• Journal of the Korean Ceramic Society
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• v.46 no.2
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• pp.161-169
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• 2009

MLCC (Multi-layer Ceramic Capacitor) is the most important passive component in electronic devices such as HHP, PC and digital display. The development trend of MLCC is a miniaturization with increasing the capacitance. In this paper, a development history of the high capacitance MLCC in Korea was introduced, and the necessity of the finer $BaTiO_3$ was explained in the viewpoint of the issued electrical and dielectric properties of high capacitance MLCC. The bottleneck technologies to realize the high capacitance was shortly introduced, followed by the prediction of the development trend of MLCC in near future.

• Resources Recycling
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• v.14 no.5 s.67
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• pp.32-39
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• 2005

Leaching behavior of nickel contained in waste Multi-Layer Ceramic Capacitor (MLCC) was investigated using a batch reactor. The effects of acid type, acid concentration, leaching temperature, particle size, and reaction time on the extraction of nickel metal from waste MLCC were examined. As a result, 97% of nickel contained in waste MLCC was leached out in 30 min at the temperature of $90^{\circ}C$ under the condition of $HNO_3$ concentration 1N, solid/liquid ratio 5 g/L and particle size $-300/+180{\mu}m$. It was also found that a Jander equation was useful to fit well the leaching rate data. The rate of nickel leaching is controlled by pore diffusion in $BaTiO_3$ layer and has an activation energy of 37.6 kJ/mol (9.0 kcal/mol).

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.319-319
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• 2013

Even though the fabrication methods of metal oxide based thin film capacitor have been well established such as RF sputtering, Sol-gel, metal organic chemical vapor deposition (MOCVD), ion beam assisted deposition (IBAD) and pulsed laser deposition (PLD), an applicable capacitor of printed circuit board (PCB) has not realized yet by these methods. Barium Strontium Titanate (BST) and other high-k ceramic oxides are important materials used in integrated passive devices, multi-chip modules (MCM), high-density interconnect, and chip-scale packaging. Thin film multi-layer technology is strongly demanded for having high capacitance (120 nF/$mm^2$). In this study, we suggest novel multi-layer thin film capacitor design and fabrication technology utilized by plasma assisted deposition and photolithography processes. Ba0.6Sr0.4TiO3 (BST) was used for the dielectric material since it has high dielectric constant and low dielectric loss. 5-layered BST and Pt thin films with multi-layer sandwich structures were formed on Pt/Ti/$SiO_2$/Si substrate by RF-magnetron sputtering and DC-sputtering. Pt electrodes and BST layers were patterned to reveal internal electrodes by photolithography. SiO2 passivation layer was deposited by plasma-enhanced chemical vapor deposition (PE-CVD). The passivation layer plays an important role to prevent short connection between the electrodes. It was patterned to create holes for the connection between internal electrodes and external electrodes by reactive-ion etching (RIE). External contact pads were formed by Pt electrodes. The microstructure and dielectric characteristics of the capacitors were investigated by scanning electron microscopy (SEM) and impedance analyzer, respectively. In conclusion, the 0402 sized thin film multi-layer capacitors have been demonstrated, which have capacitance of 10 nF. They are expected to be used for decoupling purpose and have been fabricated with high yield.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.3
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• pp.110-116
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• 2020

Grains in the BaTiO₃, which is used for a dielectric layer in MLCC(Multi-Layer Ceramic Capacitor) are necessary to form core/shell structure for a stable TCC(Temperature Coefficient of Capacitance) behavior. The shell property has been deduced from the whole TCC behavior of core/shell structure due to its tiny size, ~ few ㎛. This study demonstrates the individual TCC behavior of the shell phase measured by micro-contact measurement in a temperature range between 35 and 135℃. Pt electrode pairs deposited on an enlarged core/shell structure in a diffusion couple sample made the measurement possible. As a result, the DPT (Diffusion Phase Transition) behavior of the shell phase was revealed as a different TCC behavior from that of the core: a broad peak with T_m at 65℃. This would be also useful experimental data for a modelling that depicts dielectric-temperature behavior of core/shell structure.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.26 no.2
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• pp.135-147
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• 2015

With the miniaturization and digitalization of electronics industry, demand for Multi-Layer Ceramic Capacitor(MLCC) has increased steadily because of its various applications such as DC Blocking, Decoupling and Filtering etc. The modeling techniques of MLCC has been studied for a long time but most of these modeling method can only be applied after measurement and this has some losses of material, time in both production stage and measurement stage. This paper proposes the modeling method which can predict the frequency characteristics of MLCC from structure data and material data in design stage. The impedance of N-Layer Capacitor can be expressed in differential mathematical form based on coupled transmission line equations. By using this formula, we can predict the impedance of MLCC. As a result, proposed modeling is correspond with simulation, and it takes much less time to obtain the result than the simulation.

• Journal of Powder Materials
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• v.16 no.1
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• pp.37-42
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• 2009

In this study, the feasible test for the mechanical property characterization of $BaTiO_3$ ceramics and multi-layer ceramic capacitor(MLCC) was performed with nanoindentation technique. In case of $BaTiO_3$ ceramics, hardness and elastic modulus are dependent on the densification of specimen showing the highest hardness and elastic modulus values of 12.3 GPa and 155 GPa, respectively at $1260^{\circ}C$. In case of MLCC chip, hardness of dielectric layer was lower than that of margin region. The nanoindentation method could be useful tool for the measurement of mechanical property within $BaTiO_3$ dielectric layer of very thin thickness in high capacitance MLCC.

• The Transactions of the Korean Institute of Power Electronics
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• v.16 no.5
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• pp.448-456
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• 2011

In this paper, we proposed a LED driver that allows to use a long lifetime MLCC with small voltage capacity to replace the electrolytic condenser that has been used at the output part by storing only the voltage fluctuation due to temperature variation in the output condenser. The proposed LED driver can allow to use a long lifetime MLCC with small power loss as the output condenser instead of the conventional electrolytic condenser with short lifetime because it stores only the voltage fluctuation due to the temperature variation of the LED light source in the output condenser by connecting the output condenser with the input power supply in series in the basic topology of the conventional boost DC/DC converter. In this study, we performed a simulation to verify the conventional DC/DC converter and the proposed DC/DC converter. It was shown that the DC/DC converter proposed through the experiment allows to use MLCC as the output condenser and the efficiency can be improved.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.124-124
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• 2005

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.111-111
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• 2005

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2013.04a
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• pp.462-463
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• 2013