• 제목/요약/키워드: Multilayer process

검색결과 301건 처리시간 0.026초

Modeling and Simulation of Line Edge Roughness for EUV Resists

  • Kim, Sang-Kon
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권1호
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    • pp.61-69
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    • 2014
  • With the extreme ultraviolet (EUV) lithography, the performance limit of chemically amplified resists has recently been extended to 16- and 11-nm nodes. However, the line edge roughness (LER) and the line width roughness (LWR) are not reduced automatically with this performance extension. In this paper, to investigate the impacts of the EUVL mask and the EUVL exposure process on LER, EUVL is modeled using multilayer-thin-film theory for the mask structure and the Monte Carlo (MC) method for the exposure process. Simulation results demonstrate how LERs of the mask transfer to the resist and the exposure process develops the resist LERs.

The Evaluation and Optimization of Welding Qualities in the RSW(Resistance Spot Welding) Process Using the Servo Controlled Gun

  • Park, Yeong-Je;Cho, Hyung-Suck;Park, Ji-Hwan
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2001년도 ICCAS
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    • pp.46.6-46
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    • 2001
  • A servo gun welding system having a AC servo motor and a PC control system is presented for the improvement of quality control in the spot welding. The spot welding process is composed of the press stage, the weld stage, and the hold stage. The changes of gun press forces according to three stages in the spot welding process are controlled and measured through the load cell in order to know the influence on the welding quality. The relation between the measured force changes according to three stages and welding qualities is also implemented on the multilayer perceptrons, one of supervised learning method of neural network, which are powerful for realization of complex mapping characteristics. The estimated results and ...

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A study on nanoparticle filtration characteristics of multilayer meltblown depth filters

  • Lee, Kang-San;Hasolli, Naim;Jeon, Seong-Min;Lee, Jae-Rang;Kim, Kwang-Deuk;Park, Young-Ok;Hwang, Jungho
    • 한국입자에어로졸학회지
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    • 제12권3호
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    • pp.51-56
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    • 2016
  • Due to recent development in nanotechnology and increasing usage and production of nanomaterials, numerous studies related to environment, sanitation and safety handling of nanoparticle are being conducted. Since nanoparticles can be easily absorbed into human bodies through breathing process, based on their toxic substances and their large specific surface, these particles can cause serious health damage. Therefore, to reduce nanoparticle emissions, nanofiltration technology is becoming a serious issue. Filtration is a separation process during which a fluid passes through a barrier by removing the particles from the stream. Barrier filters can be made of various materials and shapes. One of the most common type of barrier filter is the fibrous filter. Fibrous filters are divided in two types: nonwoven and woven fabrics. Polypropylene is a thermoplastic material, used as a base material for melt blown nonwoven fabric. In this study, we examined filtration property of KCl nanoparticles with a mean particle diameter of 75 nm using multilayer meltblown filter samples. These experiments verify that the penetration of nanoparticle in the filter correlate with pressure drop; the meltblown layer MB1 has the greatest effect on dust collection efficiency of the filter. Among all tested samples, dust collection efficiency of 2-layer filter was best. However, when considering the overall pressure drop and dust collection efficiency, the 4-layer filter has the highest quality factor for particles smaller than 70 nm.

Al 식각정지층을 이용한 Nb-based SNS 조셉슨 접합의 제조공정 (Employing Al Etch Stop Layer for Nb-based SNS Josephson Junction Fabrication Process)

  • 최정숙;박정환;송운;정연욱
    • Progress in Superconductivity
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    • 제12권2호
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    • pp.114-117
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    • 2011
  • We report our efforts on the development of Nb-based non-hysteretic Josephson junction fabrication process for quantu device applications. By adopting and modifying the existing Nb-aluminum oxide tunnel junction process, we develop a process for non-hysteretic Josephson junction circuits using metal-silicide as metallic barrier material. We use sputter deposition of Nb and $MoSi_2$, PECVD deposition of silicon oxide as insulator material, and ICP-RIE for metal and oxide etch. The advantage of the metal-silicide barrier in the Nb junction process is that it can be etched in $SF_6$ RIE together with Nb electrode. In order to define a junction area precisely and uniformly, end-point detection for the RIE process is critical. In this paper, we employed thin Al layer for the etch stop, and optimized the etch condition. We have successfully demonstrated that the etch stop properties of the inserted Al layer give a uniform etch profile and a precise thickness control of the base electrode in Nb trilayer junctions.

