• ETRI Journal
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• 제38권4호
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• pp.645-653
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• 2016

This paper demonstrates the performance of a metal-substrate power module with multiple fabricated chips for a high current electrical application, and evaluates the proposed module using a 1.5-kW sinusoidal brushless direct current (BLDC) motor. Specifically, the power module has a hybrid structure employing a single-layer heat-sink extensible metal board (Al board). A fabricated motor driver IC and trench gate DMOSFET (TDMOSFET) are implemented on the Al board, and the proper heat-sink size was designed under the operating conditions. The fabricated motor driver IC mainly operates as a speed controller under various load conditions, and as a multi-phase gate driver using an N-ch silicon MOSFET high-side drive scheme. A fabricated power TDMOSFET is also included in the fabricated power module for three-phase inverter operation. Using this proposed module, a BLDC motor is operated and evaluated under various pulse load tests, and our module is compared with a commercial MOSFET module in terms of the system efficiency and input current.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2001년도 춘계학술대회논문집
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• pp.1185-1191
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• 2001

This paper discusses an experimental method for measuring the insertion loss (IL) performance of multi-layered insulations that are used in vehicles. Instead of two adjacent reverberation chambers which are generally used to measure the transmission loss (TL) of the large sound isolation materials, air-borne sound insulation tester was utilized to determine the IL and articulation index (AI) of standardized insulation materials. In comparison to reverberation chamber method, air-borne sound insulation tester method is more space-saving, more time-saving and more simple to the automotive acoustics. From the empirical results, it is found that the performances of insulation materials are closely connected with density of polyurethane foam, thickness of heavy layer, thickness of polyurethane foam, and application ratio to panel area.

• 한국기계기술학회지
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• 제20권6호
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• pp.763-769
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• 2018

In this research, in order to improve the heat retention of greenhouse, comparative analysis of the heat flux of the marketed multi-later insulating curtain was carried out. Experiments is conducted by fabricating a test apparatus for investigating the heat flux characteristics. The multi-later insulating curtain used for the experiment was compared using the P, N, S, U and T company, which are commercially available, and the heat flux due to temperature difference between the experimental apparatus and the outside was compared and analyzed. When the internal temperature of the experimental result is the maximum temperature $60^{\circ}C$, the heat flux of multi-later insulating curtain is T Co.($73.1W/m^2$) > S Co.($119.5W/m^2$) > U Co.($155W/m^2$) > N Co.($163.1W/m^2$) > P Co.($177.7W/m^2$). The heat flux means the quantity of heat passing through the unit time per unit area, and the higher the numerical value, the higher the quantity of heat passing through the multi-layer insulating curtain. This can be determined that high heat fluxes produce low heat resistance. Further, it has been found that the weight of the insulating curtain is largely unrelated to the heat insulating property, and the heat insulating curtain having a thickness containing a high internal air layer is excellent in the heat insulating property. In the future when manufacturing a heat insulating curtain, It is judged that it is desirable to manufacture a combination of heat insulating materials that contain a high internal air layer content and that can maintain the air layer even for long-term use while minimizing the volume.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.38-38
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• 2008

무선 통신에 사용되는 기판에서 passive device는 대부분 기판 위에 개별적으로 표면 실장 되고 있으며 전체 기판면적에 80% 정도를 차지하고 있다. 따라서 기판의 소형화, 경량화를 위하여 많은 면적을 차지하는 수동소자들을 다층인쇄회로기판(multi-layer circuit board)에 내장하는 내장형 수동소자(embedded passive device) 기술이 연구되고 있다. 본 연구원에서 개발한 복합재료는 무기물 충전제 $SrTiO_3$를 사용하였으며, 열가소성 수지로는 cyclo-olefin-polymer계열의 수지를 바탕으로 제작 하였고, 유전율7~7.5이고 유전손실은 0.0045이다. 또한 $SrTiO_3$/유기물 복합재료는 공정온도가 낮고 경제적인 유기물에 높은 유전상수를 갖는 무기물이 분산되어 있는 형태이며, 우수한 유전 특성, 화학적 안정성, 저온 제조공정, 제조단가의 감소, 패키징 크기의 감소 등의 장점을 갖는다. 개발된 재료를 기반으로 Multi-layer 구조를 이용한 다양한 용량대의 capacitor를 구현 하였으며, spiral inductor 와 내장형 spiral inductor를 구현하여 다양한 용량대의 inductor를 구현 하였다. 그리고 각각의 구조에 따른 inductance와 Q factor를 분석 하였으며, Q factor가 100이상인 high Q inductor도 구현하였다. 이렇게 구현된 내장형 수동소자는 기판의 크기의 감소와 제조 단가의 절감, 최소 크기의 기판을 구현하는데 응용이 가능 할 것으로 예상 된다.

