• Title/Summary/Keyword: Multi-block Technique

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A study on the surface characteristics of diamond wire-sawn silicon wafer for photovoltaic application (다이아몬드 코팅 와이어로 가공된 태양전지용 실리콘 웨이퍼의 표면 특성에 관한 연구)

  • Lee, Kyoung-Hee
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.21 no.6
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    • pp.225-229
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    • 2011
  • Most of the silicon cutting methods using the multi-wire with the slurry injection have been used for wafers of the crystalline solar cell. But the productivity of slurry injection cutting type falls due to low cutting speeds. Also, the direct contact with the metal wire and silicon block increases the concentration of metallic impurities in the wafer's surface. In addition, the abrasive silicon carbide (SiC) generates pollutants. And production costs are rising because it does not re-use the worn wire. On the other hand, the productivity of the cutting method using the diamond coated wire is about 2 times faster than the slurry injection cutting type. Also, the continuous cutting using the used wire of low wear is possible. And this is a big advantage for reduced production costs. Therefore, the cutting method of the diamond coated wire is more efficient than the slurry injection cutting technique. In this study, each cutting type is analyzed using the surface characteristics of the solar wafer and will describe the effects of the manufacturing process of the solar cell. Finally, we will suggest improvement methods of the solar cell process for using the diamond cutting type wafer.

A practial design of direct digital frequency synthesizer with multi-ROM configuration (병렬 구조의 직접 디지털 주파수 합성기의 설계)

  • 이종선;김대용;유영갑
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.21 no.12
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    • pp.3235-3245
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    • 1996
  • A DDFS(Direct Digital Frequency Synthesizer) used in spread spectrum communication systems must need fast switching speed, high resolution(the step size of the synthesizer), small size and low power. The chip has been designed with four parallel sine look-up table to achieve four times throughput of a single DDFS. To achieve a high processing speed DDFS chip, a 24-bit pipelined CMOS technique has been applied to the phase accumulator design. To reduce the size of the ROM, each sine ROM of the DDFS is stored 0-.pi./2 sine wave data by taking advantage of the fact that only one quadrant of the sine needs to be stored, since the sine the sine has symmetric property. And the 8 bit of phase accumulator's output are used as ROM addresses, and the 2 MSBs control the quadrants to synthesis the sine wave. To compensate the spectrum purity ty phase truncation, the DDFS use a noise shaper that structure like a phase accumlator. The system input clock is divided clock, 1/2*clock, and 1/4*clock. and the system use a low frequency(1/4*clock) except MUX block, so reduce the power consumption. A 107MHz DDFS(Direct Digital Frequency Synthesizer) implemented using 0.8.mu.m CMOS gate array technologies is presented. The synthesizer covers a bandwidth from DC to 26.5MHz in steps of 1.48Hz with a switching speed of 0.5.mu.s and a turing latency of 55 clock cycles. The DDFS synthesizes 10 bit sine waveforms with a spectral purity of -65dBc. Power consumption is 276.5mW at 40MHz and 5V.

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Efficient Data Acquisition Technique for Clinical Application of Multileaf Collimator (다엽콜리메이터의 임상적용을 위한 효율적인 정보 취득 기술)

  • Lee, Jae-Seung;Kim, Jung-Nam
    • The Journal of the Korea Contents Association
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    • v.8 no.11
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    • pp.182-188
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    • 2008
  • The MLC(multi leaf collimator) in charge of important role in radiation therapy field recently have been exchanging from shielding block into it rapidly, owing to being convenient. However, MLC can be occurred the leakage dose of inter_leaves and the error of algorithm in imput and output from digital signal. We compared the difference of imput method to MLC made by Varian Cop. with the error and effective field induced by MLC shaper and film scanner based on XimaVision value as using MLC layer of various shapes. According to comparing standard value with them to basic MLC layer (test1-5), MLC shaper was $0{\sim}0.29cm$, $0.23{\sim}3.59cm^2$ and film scanner was $0{\sim}0.78cm$, $0.24{\sim}3.89cm^2$. At the MLC layer to be applied in clinic, MLC shaper was $0{\sim}0.54cm$, $0.04{\sim}1.68cm^2$ and film scanner was $0{\sim}0.78cm$, $0.24{\sim}3.89cm^2$. The more distance and field from axis of central line increase, the more bigger the error value increases. There is a few mm error from standard point at the process which imput various information to apply MLC in clinic. and effective field did not have variation of monitor unit and dose owing to being a few cm2 error against real field. But there are some problem to shield critical organs because some part of target volume induced by the movement of organs can be not included, therefore we have to pay attention on the process to imput MLC layer