• 한국전기전자재료학회논문지
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• 제32권2호
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• pp.157-160
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• 2019

P(VDF-TrFE-CFE) (Poly (vinylidene fluoride-trifluoroethylene-chlorofluoroethylene)), which exhibits a high electrostriction of about 7%, can transmit tactile output as vibration or displacement. In this study, we investigated the applicability of P(VDF-TrFE-CFE) to wearable piezoelectric actuators. The P(VDF-TrFE-CFE) layers were deposited through spin-coating, and interspaced with patterned Ag electrodes to fabricate a two-layer $3.5mm{\times}3.5mm$ device. This layered structure was designed and fabricated to increase the output and displacement of the actuator at low driving voltages. In addition, a laser vibrometer and piezoelectric force microscope were used to analyze the device's vibration characteristics over the range of ~200~4,200 Hz. The on-off characteristics were confirmed at a frequency of 40 Hz.

• 한국재료학회지
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• 제29권11호
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• pp.697-702
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• 2019

In this study, using a wet chemical process, we evaluate the effectiveness of different solution concentrations in removing layers from a solar cell, which is necessary for recovery of high-purity silicon. A 4-step wet etching process is applied to a 6-inch back surface field(BSF) solar cell. The metal electrode is removed in the first and second steps of the process, and the anti-reflection coating(ARC) is removed in the third step. In the fourth step, high purity silicon is recovered by simultaneously removing the emitter and the BSF layer from the solar cell. It is confirmed by inductively coupled plasma mass spectroscopy(ICP-MS) and secondary ion mass spectroscopy(SIMS) analyses that the effectiveness of layer removal increases with increasing chemical concentrations. The purity of silicon recovered through the process, using the optimal concentration for each process, is analyzed using inductively coupled plasma atomic emission spectroscopy(ICP-AES). In addition, the silicon wafer is recovered through optimum etching conditions for silicon recovery, and the solar cell is remanufactured using this recovered silicon wafer. The efficiency of the remanufactured solar cell is very similar to that of a commercial wafer-based solar cell, and sufficient for use in the PV industry.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.39-46
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• 2017

본 연구는 평판형 히터용 금속방열판상의 세라믹 절연층 제조, 즉 절연성 금속기판에 관한 것이다. 반도체나 디스플레이의 열처리 공정 등에 사용되는 평판형 히터를 제조함에 있어서, 온도 균일도를 높이기 위해 금속 방열판으로서 열전도율이 높고, 비교적 가벼우며, 가공성 좋은 알루미늄 합금 기판이 선호된다. 이 알루미늄 기판에 발열 회로 패턴을 형성하기 위해서는 금속 기판에 절연층으로서 고온 안정성이 우수한 세라믹 유전체막을 코팅하여야 한다. 금속 기판상에 세라믹 절연층을 형성함에 있어서 가장 빈번히 발생하는 첫 번째 문제는 금속과 세라믹의 이종재료 간의 큰 열팽창계수 차이와 약한 결합력에 의한 층간박리 및 균열발생이다. 두 번째 문제는 절연층의 소재 및 구조적 결함에 따른 절연파괴이다. 본 연구에서는 이러한 문제점 해소를 위해 금속소재 기판과 세라믹 절연층 사이에 완충층을 도입하여 이들 간의 기계적 매칭과 접합력 개선을 도모하였고, 다중코팅 방법을 적용하여 절연막의 품질과 내전압 특성을 개선하고자 하였다.

