• Journal of IKEEE
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• v.13 no.2
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• pp.101-107
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• 2009

Growth in the VLSI process and design technology is resulting into a continuous increase in the number of IPs on a chip to form a system. Because of many IPs on a single chip, efficient communication between IPs is essential. We propose a dynamically reconfigurable 3-layer bus structure which can adapt to the pattern of data transmission to achieve an efficient data communication between various IPs. The proposed 3-layer bus can be reconfigured to multi-single bus mode, and single-multi bus mode, thus providing the benefits of both single-bus and multi-bus modes. Experimental results show that the flexibility of the proposed bus structure can reduce data transmission time compared to the conventional fixed bus structure. We incorporated the proposed bus structure in a JPEG system and verified that the proposed structure achieved an average of 22% improvement in time over the conventional fixed bus structure.

• Journal of the Korean Ceramic Society
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• v.46 no.5
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• pp.534-539
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• 2009

Reaction Bonded Silicon Carbide(RBSC) has been used for engineering ceramics due to low-temperature fabrication and near-net shape products with excellent structural properties such as thermal shock resistance, corrosion resistance and mechanical strength. Recently, attempts have been made to develop hot gas filter with gradient pore structure by RBSC to overcome weakness of commercial clay-bonded SiC filter such as low fracture toughness and low reliability. In this study a fabrication process of porous RBSC with multi-layer pore structure with gradient pore size was developed. The support layer of the RBSC with multi-layer pore structure was fabricated by conventional Si infiltration process. The intermediate and filter layers consisted of phenolic resin and fine SiC powder were prepared by dip-coating of the support RBSC in slurry of SiC and phenol resin. The temperature of $1550^{\circ}C$ to make Si left in RBSC support layer infiltrate into dip-coated layer to produce SiC by reacting with pyro-carbon from phenol resin.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1046-1049
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• 2006

We proposed a simplified fabrication structure and method which can provide separate Red (R), Green (G), Blue (B), and White (W) OLED pixels with 2 metal-mask changes in emitting layer fabrication inspired from the structure of multi-layer white OLED and carrier blocking mechanism. A red emission layer for the R and W pixel with 1st mask, and then a blue emission layer with hole blocking layer for the B and W pixel with 2nd mask, and finally a common green emission layer were deposited sequentially. We expect that this concept would be very useful to the actual fabrication of multi-color OLED display although additional optimization is needed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.427-430
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• 2003

The properties of digital X-ray detectors depend on the absorption extent of X-rays, the generated signal of each X-ray photon and the distribution of the generated signal between pixels. In digital X-ray detector with single layer, signal is generated by X-ray photon captured in photoconductor. In X-ray detector with multi structure that scintillator formed above the top of photoconductor, signal is generated both by X-ray photon captured each in scintillator and photoconductor. X-ray detector with multi structure is generated more signal than single layer detector. In this paper, we simulated absorption fraction of X-ray detector with multi-layer using Monte Carlo program. The results compared with single-layer detector to be formed scinillator or photoconductor.

• Journal of the Korea Institute of Building Construction
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• v.3 no.1
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• pp.93-105
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• 2003

The Precast Concrete(PC) method was developed for a large production of a structure in Europe. Afterwards, this PC method has been applied to a structure and an outside Coating of buildings extensively. The outside Coating of the building applied this PC method is a method to put tiles or stones to base concrete. And there is a method to use paints for, so the expression of various patterns is possible. The Multi-Layer Coating is one of the methods to use paints. This Multi-Layer Coating method can show various designs of external appearance with Foam when it is made with the PC panel. Also, the paint film of the PC panel enables a splendid appearance, and a protective function of concrete is possible, too. Therefore, it makes good durability of the PC. Besides, maintenance is easy to manage because it is free from pollution when it uses metallic materials, stones, or any other materials. You might have no trouble in applying the Multi-Layer Coating method in order to save a merit of an outside Coating on the PC panel. However, the Multi-Layer Coating method used as a current outside Coating method has pollution and bad working environment because Oil Epoxy Resins have toxicity and flammability. Therefore, a lot of warnings are required for coating work in order to have appropriate quality because working hours are short, and production efficiency is low too. These reasons make the cost of construction of the Multi-Layer Coating method increase. And employers or designers may have problems in selecting this Multi-Layer Coating method. Therefore, the purpose of this study is to get activation of the Multi-Layer Coating method by offering improvement measures about the problems of the existing Multi-Layer Coating method.

