• 한국재료학회:학술대회논문집
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• 한국재료학회 1996년도 재료학회 춘계학술발표회
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• pp.30-30
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• 1996

• 대한전자공학회논문지SD
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• 제41권11호
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• pp.29-34
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• 2004

본 논문에서는 molecular beam epitaxy (MBE)로 성장한 AlGaN/InGaN/GaN high electron-mobility transistors (HEMTs)의 선형성과 RF dispersion 특성을 조사하였다. 전극 길이가 0.5 ㎛인 AlGaN/InGaN HEMT는 최대 전류 밀도가 730mA/mm, 최대 전달정수가 156 mS/mm인 비교적 우수한 DC 특성과 함께, 기존의 AlGaN/GaN HEMT와는 달리 높은 게이트 전압에도 완만한 전류 전달 특성을 보여 선형성이 우수함을 나타내었다. 또한 여러 다른 온도에서 측정한 펄스 전류 특성에서 소자 표면에 존재하는 트랩에 의한 전류 와해 (current collapse) 현상이 발생되지 않음을 확인하였다. 이 연구 결과는 InGaN를 채널층으로 하는 GaN HEMT의 경우 선형성이 우수하고, 고전압 RF 동작조건에서 출력저하가 발생하지 않는 고출력 소자를 제작할 수 있음을 보여준다.

• 한국재료학회지
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• 제24권5호
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• pp.266-270
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• 2014

Aluminum nitride(AlN) films were grown on the C-face and on the Si-face of (0001) silicon carbide(SiC) substrates using plasma-assisted molecular-beam epitaxy(PA-MBE). This study was focused on first-stage growth manipulation prior to the start of AlN growth. Al pre-exposure, N-plasma pre-exposure, and simultaneous exposure(Al and N-plasma) procedures were used in the investigation. In addition, substrate polarity and, first-stage growth manipulation strongly affected the growth and properties of the AlN films. Al pre-exposure on the C-face and on the Si-face of SiC substrates prior to initiation of the AlN growth resulted in the formation of hexagonal hillocks on the surface. However, crack formation was observed on the C-face of SiC substrates without Al pre-exposure. X-ray rocking-curve measurements revealed that the AlN epilayers grown on the Si-face of the SiC showed relatively lower tilt and twist mosaic than did the epilayers grown on the C-face of the SiC. The results from the investigations reported in this paper indicate that the growth conditions on the Si-face of the SiC without Al pre-exposure was highly preferred to obtain the overall high-quality AlN epilayers formed using PA-MBE.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.70-70
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• 2010

일차원 나노구조를 갖는 재료는 크기효과 뿐만 아니라 단결정성, 일차원성으로 인해 새로운 물리적, 화학적 성질과 높은 표면적-부피비 등으로 인하여 많은 관심의 대상이 되고 있다. 일차원 나노구조 중에 특히 GaAs 나노와이어의 경우, 미래의 전자 소자 혹은 광자 소자로서의 잠재력 때문에 많은 연구가 이루어지고 있다. GaAs 나노와이어는 MOCVD(Metal-Organic Chemical Vapor Deposition), CBE(Chemical Beam Epitaxy), MBE(Molecular Beam Epitaxy)등의 방법으로 성장시킬 수 있다. 본 연구에서는 아크 방전법으로 합성한 단일벽 탄소나노튜브 템플릿 위에 GaAs를 MBE로 성장시켜 다공성의 GaAs-탄소나노튜브 복합체를 제작하였다. GaAs는 성장온도를 $400^{\circ}{\sim}600^{\circ}C$ 사이로 변화시켜 성장시켰다. 성장온도가 $500^{\circ}C$ 미만일 경우에는 GaAs가 탄소나노튜브 위에서 입상구조로 성장이 되었으며 $500^{\circ}C$ 이상에서는 탄소나노튜브 위에 나노와이어가 성장되었다. 또한, 제작된 GaAs-탄소나노튜브 복합체를 전자 소스로서의 응용가능성을 보기 위해 전계 방출 특성을 측정하였다.

• 한국산학기술학회논문지
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• 제11권2호
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• pp.409-413
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• 2010

실리콘 기판에 GaN 에피성장을 확인하기 위해, P형 Si(100) 기판 전면에 버퍼층으로 10 nm 두께의 코발트실리사이드를 형성시켰다. 형성된 코발트실리사이드 층을 HF로 크리닝하고, PA-MBE (plasma assisted-molecular beam epitaxy)를 써서 저온에서 500 nm의 GaN를 성막하였다. 완성된 GaN은 광학현미경, 주사탐침현미경, TEM, HR-XRD를 활용하여 특성을 확인하였다. HF 크리닝을 하지 않은 경우에는 GaN 에피택시 성장이 진행되지 않았다. HF 크리닝을 실시한 경우에는 실리사이드 표면의 국부적인 에칭에 의해 GaN성장이 유리하여 모두 GaN $4\;{\mu}m$ 정도의 두께를 가진 에피택시 성장이 진행되었다. XRD로 GaN의 <0002> 방향의 결정성 (crsytallinity)을 $\omega$-scan으로 판단한 결과 Si(100) 기판의 경우 2.7도를 보여 기존의 사파이어 기판 정도로 우수할 가능성이 있었다. 나노급 코발트실리사이드를 버퍼로 채용하여 GaN의 에피성장이 가능할 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.115-115
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• 2009

Epitaxial ZnO film was grown on Si(111) substrate with oxidazed CrN buffer by plasma-assisted molecular beam epitaxy (PAMBE). The growth and structural properties are investigated. The single crystalline growth was revealed by in-situ RHEED analysis. Crystalline quality of ZnO film grown on oxidized CrN buffer was investigated by the X-ray rocking curves. The FWHMs of (0002) XRCs was $1.379^{\circ}$. This value was smaller than the ZnO film grown directly on (111) Si substrate.