• 한국산학기술학회논문지
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• 제18권5호
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• pp.475-480
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• 2017

본 논문에서는 레이저 유도증착 공정을 사용하여 절연기판위에 미세패턴의 전도성 향상시켰다. 기존의 레이저 유도증착의 공정에서 발생하는 높은 레이저빔 에너지로 인하여, 미세패턴의 낮은 증착밀도, 산화와 같은 문제점이 있다. 이러한 문제점을 폴리머 코팅층을 사용하여 증착정밀도와 전도성 향상하였다. 실리콘 웨이퍼 위에 미세패턴 증착을 위해서 크롬, 구리를 사용하였다. 본 연구에서는 다중펄스 방식의 레이저 빔을 금속박막에 조사하여 절연기판(insulating substrate: $SiO_2$) 위에 시드 층을 형성하고, 형성된 시드 층위에 무전해 도금을 적용하여 미세패턴 및 구조물을 제작하는 복합공정기술을 개발하였다. 레이저빔의 다중 스캔방식으로 조사함으로서 레이저빔의 에너지가 증착 층의 증착밀도와 표면품위를 향상시키고, 미세전극 패턴으로 사용가능한 전기 전도성을 갖게 되었음 알 수 있었다. 레이저 직접묘화법과 무전해 도금을 적용한 복합공정을 이용하여 미세전극을 증착 한 후 비저항을 측정한 결과 도금 전 저항이 $6.4{\Omega}$, 도금 후의 저항이 $2.6{\Omega}$으로 미세전극 패턴의 표면조직이 균일하고 증착되었다. 표면조직이 균일하고 치밀하게 증착되었기 때문에 전기 전도도가 약 3배정도 향상되었다.

• 한국약용작물학회지
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• 제21권1호
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• pp.7-19
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• 2013

This study was carried out to select new pelleting binder and material for seeds from Fraxinus rhynchophylla Hance and Alnus sibirica Fisch. ex Turcz. The optimum treatments of the various concentrations and species of priming agents to improve seed germination of both woody medicinal plants were also estimated. Germinability was increased when the seeds of Fraxinus rhynchophylla Hance was soaked in -1.0 MPa of PEG6000 solution at $15^{\circ}C$ for 4 days significantly, the optimum treatment for improving germination of Alnus sibirica Fisch. ex Turcz was observed when the tested seeds was soaked in 100 mM of KCl at $15^{\circ}C$ for 4 days. The influence of physical and chemical properties of pelleting solid materials, the mixture of gypsum, diatomaceous earth, dalma ceramic and vermicuolite (6:1:1:1 ratio) were found as the best pelleting materials for Fraxinus rhynchophylla Hance and Alnus sibirica Fisch. ex Turcz. seeds. To satisfy the requirements of absorption and compatibility for multi-layer seed pelleting, SGPA (Starch-grafted cross-linked polyacrylates) hydrogel was prepared using starch, acrylonitrile, ceric ammonium nitrate, nitric acid, methyl alcohol and potassium hydroxide. The resulting SGPA hydrogel showed high water absorption but not plant compatibility. It suggested that seed pelleting using pelleting materials and SGPA hydrogel (multi-layer coating) after priming agent treatment is to increase germinability and seedling growth and it can reduced irrigation labours and can also save seed.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• 멤브레인
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• 제23권2호
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• pp.176-184
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• 2013

다성분계 휘발성 유기화합물(VOCs; Volatile Organic Compounds)의 분리를 위하여 상전이법을 이용하여 방사한 poly (ether imide) (PEI) 중공사 지지체에 poly (dimethylsiloxane) (PDMS)를 코팅하여 중공사 복합막을 제조하였다. VOCs 회수용 중공사막으로서 적합성을 알아보기 위해서 중공사막의 모폴로지, 질소 및 산소 기체 투과도를 측정하고, 벤젠, 톨루엔 그리고 자일렌에 대한 내구성을 조사하였다. 다성분계 휘발성 유기화합물의 효과적인 분리성능을 조사하기 위하여 Stage-cut과 feed 농도에 따른 다성분계 VOCs 투과 성능 변화를 관찰하였다. PEI 지지체 중공사막에 PDMS를 코팅시킴에 따라 산소와 질소 투과도는 각각 45,000 GPU와 49,450 GPU에서 63 GPU와 30 GPU로 감소하는 것을 확인하였다. VOCs 투과농도는 Stage-cut이 감소함에 따라 증가하나, 회수율은 감소하였다. 반면에 공급농도 증가에 따라 투과농도는 비례적으로 증가하였지만, 농축비나 회수율은 큰 변화가 없었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.354-361
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• 2005