• Proceedings of the KIPE Conference
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• 2018.07a
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• pp.298-299
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• 2018

본 논문에서는 자기유도방식 무선전력전송(Inductive Power Transfer, IPT) 시스템에 적용되는 송수신 코일의 Multi-layer 구조의 자기결합 특성에 대하여 분석한다. 기존에 제안된 Single-layer 구조의 코일과 Multi-layer 구조의 코일이 가지는 차이점을 자기결합도 측면에서 비교 분석하고 이를 Simulation 및 실험을 통해 검증한다.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.12 no.1
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• pp.45-53
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• 2006

Thermal insulation is used in a variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. Among these factors, the thermal resistance of the insulating wall is the most important factor to determine the performance of the insulating package. In many cases, insulating wall consists of multi-layered structure and the heat transfer through this structure is a very complex process. In this study, an one-dimensional mathematical model, which includes all of the heat transfer principles covering conduction, convection and radiation in multi-layered structure, were developed. Based on this model, several heat transfer phenomena occurred in the air space between the layer of the insulating wall were investigated. From the simulation results, it was observed that the heat transfer through the air space between the layer were dominated by conduction and radiation and the low emissivity of the surface of each solid layer of the wall can dramatically increase the thermal resistance of the wall. For practical use, an equation was derived for the calculation of the thermal resistance of a multi-layered wall.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.40 no.3
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• pp.18-24
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• 2003

The resonator using two layer microstrip structure was proposed and the bandpass filter was designed using this resonator in this paper. The proposed resonator structure is constructed by placing a U-shape of resonator in the first layer and then placing a broadside coupling strip in the second layer just above of the U-shape of resonator's edge part. Because these structure has various design parameters than general single layer coupled line structure, filter design is more flexible. In this paper, the narrow band filter was designed using multi-layer structure that had been applied to broadband filter because it's high coupling nature. The filter was designed to have 4MHz center frequency and 3 % fractional bandwidth, and finally confirmed that can be realizable narrow band filter by using multi-layer structure through fabrication and measurement.

• Journal of the Korean Institute of Landscape Architecture
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• v.43 no.5
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• pp.55-64
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• 2015

In this study, negative air ions, which can increase comfort and positively influence human health, was set as an evaluative factor for school forests. The characteristics, location and microclimate of school forests were examined to determine an effective school forest model for maximum negative air ion generation. It also aimed to provide basic data for the development of urban green fields. The negative air ion concentrations were different according to the green types. The order from the highest to the lowest was: single-layer structure($934ea/cm^3$) > multi-layer structure($794ea/cm^3$) > grass($553ea/cm^3$) > bare ground($529ea/cm^3$). As for the correlation with microclimate, negative air ion concentration was negatively correlated with temperature. The negative air ion concentration was significantly different according to planting type. The negative air ion concentration was higher at single-layer structure sites than at multi-layer structure sites, which appears to indicate that the temperature is higher when the vegetation structure was single-layer compared to multi-layer. Wind speed was higher at the single-layer planted site than at the multi-layer planted site. The vegetation wind shielding effect was lower at single-layer planted sites than at multi-layer planted sites. The single-layer planted site provided more favorable conditions for the generation and dispersion of negative air ions.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.2
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• pp.443-448
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• 2010

Rapid advance in information technology requires high performance devices with compact size. Integrated multi-layer electronic element with different functions enables those compact devices to possess various performances and powerful capabilities. In mass production, the multi-layer electronic element is manufactured as a bulk type with a large number of parts for productivity. However, this may cause the electronic part to be damaged in the cutting process of the bulk elements to separate into each part. Therefore the cutting performance of multi-layer element bulk is playing an important role in the view of production efficiency. This study focuses on the cutting characteristics of multi-layer electronic elements. In order to increase the efficiency, the vibration cutting method was applied to the blade cutting machine. Flexure hinge structure, which is an physical amplifier of increasing displacement, was attached to the vibration cutting device for machining efficiency. The behaviors of flexure hinge were modeled with Lagrange equation and simulated with finite element method (FEM). Performance of hinge structure was verified by experimental modal analysis (EMA) for hinge structure to be tuned to the specific mode of vibrations. Cutting experiments of multi-layer elements were conducted with the proposed vibrating cutting module, and the characteristics was analyzed.