• 전자공학회논문지A
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• 제30A권8호
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• pp.81-87
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• 1993

The growth thickness uniformity of epitaxial layers deposited using a moiecular beam epitaxy system is calculated from the arrangement of molecular beam source and the substrate and the geometric dimensions of the crucible in order to predict the optimum design conditions of the prototype MBE system. The thickness uniformity better than 5% over a 3-inch wafer can be obtained by keeping the distance between the substrate and the crucible's orifice longer than 20cm, the tapering angle of the crucible larger than 6$^{\circ}$, and the angle between the normal to the substrate at the center and the crucible axis as larger as possible. In addition, the growth yield decreases to below 51% as the distance between the substrate and the orifice becomes longer than 25cm.

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1996년도 The 9th KACG Technical Annual Meeting and the 3rd Korea-Japan EMGS (Electronic Materials Growth Symposium)
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• pp.508-508
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• 1996

;The growth of films have considerable interest in the field of superlattice structured multi-layer epitaxy led to realization of new devices concepts. Molecular beam epitaxy (MBE) with in situ observation by reflection high-energy electron diffraction (RHEED) is a key technology for controlled layered growth on the atomic scale in oxide crystal thin films. Also, the combination of radical oxygen source and MBE will certainly accelerate the progress of applications of oxides. In this study, the growth process of single crystal films using by MBE method is discussed taking the oxide materials of Bi-Sr-Ca-Cu family. Oxidation was provided by a flux density of activated oxygen (oxygen radicals) from an rf-excited discharge. Generation of oxygen radicals is obtained in a specially designed radical sources with different types (coil and electrode types). Molecular oxygen was introduced into a quartz tube through a variable leak valve with mass flowmeter. Corresponding to the oxygen flow rate, the pressure of the system ranged from $1{\;}{\times}{\;}10^{-6}{\;}Torr{\;}to{\;}5{\;}{\times}{\;}10^{-5}$ Torr. The base pressure was $1{\;}{\times}{\;}10^{-10}$ Torr. The growth of Bi-oxides was achieved by coevaporation of metal elements and oxygen. In this way a Bi-oxide multilayer structure was prepared on a basal-plane MgO or $SrTiO_3$ substrate. The grown films compiled using RHEED patterns during and after the growth. Futher, the exact observation of oxygen radicals with MBE is an important technology for a approach of growth conditions on stoichiometry and perfection on the atomic scale in oxide. The oxidization degree, which is determined and controlled by the number of activated oxygen when using radical sources of two types, are utilized by voltage locked loop (VLL) method. Coil type is suitable for oxygen radical source than electrode type. The relationship between the flux of oxygen radical and the rf power or oxygen partial pressure estimated. The flux of radicals increases as the rf power increases, and indicates to the frequency change having the the value of about $2{\times}10^{14}{\;}atoms{\;}{\cdots}{\;}cm^{-2}{\;}{\cdots}{\;}S^{-I}$ when the oxygen flow rate of 2.0 seem and rf power 150 W.150 W.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1994년도 춘계 학술발표 강연 및 논문 개요집
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• pp.127-127
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• 1994

• 한국전기전자재료학회논문지
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• 제19권7호
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• pp.605-610
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• 2006

We have investigated $Al_{0.25}Ga_{0.75}As/In_{0.2}Ga_{0.8}As$ structures for pseudomorphic high electron mobility transistor(pHEMT), which were grown by molecular beam epitaxy(MBE) and consequently annealed by rapid thermal anneal(RTA), using Hall measurement, photoluminescence, and transmission electron microscopy (TEM). According to intensity and full-width at half maximum maintained stable at the same energy level, the quantized energy level in $Al_{0.25}Ga_{0.75}As/In_{0.2}Ga_{0.8}As$ quantum wells was independent of the RTA conditions. However, the Hall mobility was decreased from $6,326cm^2/V.s\;to\;2,790cm^2/V.s\;and\;2,078cm^2/V.s$ after heat treatment respectively at $500^{\circ}C\;and\;600^{\circ}C$. The heat treatment which is indispensable during the fabrication procedure would cause catastrophic degradation in electrical transport properties. TEM observation revealed atomically non-uniform interfaces, but no dislocations were generated or propagated. From theoretical consideration about the mobility changes owing to inter-diffusion, the degraded mobility could be directly correlated to the interface scattering as long as samples were annealed below $600^{\circ}C$ lot 1 min.