• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.4
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• pp.15-21
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• 2008

Secondary electron detectors used in scanning electron microscope accept secondary electrons emitted from the specimen and convert them to an electrical signal that, after amplification, is used to modulate the gray-level intensities on a cathode ray tube, producing an image of the specimen. In order to acquire images with good qualities, as many secondary electrons as possible should be reached to the detector. To realize this it is very important to select an appropriate mounting position and angle of the detector inside the chamber of scanning electron microscope. In this paper, a number of numerical simulations are performed to explore the relationships between detection rates of secondary electrons and the values of some parameters, such as distances between the detector and sample, relative mounting positions of scintillator positioned inside the detector with respect to detector cover, two types of mounting angles of the detector. The relationships between detection rates and applied voltages to corona ring and faraday cage, and energies of secondary electrons are investigated as well.

• Transactions of the Korean Society of Mechanical Engineers
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• v.10 no.3
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• pp.305-315
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• 1986

Redesign of the mounting system to minimize vibration of a variable displacement engine through computer simulation is considered. A three degree of freedom model is established for an in-line four-cylinder automobile engine with a three point mounting system. The engine mount locations and angles, and isolator sizes are chosen as design parameters. Constraints on isolator deformations and design parameters are imposed. The gradient projection method is utilized for optimization. Simulation studies show significant vibration reduction can be obtained especially at idling speed.

• The Journal of the Acoustical Society of Korea
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• v.8 no.1
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• pp.38-47
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• 1989

The optimal mounting system for reciprocating comperssor supported on a flexible is designed. Four short hollow rubber cylinders are used as mounting pads, and so the thickness, diameter, height and location of the rubber mounts are considered as design parameters. The optimal mounts parameters which give the smallest force transmittance, are obtained by Constrained Rosenbrock Method.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.31B no.9
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• pp.112-123
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• 1994

In this paper, inspection and subpixed alignment algorithms of SMD's (Surface Mounting Devices) using fuzzy morphology are proposed. First, camera calibration is performed and then the inspection algorithm detects defects such as lead bending and breaking using the ruler generated by fuzy morphology. The SMD having no defects is tested whether it is mounted in the specified position or not. The proposed subpixel alignment algorithm detects accurately orientation and position using subpixel interpolation. It consists of two parts: preprocessing and main processing steps, in which corner points and coarse orientation of a SMD are detected, and interpolation is used to obtain final parameters with wubpixel accuracy. The computer simulation shows that the proposed algorithms give more accurate parameters, and they can be applied to fast and accurate automatic surface mounting systems.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.32 no.3
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• pp.205-216
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• 2014

Multi-camera systems have been widely used as cost-effective tools for the collection of geospatial data for various applications. In order to fully achieve the potential accuracy of these systems for object space reconstruction, careful system calibration should be carried out prior to data collection. Since the structural integrity of the involved cameras' components and system mounting parameters cannot be guaranteed over time, multi-camera system should be frequently calibrated to confirm the stability of the estimated parameters. Therefore, automated techniques are needed to facilitate and speed up the system calibration procedure. The automation of the multi-camera system calibration approach, which was proposed in the first part of this paper, is contingent on the automated detection, localization, and identification of the object space signalized targets in the images. In this paper, the automation of the proposed camera calibration procedure through automatic target extraction and labelling approaches will be presented. The introduced automated system calibration procedure is then implemented for a newly-developed multi-camera system while considering the optimum configuration for the data collection. Experimental results from the implemented system calibration procedure are finally presented to verify the feasibility the proposed automated procedure. Qualitative and quantitative evaluation of the estimated system calibration parameters from two-calibration sessions is also presented to confirm the stability of the cameras' interior orientation and system mounting parameters.

• Journal of the Korean Society of Industry Convergence
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• v.2 no.2
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• pp.131-137
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• 1999

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

• Journal of KSNVE
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• v.11 no.1
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• pp.36-40
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• 2001

In this paper, an integrated system for dynamic analysis and optimal design of engine mount systems is presented. The system can simulate static and dynamic behaviors of engine mount systems and optimize design parameters such as mount stiffness, mounting locations with desired design targets of frequency or displacement. A FF-engine with an automatic transmission is used to demonstrate the analysis and optimal design capabilities of the proposed design system.

• 제어로봇시스템학회:학술대회논문집
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• 1994.10a
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• pp.238-242
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• 1994

Shuster's algorithm for spin-axis determination is extended to include sensor bias and mounting angle as its solve-for parameters. The relation between direct and derived measurements bias is obtained by linearizing their kinematic equations. A one-step least-square estimation technique referred to as the 'closed form' solution is used, and the solution provides a more refined and decent initial guess for the subsequent filtering process contained within the differential correction module. The modified algorithm is applied for attitude determination of a GEO communication satellite in transfer orbit, and its results are presented.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.6
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.