• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.12
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• pp.55-67
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• 2010

The electrical properties of a back drilled via-hole (BDH) without the open-stub and the plated through via-hole (PTH) with the open-stub, which is called the conventional structure, in a high-count multi~layered (HCML) printed circuit board (PCB) were investigated for a high-speed digital system, and a selected inner layer to transmit a high-speed signal was farthest away from the side to mount the component. Within 10 GHz of the broadband frequency, a design of experiment (DOE) methodology was carried out with three cause factors of each via-hole structure, which were the distance between the via-holes, the dimensions of drilling pad and the anti-pad in the ground plane, and then the relation between cause and result factors which were the maximum return loss, the half-power frequency, and the minimum insertion loss was analyzed. Subsequently, the empirical formulae resulting in a macro model were extracted and compared with the experiment results. Even, out of the cause range, the calculated results obtained from the macro model can be also matched with the measured results within 5 % of the error.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.715-718
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• 2004

In this paper, we studied the characteristics of new polishing pad, which can apply W-CMP process for global planarization of multi-level interconnection structure. The hardness and density were measured as a function of groove pattern. Also, we compared the pore size through the SEM photograph. Finally, we investigated the CMP characteristics with five different kind of groove pattern sample. Through the above results, we can select optimum groove pattern, so we can expect to begin home product of polishing pad.

• International Journal of Precision Engineering and Manufacturing
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• v.4 no.2
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• pp.64-70
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• 2003

A new method using a transfer function is introduced in the present paper for analyzing the motion errors of hydrostatic bearing tables. The relationship between film reaction force in a single-side hydrostatic pad and the form error of guide rail is derived at various spatial frequencies by finite element analysis, and it is expressed as a transfer function. This transfer function clarifies so called 'the averaging effect of an oil film' quantitively. It is found that the amplitude of film force is reduced as the spatial frequency increases or the relative width of the pocket is reduced. The motion errors of a multi pad type table are estimated using a transfer function, the form errors of a guide rail and the geometric relationship between the pads. The method is named as the Transfer Function Method (TFM). The motion errors calculated by the TFM show good agreement with the motion errors calculated by the Multi Pad Method considering the entire table as an analysis object. From the results, it is confirmed that the proposed TFM is very effective to analyze the motion errors of hydrostatic tables.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.450-455
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• 2002

Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.9-14
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• 2001

A new model utilizing a transfer function is introduced in the present paper for analizing motion errors of hydrostatic tables. Relationship between film reaction force in a single hydrostatic pad and form error of a guide rail is derived at various spacial frequencies by finite element analysis, and it is expressed as a transfer function. This transfer function clarifies so called averaging effect of the oil film quantitively. For example, it is found that the amplitide of the film reaction force is reduced as the spacial frequency increases or relative width of the pocket is reduced. Motion errors of a multiple pad table is estimated from transfer function, geometric relationship between each pads and form errors of a guide rail, which is named as Transfer Function Method. Calculated motion errors by TFM show good agreement with motion errors calculated by Multi Pad Method, which is considered entire table as an analysis object. From the results, it is confirmed that the proposed TFM is very effective to analyze the motion errors of hydrostatic tables.

• Journal of Digital Convergence
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• v.15 no.10
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• pp.445-454
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• 2017

Recently, playing musical instruments in the application or website which is a sort of playing has been catching on for ordinary people even though they don't know how to play musical instruments. It appears that such playing has randomness which is quite natural. Thus, 'Random operation method' which induces the observing audience and changes them to manage actively is developed and suggested for the image system in this paper by utilizing Launch Pad, based on theoretical background and case analysis. Step Sequencer was developed in two ways: the image system is realized with Step Sequencer by connecting external program or made as clips to arrange them for each key on Launch Pad and implement, which is keyboard launch type.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.12
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• pp.1397-1404
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• 2014

Grab cranes are used for multi-purpose when the sand and soil are deposited into harbor wharf or the undersea construction is performed. Among the components of crane grab, the wire drum and disc brake pad are key expendables and have disadvantages that lot of heat is generated and very expensive when replacing them. In this study, the thermal image analysis for the disc brake, which works with wire drum of the crane is suggested. The suggested system performs the pad thermal diagnosis through the thermal image using the characteristics that the disc and pad surface temperatures are distributed abnormally before the brake failure and the disc pad damage. Therefore, the damage by the failure can be prevented by discovering the abnormality of the machine parts before failure and the life cycle of the pad and the cost can be extended and saved by operating the crane performing constant checkup for the overload.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.215-216
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• 2010

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.18 no.3
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• pp.93-100
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• 2018

The electronic acupuncture has the advantage of treating the patient with acupuncture by simultaneously analyzing the patient's physical condition and treatment condition. In this paper, it is proposed and developed an electronic acupuncture algorithm embedded in a multi pad. Especially, it is implemented the control algorithm using the optimal electronic dipstick calculation, sensing pad and DSP system for the patient's body condition. Moreover, in this paper, it is developed SW and HW prototypes that can receive personal information by patient and can receive multi-array type electronc needle guiding procedure based on WEB.

• Journal of Drive and Control
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• v.15 no.3
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• pp.43-48
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• 2018

The hydraulic control valve, used in the CPB (cold-pad-Batch) cold dyeing system, passes through a pressurized material that absorbs the dye. The hydraulic control of the hydraulic control panel shall be driven in a uniform and precisely controlled manner, as it interferes directly with the dyschromatism. In this study, an acceleration test model was employed to verify the durability of the hydraulic control of the hydraulic control panel, which was manufactured by the scenic model, and the pre-roll angle was analyzed before the performance of acceleration test. Based on the change in the amount of deformation of the padder roll the durability of the padder roll was analyzed along with verification of the durability of the skin and the rubber coating in contact with the fabric. Furthermore, the accelerated test method used for hydraulic controlled multi-cell padder rolls was verified.