In high speed cutting process, due to the friction between the tool and workpiece, a temperature rise of contacting part is serious. It need to develop cutting tool for overcoming such a poor condition. So now, some studies, the optimization of tool shapes, the fine grains of tool material, multi-layer coating of tools are processing. If mirror finishing on the tool is processed, there is advantage of relation between chip and tool, because of less friction, and also tool's lift would be increased. As a result mirror like finishing is expected efficient enhancement of tool. Generally, it is too difficult to process by a general way for tools of complex shapes, it is required a new method to process such complex shape tools. The magnetic fluid polishing technique can polish the workpiece of complex shape, because the polishing method which polishes as compress the workpiece by the magnetism abrasives to arrange to the linear according to the line of magnetic force. In this paper, We polished the surface of the high speed cutting tool using the magnetic fluid polishing technique, to enhance the performance of the high speed cutting tool.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.276-279
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• 2004

Plasma enhanced chemical vapor deposition (PECVD) of silicon nitride (SiN) is a proven technique for obtaining layers that meet the needs of surface passivation and anti-reflection coating. In addition, the deposition process appears to provoke bulk passivation as well due to diffusion of atomic hydrogen. This bulk passivation is an important advantage of PECVD deposition when compared to the conventional CVD techniques. A further advantage of PECVD is that the process takes place at a relatively low temperature of 300t, keeping the total thermal budget of the cell processing to a minimum. In this work SiN deposition was performed using a horizontal PECVD reactor system consisting of a long horizontal quartz tube that was radiantly heated. Special and long rectangular graphite plates served as both the electrodes to establish the plasma and holders of the wafers. The electrode configuration was designed to provide a uniform plasma environment for each wafer and to ensure the film uniformity. These horizontally oriented graphite electrodes were stacked parallel to one another, side by side, with alternating plates serving as power and ground electrodes for the RF power supply. The plasma was formed in the space between each pair of plates. Also this paper deals with the fabrication of multicrystalline silicon solar cells with PECVD SiN layers combined with high-throughput screen printing and RTP firing. Using this sequence we were able to obtain solar cells with an efficiency of 14% for polished multi crystalline Si wafers of size 125 m square.

• 한국산학기술학회논문지
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• 제17권12호
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• pp.482-487
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• 2016

파장 400 nm 이하의 자외선은 눈 건강에 매우 해롭다. 특히 UVA (315 nm ~ 400 nm)는 백내장, 설안염, 초자체경화 등을 유발할 수 있고, UVB (280 nm ~ 315 nm)는 결막염, 각막염 및 설안염 등을 일으킬 수 있다. 따라서 폴리머 안경렌즈를 사용함에 있어서 자외선의 차단 기능과 가시광선 영역에서 투과되는 빛을 증가시키고, 안경렌즈 표면에서 형성되는 허상을 방지하는 반사방지 기능은 매우 중요하다. 본 연구에서는 m-자일릴렌 디이소시아네이트 모노머와 2,3-Bis-1-propanethiol 모노머 및 벤조트리아졸 UV 흡수제 (SEESORB 709), 안료 혼합물, 이염화 이부틸 주석 촉매제, 알킬인산 에스터 이형제 등의 혼합물을 인젝션 몰드 방법으로 열중합 공정을 적용하여, 굴절률 1.67의 고굴절률 폴리머 안경렌즈를 제조하였다. 폴리머 안경렌즈 표면에서의 반사를 줄이기 위하여 렌즈 양면에 다층박막 반사방지 코팅을 E-beam 증착 시스템으로 코팅하였다. 자외선 차단 폴리머 안경렌즈의 광학적 특성을 UV-visible spectrometer로 분석하였고, 반사방지층을 구성하는 박막의 굴절률, 표면거칠기 등과 같은 박막소재 특성을 각각 Ellipsometry 및 원자힘 현미경으로 분석하였다. 분석 결과 제조된 안경렌즈는 395 nm 파장 이하의 자외선을 99% 이상 완벽하게 차단하였다.