• 전기전자학회논문지
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• 제23권4호
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• pp.1128-1133
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• 2019

이 논문에서는 전이 금속 산화물(TMO)층으로 구성된 다층 박막을 사용하는 BIPV(Building Integrated Photovoltaic) 시스템용 전면 컬러 유리를 제안하였다. 몰리브덴 산화물(MoO₃) 및 텅스텐 산화물(WO₃)은 굴절률 차이가 큰 계면을 형성하여 적절한 간섭효과를 얻을 수 있다. 단일 Thermal Evaporator 증착 방법을 통해 다층 박막을 제작함으로써 간단하고 빠르며 저렴한 제조 방법을 제안하였다. MoO₃(60nm)/WO₃(100nm) 다층 박막으로 90% 이상의 광 투과율을 갖는 자홍색 유리를 시연하였으며, 이 기술은 상용화된 BIPV 시스템에 유용할 것으로 기대된다.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.25-28
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• 2000

분자선에피택시법에 의하여 GaAs(100)기판 위에 InAs 자발형성양자점을 성장하였다. InAs 양자점은 1, 3, 6, 10, 15 및 20층 등으로 다양하게 적층되어졌고, GaAs 층과 InAs 양자점 층은 각각 20 MLs와 2 MLs의 두께를 갖도록 하였다. 이 양자점의 나노구조적 특성은 PL과 STEM을 사용하여 분석하였다. 가장 높은 PL 강도는 6층의 적층구조를 갖는 시편에서 나타났고 PL 피크의 에너지가 적층회수가 증가함에 따라 분리됨을 알 수 있었다. STEM분석결과, 6충의 적층구조에서는 결함이 거의 없이 수직으로 형성된 구조를 보여준 반면에 10층 이상의 적층구조를 가질 때 그 성장 방향에 따라 volcano형상을 갖는 결함이 수직하게 성장되어졌다.

• Bulletin of the Korean Chemical Society
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• 제33권5호
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• pp.1523-1526
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• 2012

In this work, we prepared activated multi-walled carbon nanotubes/polyacrylonitrile (A-MWCNTs/C) composites by film casting and activation method. Electrochemical properties of the composites were investigated in terms of serving as MWCNTs-based electrode materials for electric double layer capacitors (EDLCs). As a result, the A-MWCNTs/C composites had much higher BET specific surface area, and pore volume, and lower volume ratio of micropores than those of pristine MWCNTs/PAN ones. Furthermore, some functional groups were added on the surface of the A-MWCNTs/C composites. The specific capacitance of the A-MWCNTs/C composites was more than 4.5 times that of the pristine ones at 0.1 V discharging voltage owing to the changes of the structure and surface characteristics of the MWCNTs by activation process.

• 한국생산제조학회지
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• 제9권1호
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• pp.96-101
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• 2000

Ceramic, PCD and CBN tools are available for the difficult-to-cut-materials such as hardened carbon tool steel, stainless steel, Inconel 718 and etc.. Ceramic toolsare likely to be chipped and abruptly broken before the appearance of normal wear in turning. Ther2efore ceramic tools are suitable for continuous cut in turning not for intermittent in milling. In this study, TiN/TiCN multi-layer coated ceramic tools were found to restrain the chipping, breaking and early fracture and to increase the critical cutting speed owing to TiN/TiCN multi-layer coating in Arc Ion Plating of PVD method.

• Journal of Information Display
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• 제7권2호
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• pp.12-15
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• 2006

We propose a patterning method of liquid crystal (LC) alignment layer for producing multi-domain LC structures. By controlling thermal conditions during micro-contact printing procedures and facilitating wetting properties of patterning materials, patterned LC orientation can be easily obtained on a bare ITO surface or other polymer films. The newly proposed patterning method is expected to be a very useful tool for fabricating multi-domain LC structures to enhance or design electro-optic properties of LC-based devices.

• 한국표면공학회지
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• 제48권4호
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• pp.169-173
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• 2015

$CuInSe_2$ thin films which have been widely used for thin solar cells as a light absorber were prepared by hydrazine solution processing, and their microstructural properties were investigated. Hydrazine $CuInSe_2$ precursor solutions were prepared by dissolving $Cu_2S$, S, $In_2Se_3$ and Se powder in hydrazine solvent. Multilayer $CuInSe_2$ chalcopyrite phase thin films were prepared by repeating spin-coating process using the precursor solution. Unfortunately, the presence of the interfaces between each $CuInSe_2$ layer formed by multi-layer coating impeded grain growth across the interface. Here, by doing simple interface engineering to solve the limited grain growth issue, the large grained (${\sim}1{\mu}m$) $CuInSe_2$ thin films were obtained.