• JSTS:Journal of Semiconductor Technology and Science
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• 제14권3호
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• pp.322-330
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• 2014

New effective techniques to repair "small" design errors in integrated circuits are presented. As semiconductor chip complexity increases and the design period becomes tight, errors frequently remain in a fabricated chip making revisions required. Full mask revision significantly increases the cost and time-to-market. However, since many "small" errors can be repaired by modifying several connections among the circuit blocks and spare cells, errors can frequently be repaired by revising metal layers. Metal only revision takes significantly less time and involves less cost when compared to full mask revision, since mask revision costs multi-million dollars while metal revision costs tens of thousand dollars. In our research, new techniques are developed to further reduce the number of metal layers to be revised. Specifically, we partition the circuit blocks with higher error probabilities and extend the terminals of the signals crossing the partition boundaries to the preselected metal repair layers. Our partitioning and pin extension to repair layers can significantly improve the repairability by revising only the metal repair layers. Since pin extension may increase delay slightly, this method can be used for non-timing-critical parts of circuits. Experimental results by using academia and industrial circuits show that the revision of the two metal layers can repair many "small" errors at low-cost and with short revision time. On the average, when 11.64% of the spare cell area and 24.72% of the extended pins are added to the original circuits, 83.74% of the single errors (and 72.22% of the double errors) can be corrected by using two metal revision. We also suggest methods to use our repair techniques with normal commercial vender tools.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.176-176
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• 2010

One of the critical issues for applications of flexible organic thin film transistors (OTFTs) for flexible electronic systems is the electrical stabilities of the OTFT devices, including variation of the current on/off ratio (Ion/Ioff), leakage current, threshold voltage, and hysteresis under repetitive mechanical deformation. In particular, repetitive mechanical deformation accelerates the degradation of device performance at the ambient environment. In this work, electrical stability of the pentacene organic thin film transistors (OTFTs) employing multi-stack hybrid encapsulation layers was investigated under mechanical cyclic bending. Flexible bottom-gated pentacene-based OTFTs fabricated on flexible polyimide substrate with poly-4-vinyl phenol (PVP) dielectric as a gate dielectric were encapsulated by the plasma-deposited organic layer and atomic-layer-deposited inorganic layer. For cyclic bending experiment of flexible OTFTs, the devices were cyclically bent up to 105 times with 5mm bending radius. In the most of the devices after 105 times of bending cycles, the off-current of the OTFT with no encapsulation layers was quickly increased due to increases in the conductivity of the pentacene caused by doping effects from $O_2$ and $H_2O$ in the atmosphere, which leads to decrease in the Ion/Ioff and increase in the hysteresis. With encapsulation layers, however, the electrical stabilities of the OTFTs were improved significantly. In particular, the OTFTs with multi-stack hybrid encapsulation layer showed the best electrical stabilities up to the bending cycles of $10^5$ times compared to the devices with single organic encapsulation layer. Changes in electrical properties of cyclically bent OTFTs with encapsulation layers will be discussed in detail.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 ITC-CSCC -1
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• pp.365-368
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• 2002

We investigated the influence of RTP annealing of multi-layered metal films deposited on oxides layer. Two types of oxides, BPSG and P-7205, were used as a bottom layer under multi-layered metal film. The bonding was not good in metal/BPSG/Si samples because adhesion between metal layer and BPSG oxide layer was poor by interfacial reaction during RTP annealing above 650$^{\circ}C$. On the other hand bonding was always good in metal/ P-TEOS /Si samples regardless of annealing temperature. We observed the interface between oxide and metal layers using AES and TEM. The phosphorus and oxygen profile in interface between metal and oxide layers were different in metal/BPSG/Si and metal/P-TEOS/Si samples. We have known that the properties of interface was improved in metal/BPSG/Si samples when the sample was annealed below 650$^{\circ}C$.

• 한국재난관리표준학회지
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• 제1권2호
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• pp.79-85
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• 2008

본 연구는 지진이 발생한 경우, 교량이 위치하고 있는 기초부 주변토체의 영향을 포함하고 그 위에 위치한 교량시스템의 동적거동을 예측하여 결과적으로 전체적 교량시스템의 내진거동을 분석하기 위한 통합된 새로운 방법론(Unified Dynamic Analysis Method)에 대하여 제안하고자 한다. 주변토체의 영향을 포함한 교량의 내진거동을 분석하는 통합된 방법론은 교량의 내진평가시에 적절하게 사용 될 수 있다는 것을 밝혔다. 본 방법론을 이용시 다중입력파에 대한 영향분석도 용이할 수 있다.

• 한국전기전자재료학회논문지
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• 제19권8호
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• pp.764-768
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• 2006

For the possible application of pearl pigment, multi-layered $TiO_2/Al,\;Cr/TiO_2$ thin film were deposited on $SiO_2$ substrate by using sputtering method, $TiO_2$ and Al or Cr was selected as a possible high and low refraction material at the film interface respectively. Optical properties including color effect were systematically studied in terms of different film thickness and film layers by using spectrometer. In order to expect the experimental results, the simulation program, the Essential Macleod Program(EMP) was adopted and compared with the experimental data. The film consisting of $TiO_2/Al,\;Cr/TiO_2$ layers shows a wavelength range of $430{\sim}760nm$, typically color ranges between bluish purple and red. It was confirmed that this experimental result was quite well consistent with the experimental one.