Flexible Thin Film Encapsulation and Planarization Effectby Low Temperature Flowable Oxide Process

  • Yong, Sang Heon;Kim, Hoonbea;Chung, Ho Kyoon;Chae, Heeyeop
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.431-431
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    • 2013
  • Flexible Organic Light Emitting Diode (OLED) displays are required for future devices. It is possible that plastic substrates are instead of glass substrates. But the plastic substrates are permeable to moisture and oxygen. This weak point can cause the degradation of fabricated flexible devices; therefore, encapsulation process for flexible substrate is needed to protect organic devices from moisture and oxygen. Y.G. Lee et al.(2009) [1] reported organic and inorganic multilayer structure as an encapsulation barrier for enhanced reliability and life-time.Flowable Oxide process is a low-temperature process which shows the excellent gap-fill characteristics and high deposition rate. Besides, planarization is expected by covering dust smoothly on the substrate surface. So, in this research, Bi-layer structured is used for encapsulation: Flowable Oxide Thin film by PECVD process and Al2O3 thin film by ALD process. The samples were analyzed by water vapor transmission rate (WVTR) using the Calcium test and film cross section images were obtained by FE-SEM.

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다양한 기판 위에서 고분자 전해질 다층 막과 폴리에틸렌글리콜 미세 구조물을 이용한 세포 패터닝 방법 (Cell Patterning on Various Substrates Using Polyelectrolyte Multilayer and Microstructure of Poly(Ethylene Glycol))

  • 심현우;이지혜;최호석;이창수
    • Korean Chemical Engineering Research
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    • 제46권6호
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    • pp.1100-1106
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    • 2008
  • 본 연구는 표면에 세포를 부착하는데 있어서, 다양한 기판 표면에 보편적인 플랫폼으로써 적용될 수 있는 세포 부착을 위한 기능성 표면의 제작 기술 및 이를 이용한 세포의 선택적인 고정과 편리한 세포 패터닝의 방법을 보여주었다. 세포 부착에 적합한 기능성 표면의 제작은 산소 플라즈마 처리를 이용한 다양한 기판의(유리, PMMA, PS, PDMS) 표면 활성화 및 상반되는 고분자 전해질의(PAH, PDAC, PSS, PAA) 정전기적 인력을 통한 증착으로 이루어진 다층의 고분자 전해질 층을 통해 제작될 수 있었다. 또한, 고분자 전해질로 증착된 표면 위로 마이크로 몰딩 인 케필러리 방법을 사용하여 PEG 마이크로 구조물을 제작함으로써 세포의 선택적인 고정이 이루어질 수 있었다. 다층의 고분자 전해질로 증착된 표면은 세포와의 강한 정전기적 인력으로 세포 부착에 유리한 표면을 제공하였다. 반면에, 제작된 PEG 마이크로 구조물은 물리적, 생물학적인 장애물의 역할로써 세포의 비 특이적인 흡착을 방지하였다. 세포 부착을 위한 기능성 표면을 제작하는 동안 표면의 특성은 접촉각 측정을 통해 이루어 졌다. 다양한 기판 상에서 개질된 표면은 세포 부착을 위한 적합한 환경의 제공과 함께 세포의 마이크로 패터닝 기술에서 높은 수율의 세포 패터닝을 제공한다. 상기의 제안된 세포 부착을 위한 기능성 표면 제작 기술 방법은 제작 과정이 매우 간단하고, 편리하여 손쉽게 구현이 가능하며, 제작 공정에서 어떠한 해로운 용매도 사용하지 않기 때문에 친환경적이다. 또한, 이를 이용하여 세포를 이용하는 바이오 칩 및 바이오 센서, 세포를 기반으로 하는 시스템 등에서 기본이 되는 기술로 사용될 수 있는 넓은 응용 범위를 갖는다.

