• Proceedings of the Korean Institute of Building Construction Conference
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• 2016.05a
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• pp.113-114
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• 2016

This paper proposes a technical requirements analysis of implementation of multi-trade prefabrication. Recently, there has been a rise in the use of prefabrication to minimize on-site work for time reduction to increase productivity. Prefabrication technique is evolved into multi-trade prefabrication combining other trades from single-trade prefabrication. For implementation of new technique, not only itself but complementary techniques have to be prepared. In this paper, MEP corridor rack, a major item of multi-trade prefabrication, was implemented in the test bed and its process was analyzed to find out technical requirements. As a result, comparatively high level of IT technique was required for efficient use of multi-trade prefabrication in design, lifting and construction phase. In design phase, component level of BIM library was needed for manufacturing; and in lifting phase, BIM-based site logistics process was required. Also in construction phase, laser scanning was implemented for gathering shape and geometry of the wall and slab that were attached to multi-trade prefabrication module.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.242-245
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• 2007

In the present investigation, the multi-stage warm drawing process was applied to the magnesium alloy AZ31 sheet to examine the feasibility of multi-stage forming process as a high formability product making process. For that purpose, a multi-stage drawing die system with heating module was developed, and the AZ31 sheets of different sizes were consecutively drawn by the multi-stage drawing die. The obtained drawn cups of AZ31 showed that the multi-stage drawing provided the better formability than the single stage drawing in terms of drawing depth without cup defects such as wrinkles or fractures. The sheet formability improvement by using the multi-stage drawing die system against the single stage was also analyzed in terms of the finite element analysis of material state variables evolution.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.5
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• pp.185-189
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• 2005

This paper focuses on the design for Rx/Tx switch module of GSM(global standard mobile) band, characterization of a miniature, low power and dual-band implementation of the front-end switch module with low-pass filer And the effort to make agreement between the simulated design and the measured data for these solutions takes the place through accumulated design and manufacturing data library. We present the design, modeling and measurement of switch module integrating GSM Rx/Tx switching circuit and LPF(low pass filter) on a LTCC(low temperature co-fired ceramic) substrate. For GSM application, insertion and return loss of the low pass filter designed was less than 0.3 dB which was less than 12.7 dB at 900 MHz. The LTCC switch module contained 10 embedded passives and 3 surface mount components integrated on 4.6$\times$4.8$\times$1.2 mm, 6-layer multi-layer integrated circuit. The insertion loss of switch module measured at 900 MHz was 11 dB. In both of the design approach yielded excellent agreement between measured and simulated results.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.353-359
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• 1988

In this paper, the design and implementation of a multi-processor based die bonder machine for the semiconductor will be described. This is a final research results carried out for two years from June, 1986 to July, 1988. The mechanical system consists of three subsystems such as bonding head module, wafer feeding module, and lead frame feeding module. The overall control system consists of the following three subsystems each of which employs a 16 bit microprocessor MC 68000 : (i) supervisory control system, (ii) visual recognition / inspection system and (iii) the display system. Specifically, the supervisory control system supervises the whole sequence of die bonder machine, performs a self-diagnostics while it controls the bonding head module according to the prespecified bonding cycle. The vision system recognizes the die to inspect the die quality and deviation / orientation of a die with respect to a reference position, while it controls the wafer feeding module. Finally, the display system performs a character display, image display ans various error messages to communicate with operator. Lead frame feeding module is controlled by this subsystem. It is reported that the proposed control system were applied to an engineering sample and tested in real-time, and the results are sucessful as an engineering sample phase.

• Industrial Engineering and Management Systems
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• v.9 no.3
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• pp.227-241
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• 2010

A memory module industry's supply chain usually consists of multiple manufacturing sites and multiple distribution centers. In order to fulfill the variety of demands from downstream customers, production planners need not only to decide the order allocation among multiple manufacturing sites but also to consider memory module industrial characteristics and supply chain constraints, such as multiple material substitution relationships, capacity, and transportation lead time, fluctuation of component purchasing prices and available supply quantities of critical materials (e.g., DRAM, chip), based on human experience. In this research, a directed graph-based supply network planning (DGSNP) model is developed for memory module industry. In addition to multi-site order allocation, the DGSNP model explicitly considers production planning for each manufacturing site, and purchasing planning from each supplier. First, the research formulates the supply network's structure and constraints in a directed-graph form. Then, a proposed genetic algorithm (GA) solves the matrix form which is transformed from the directed-graph model. Finally, the final matrix, with a calculated maximum profit, can be transformed back to a directed-graph based supply network plan as a reference for planners. The results of the illustrative experiments show that the DGSNP model, compared to current memory module industry practices, determines a convincing supply network planning solution, as measured by total profit.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2444-2448
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• 2007

