체와의 충돌 및 침투 현상을 해석하기 위해 페리다이나믹 비국부 접촉 모델이 고려되었다. 7개의 유리층과 하나의 탄성 백킹층이 폴리비닐부티랄 필름으로 부착된 다중적층 유리의 충돌 파괴 해석을 통해 제안된 해석 모델의 손상 파괴 적용 가능성을 확인하였다.

플랜트구조와 신경망에뮬레이터의 구조 및 학습시간과의 관계 (A study on interrelation between the structure of a Plant and the str neural network emulator and the learning rate)

  • 배창한;이광원
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1997년도 하계학술대회 논문집 B
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    • pp.386-389
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    • 1997
  • Error-backpropagation has been used in the bulk of Practical applications for neural networks. While an emulator, a multilayered neural network, learns to identify the system's dynamic characteristics. There is, however, no concrete theoretical results about the structure of a plant and the structure of a multilayered neural network and the learning rate. The paper investigates the relation between structure of a plant and a multilayered network and learning rate. Simulation study shows that the plant signal with a short period and a fast sam time is preferable for learning of the network emulator.

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Multilayered viscoelastic beam loaded in torsion under strain-path control: A delamination analysis

  • Victor I. Rizov
    • Advances in materials Research
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    • 제13권2호
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    • pp.87-102
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    • 2024
  • This paper is focused on the delamination analysis of a multilayered beam structure loaded in torsion under strain-path control. The beam under consideration has a rectangular cross-section. The layers of the beam are made of different viscoelastic materials which exhibit continuous inhomogeneity in longitudinal direction. Since the delamination is located inside the beam structure, the torsion moments in the two crack arms are obtained by modeling the beam as an internally static undetermined structure. The strain energy stored in the beam is analyzed in order to derive the strain energy release rate (SERR). Since the delamination is located inside the beam, the delamination has two tips. Thus, solutions of the SERR are obtained for both tips. The solutions are verified by analyzing the beam compliance. Delamination analysis with bending-torsion coupling is also performed. The solutions derived are timedependent due to two factors. First, the beam has viscoelastic behavior and, second, the angle of twist of the beam-free end induced by the external torsion moment changes with time according to a law that is fixed in advance.

Possibility of Magnetocapacitor for Multilayered Thin Films

  • Hong, Jong-Soo;Yoon, Sung-Wook;Kim, Chul-Sung;Shim, In-Bo
    • Journal of Magnetics
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    • 제17권2호
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    • pp.78-82
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    • 2012
  • CoNiFe(CNF)/$BaTiO_3(BTO)$/CoNiFe(CNF) multilayered thin films were deposited on Pt/Ti/$SiO_2$/Si substrates by using pulsed laser deposition (PLD) system. We fabricated three different thin films of BTO, BTO/CNF and CNF/BTO/CNF for magneto-capacitor and studied their crystalline structure, surface and interface morphology, and magnetic and electrical properties. When three different structures of multilayered thin film were compared, magnetization of CNF/BTO/CNF thin films was decreased by magnetic and dielectric interaction. Also we confirmed that capacitance of CNF/BTO/CNF multilayered thin film was enhanced as being near tetragonal structure with increasing of c/a ratio because of atomic bonding at interface between BTO dielectric and CNF magnetic materials. Finally, we studied the change of the capacitance of CNF/BTO/CNF multilayered thin film with magnetic field for emergence of magnetocapacitance and suggested a possibility of enhanced capacitance.