혼합 산화제가 W-CMP 특성에 미치는 영향 (Effects of Mixed Oxidizer on the W-CMP Characteristics)

  • 박창준;서용진;김상용;이우선
    • 한국전기전자재료학회논문지
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    • 제16권12S호
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    • pp.1181-1186
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    • 2003
  • Chemical Mechanical Polishing (CMP) is an essential dielectric planarization in multilayer microelectronic device fabrication. In the CMP process, it is necessary to minimize the extent of surface defect formation while maintaining good planarity and optimal material removal rates. The polishing mechanism of W-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. Thus, it is important to understand the effect of oxidizer on W passivation layer, in order to obtain higher removal rate (RR) and very low non-uniformity (NU %) during W-CMP process. In this paper, we compared the effects of oxidizer or W-CMP process with three different kind of oxidizers with 5 wt% hydrogen peroxide such as Fe(NO$_3$)$_3$, H$_2$O$_2$, and KIO$_3$. The difference in removal rate and roughness of W in stable and unstable slurries are believed to caused by modification in the mechanical behavior of Al$_2$O$_3$ particles in presence of surfactant stabilizing the slurry.

세라믹 적층공정을 이용한 강압용 압전변압기의 제작 및 특성 (Fabrication and Properties of Piezoelectric Transformer for Step-Down Voltage using Ceramic Stack Process)

  • 이창배;윤중락
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.164-164
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    • 2009
  • A multilayer piezoelectric transformer(MPT) for step-down voltage was made by ceramic stack process. And then, the characteristics of piezoelectric transformer, such as resonance frequency, matching impedance, electro-mechanical coupling coefficient, voltage gain, heat generation and efficiency, are analyzed. The piezoelectric transformer consists of a lead zirconate titanate ceramic with a high electromechanical quality factor. The piezoelectric transformer, with a multilayered construction in the thickness direction, was formed with dimensions 15mm long, 15mm wide and 5mm thick.

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신경회로망을 이용한 소결기 팰릿 속도 제어 (Pallet speed control in a sintering plant using neural networks)

  • 장민;조성준
    • 한국데이타베이스학회:학술대회논문집
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    • 한국데이타베이스학회 1999년도 춘계공동학술대회: 지식경영과 지식공학
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    • pp.261-270
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    • 1999
  • Sintering transforms powdered ore into lumped ore so that the latter can be used in a blast furnace. The powdered ore combined with coke and other materials is loaded into a container and moved along by a pallet while the ignited coke bums. The speed by which the pallet moves determines how much sintering takes place. Since the process is complicated and lacks an accurate mathematical model, human operators manually control the speed by monitoring various factors in the plant. In this paper, we propose a neural network-based pallet speed controller which copies human operator knowledge. Actual process data were collected from a sintering plant fer eight months and preprocessed to remove noisy and inconsistent data. A multilayer perceptron was trained using a back-propagation learning algorithm. In on-line testing at the sinter plant, the proposed model reliably controlled pallet speed during normal operation without the help of human operators. Moreover, the duality and productivity was as good as with human operators.

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금속 절삭공구에 대한 PVD 코팅기술의 동향 (Tendency of PVD coating technology on Metal cutting tools)

  • 김종성
    • 한국정밀공학회지
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    • 제18권8호
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    • pp.11-17
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    • 2001
  • Industrial use of physical vapor deposition(PVD) has been widely expanded during last two decades, and in the mean time plasma assistance in PVD has become an essential tool in preparing compound films with dense microstructure. The principles of electron beam-based plating, balanced and unbalanced magnetron sputtering and cathodic arc deposition. consisting three basic configuration of plasma assisted PVD(PAPVD)process, were reviewed. Recent technical development in PVD coating process were discussed. This paper tries to show tendency for developing new coating film on cutting tools.

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