• 전자공학회논문지
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• 제51권12호
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• pp.140-149
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• 2014

최근 초고해상도 디스플레이의 개발로 영상의 화질 향상에 관한 연구가 활발히 이루어지고 있다. 기존의 화질 향상 방법은 대비와 디테일을 동시에 향상시키는 과정에서 경계 영역을 중심으로 대비의 역전현상이 발생하는 문제가 있다. 본 논문은 영상의 화질 향상을 향상하는 과정에서 계층적 정보와 경계 영역의 밝기편차를 고려함으로써 이를 해결하고자 하였다. 먼저 크기가 다른 계층들에 대하여 블록의 크기별로 대비를 향상한다. 다음으로 각 블록별 경계영역을 계산하고 해당 영역의 밝기 변화율을 기반으로 가중치를 결정한다. 결정된 가중치를 이용하여 디테일 향상을 수행한다. 다양한 영상에 대하여 실험한 결과 제안한 알고리즘의 대비 및 디테일이 우수함을 확인하였다.

• 반도체디스플레이기술학회지
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• 제14권4호
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• pp.45-49
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• 2015

Using a combined CVD and ALD equipment system, multi-layer quantum well structures of $Al_2O_3/a-Si/Al_2O_3$ were fabricated on silicon Schottky junction devices and implemented to quantum well solar cells, in which the 1~1.5 nm thicknesses of the aluminum oxide films and the a-Si thin film layers were deposited at $300^{\circ}C$ and $450^{\circ}C$, respectively. Fabricated solar cell was operated by tunneling phenomena through the inserted quantum well structure being generated electrons on the silicon surface. Efficiency of the fabricated solar cell inserted with multi-quantum well of 41 layers has been increased by about 10 times that of the solar cell of pure Schottky junction solar cell.

• Journal of Communications and Networks
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• 제4권3호
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• pp.221-229
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• 2002

Adaptability is the most promising feature to be applied in future robust multimedia applications. In this paper, we propose the Direct Algorithm to improve the degree of satisfaction at heterogeneous receivers in multi-layered multicast video environments. The algorithm relies on a mechanism that dynamically controls the rates of the video layers and is based on feedback control packets sent by the receivers. The algorithm also addresses scalability issues by implementing a merging procedure at intermediate nodes in order to avoid packet implosion at the source in the case of large multicast groups. The proposed scheme is optimized to achieve high global video quality and reduced bandwidth requirements. We also propose the Direct Algorithm with a virtual number of layers. The virtual layering scheme induces intermediate nodes to keep extra states of the multicast session, which reduces the video degradation for all the receivers. The results show that the proposed scheme leads to improved global video quality at heterogeneous receivers with no cost of extra bandwidth.

• 한국멀티미디어학회논문지
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• 제23권12호
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• pp.1540-1551
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• 2020

Aiming at the problem that the existing human behavior recognition algorithm cannot fully utilize the multi-level spatio-temporal information of the network, a human behavior recognition algorithm based on a dense three-dimensional residual network is proposed. First, the proposed algorithm uses a dense block of three-dimensional residuals as the basic module of the network. The module extracts the hierarchical features of human behavior through densely connected convolutional layers; Secondly, the local feature aggregation adaptive method is used to learn the local dense features of human behavior; Then, the residual connection module is applied to promote the flow of feature information and reduced the difficulty of training; Finally, the multi-layer local feature extraction of the network is realized by cascading multiple three-dimensional residual dense blocks, and use the global feature aggregation adaptive method to learn the features of all network layers to realize human behavior recognition. A large number of experimental results on benchmark datasets KTH show that the recognition rate (top-l accuracy) of the proposed algorithm reaches 93.52%. Compared with the three-dimensional convolutional neural network (C3D) algorithm, it has improved by 3.93 percentage points. The proposed algorithm framework has good robustness and transfer learning ability, and can effectively handle a variety of video behavior recognition tasks.

• 전기전자학회논문지
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• 제25권4호
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• pp.650-663
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• 2021

Subsurface topology estimation is an important factor in the geophysical survey. Electrical impedance tomography is one of the popular methods used for subsurface imaging. The EIT inverse problem is highly nonlinear and ill-posed; therefore, reconstructed conductivity distribution suffers from low spatial resolution. The subsurface region can be approximated as piece-wise separate regions with constant conductivity in each region; therefore, the conductivity estimation problem is transformed to estimate the shape and location of the layer boundary interface. Each layer interface boundary is treated as an open boundary that is described using front points. The subsurface domain contains multi-layers with very complex configurations, and, in such situations, conventional methods such as the modified Newton Raphson method fail to provide the desired solution. Therefore, in this work, we have implemented a 7-layer artificial neural network (ANN) as an inverse problem algorithm to estimate the front points that describe the multi-layer interface boundaries. An ANN model consisting of input, output, and five fully connected hidden layers are trained for interlayer boundary reconstruction using training data that consists of pairs of voltage measurements of the subsurface domain with three-layer configuration and the corresponding front points of interface boundaries. The results from the proposed ANN model are compared with the gravitational search algorithm (GSA) for interlayer boundary estimation, and the results show that ANN is successful in estimating the layer boundaries with good accuracy.