The multi channel of DDI which is the core part of the LCD-TV has been propelled. When multi channel in DDI is introduced, it brings a thermal problem because of the increased power. To solve the thermal problem of the DDI it needs to be investigated each at the package level and module level. It is important to extract the junction temperature(Tj) of DDI clearly from the system level. The objective of this research is to construct a compact model. The compact model is to reduce LCD module including DDI. When the compact model is used, it will be able to easily handle the boundary condition and accurately predict the temperature. Consequently, the temperature of DDI can be calculated easily at the system level. Through this research,we also proposed the cooling plan of DDI for a protection of overheating. The cooling plan was utilized in DDI design.

• Journal of the Korea Safety Management & Science
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• v.10 no.2
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• pp.155-162
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• 2008

The ubiquitous, which is developed for human's convenience, uses the concept of situation awareness that communicates with computer and performs a certain work without user's recognition. In order to collect the information of situation, many devices are required. Also, in the condition of ubiquitous middleware, priority is given to effective controls of various devices. There are many devices for collecting the information of situation awareness such as sensor, RFID, etc. Among them, in the use of RFID, the researcher performed the experiment, in which multiple readers were used depending on the necessity of awareness information, and found the problem of intervention between readers occurring when multiple readers are used. The paper handles the problem of intervention causing from using multiple readers and suggests middleware design module using session manager to solve the problem.

• Proceedings of the KIEE Conference
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• 1999.11c
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• pp.791-793
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• 1999

제어 컴퓨터의 고장으로 인해 인명이나 재산에 치명적 영향을 미치는 safety-critical 실시간 시스템을 제어하고 모니터링하기 위해 디지털 컴퓨터의 사용은 점점 일반화되고 있다. 특히, VLSI 기술의 급격한 발달로 인해 하드웨어가 초소형화 되고 대량생산이 가능해진 현실에서 이러한 제어 컴퓨터의 극대화된 신뢰도 요구를 만족시키기 위해 막중한 하드웨어 여분(hardware redundancy)이 널리 사용되고 있는 실정이다. 본 논문에서는 N개의 다중 모듈(multi-module)로 이루어진 하드웨어 여분의 운영 모드를 분석하고 각 운영 모드에서 고장이 발생할 경우 모드의 전환과 그로 인한 신뢰도의 변화를 계산할 것이다. 그리고 간단한 시뮬레이션을 통해 전환된 여러 모드 중 가장 우수한 신뢰도를 갖는 모드를 평가하게 된다.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.21 no.8
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• pp.2033-2042
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• 1996

In this papre, we describe a recently implemented echo canceller for digital cellular communication of Code Division Multiple Access(CDMA) that features time sharing of digital signal processor(DSP) over four channels in one DSP to reduce per channel costs. In the Public Land Mobile Network(PLMN), it is important to cancel the echo reflected from the Public Switched Telephone Network(PSTN) side. In case of digital mobile system, the round-trip delay of the echo is in excess of about 180 milliseconds due to frame-by-frame voice coding. It is necessary to cancel the echo in PLMN. We have developed a multi-channel echo canceller tht operates with Time Switch Module in a Mobile Switching Center(MSC). The general echo canceller needs PCM trunk interface circuits and the tone detection and disabling circuits, but the multi-channel echo canceller linked with Time Switch Module does not need them. Therefore we could develop the effective and economical echo canceller.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 1998.10a
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• pp.413-420
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• 1998

In this study, an expert system is developed to evaluate a safety of tunnel structures. Using a dynamic finite element analysis module, this expert system predicts dynamic responses of a concrete lining surface which a transient force is applied on and estimates the condition between the concrete lining and surrounding ground. The evaluation parameter values of the module are multi-reflected wave frequency and amplitude of the dynamic responses. The multi-reflected wave frequency represents the depth of concrete lining, and the other parameter, the amplitude of the frequency, is utilized for detecting the internal flaws. A comparison of the dynamic responses between numerical and experimental model test verifies an effectiveness of this system. By this expert system, the safety of tunnel structures and the detection of internal flaws of concrete linings are estimated quantitatively.