• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.242-242
• /
• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.43 no.12 s.354
• /
• pp.23-32
• /
• 2006

Fast and accurate power bus design (FAPUD) method for multi-layers high-speed digital boards is devised for the power supply network design tool for accurate and precise high speed board. FAPUD is constructed, based on two main algorithms of the PBEC (Path Based Equivalent Circuit) model and the network synthesis method. The PBEC model exploits simple arithmetic expressions of the lumped 1-D circuit model from the electrical parameters of a 2-D power distribution network. The circuit level design based on PBEC is carried with the proposed regional approach. The circuit level design directly calculates and determines the size of on-chip decoupling capacitors, the size and the location of off-chip decoupling capacitors, and the effective inductances of the package power bus. As a design output, a lumped circuit model and a pre-layout of the power bus including a whole decoupling capacitors are obtained after processing FAPUD. In the tuning procedure, the board re-optimization considering simultaneous switching noise (SSN) added by I/O switching can be carried out because the I/O switching effect on a power supply noise can be estimated over the operation frequency range with the lumped circuit model. Furthermore, if a design changes or needs to be tuned, FAPUD can modify design by replacing decoupling capacitors without consuming other design resources. Finally, FAPUD is accurate compared with conventional PEEC-based design tools, and its design time is 10 times faster than that of conventional PEEC-based design tools.