• 제목/요약/키워드: Mold Filling Process

검색결과 212건 처리시간 0.028초

국부가압 다이캐스팅 공정에서 3차원 유동 및 응고해석을 통한 자동차 변속기 Gear Housing의 주조방안 설계 최적화 (Optimization of Casting Design for Automobile Transmission Gear Housing by 3D Filling and Solidification Simulation in Local Squeeze Diecasting Process)

  • 박진영;김억수;박용호;박익민
    • 한국재료학회지
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    • 제16권11호
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    • pp.668-675
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    • 2006
  • In the partial squeeze casting process, the filling behavior of liquid metal and solidification pattern in thick area have significant influence on the quality of casting products and die life. For the optimal casting design of automobile transmission gear housing, various analyses were performed in this study by using computer simulation code, MAGMAsoft and the simulation results were compared and analyzed with experimental results. By air pressure criteria, internal porosities caused by air entrap during the mold filling were predicted and reduced remarkably by modification of gating system. Also, optimal squeeze-time lag to apply partial squeeze pin in thick area was calculated and the castings was free from shrinkage defects with the result of solidification analysis. Consequently, casting design for automobile transmission gear housing was optimized and approved by Computer Tomography.

개선된 회전형 레올로지 측정법을 이용한 박형 반도체 패키지 내에서의 3차원 몰드 유동현상 연구 (Full Three Dimensional Rheokinetic Modeling of Mold Flow in Thin Package using Modified Parallel Plate Rheometry)

  • 이민우;유민;유희열
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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    • pp.17-20
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    • 2003
  • The EMC's rheological effects on molding process are evaluated in this study. When considering mold processing for IC packages, the major concerning items in current studies are incomplete fill, severe wire sweeping and paddle shifts etc. To simulate EMC's fast curing rheokinetics with 3D mold flow behavior, one should select appropriate rheometry which characterize each EMC's rheological motion and finding empirical parameters for numerical analysis current studies present the new rheometry with parallel plate rheometry for reactive rheokinetic experiments, the experiment and numerical analysis is done with the commercial higher filler loaded EMC for the case of Thin Quad Plant Packages (TQFP) with package thickness below 1.0 mm. The experimental results and simulation results based on new rheometry matches well in point of the prediction of wire sweep, filling behavior of melt front advancement and void trapping position.

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사출성형시 보압이 냉각시간에 미치는 영향 (Effects of holding pressure affecting cooling time in injection molding)

  • 문영배;최윤식;정영득
    • Design & Manufacturing
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    • 제2권1호
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    • pp.39-43
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    • 2008
  • There occur not only many problems in the injection process but also low quality productivity due to the injection conditions of various injection factors. Injection molding process factors such as molding temperature, injection pressure, flow rate and flow velocity, must be controlled properly in filling and packing phases in the injection molding process. In this study, effects of these factors on the injection molding were investigated through the flow analysis for the holding pressure affecting cooling time. Results of this study would be helpful to setting of holding pressure for optimization of forming condition in order to reduce cooling time in injection molding.

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3차원 적응 격자 세분화를 이용한 주조 공정의 충전 해석 (Three Dimensional Finite Element Analysis of Filling Stage in Casting Process Using Adaptive Grid Refinement Technique)

  • 김기돈;정준호;양동열
    • 대한기계학회논문집B
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    • 제29권5호
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    • pp.568-576
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    • 2005
  • A 3-D finite element model combined with a volume tracking method is presented in this work to simulate the mold filling for casting processes. Especially, the analysis involves an adaptive grid method that is created under a criterion of element categorization of filling states and locations in the total region at each time step. By using an adaptive grid wherein the elements, finer than those in internal and external regions, are distributed at the surface region through refinement and coarsening procedures, a more efficient analysis of transient fluid flow with free surface is achieved. Adaptive grid based on VOF method is developed in tetrahedral element system. Through a 3-D analysis of the benchmark test of the casting process, the efficiency of the proposed adaptive grid method is verified. Developed FE code is applied to a typical industrial part of the casting process such as aluminum road wheel.

마이크로 채널 충전 과정의 유동 현상(I) - 유동 가시화 실험 - (Flow Phenomena in Micro-Channel Filling Process (I) - Flow Visualization Experiment -)

  • 김동성;이광철;권태헌;이승섭
    • 대한기계학회논문집A
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    • 제26권10호
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    • pp.1982-1988
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    • 2002
  • Micro-injection molding and microfluidic devices with the help of MEMS technologies including the LIGA process are expected to play important roles in micro-system industries, in particular the bio-application industry, in the near future. Understanding fluid flows in micro-channels is important since micro-channels are typical geometry in various microfluidic devices and mold inserts for micro-injection molding. In the present study, Part 1, an experimental investigation has been carried out to understand the detailed flow phenomena in micro-channel filling process. Three sets of micro-channels of different thickness (40um,30um and 2011m) were fabricated using SU-8 on silicon wafer substrate. And a flow visualization system was developed to observe the filling flow into the micro-channels. Experimental flow observations are extensively made to find the effects of pressure, inertia force, viscous force and surface tension. A dimensional analysis for experimental results was carried out and several relationships A dimensionless parameters are obtained.

Investigation of the numerical analysis for the ultrasonic vibration in the injection molding

  • Lee, Jae-Yeol;Kim, Nak-Soo
    • Korea-Australia Rheology Journal
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    • 제21권1호
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    • pp.17-25
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    • 2009
  • We studied the flow characteristics of the polymer melt in the injection molding process with ultrasonic vibration by using the numerical analysis. To minimize the error between the experimental data and numerical result, we presented a methodology using the design of experiments and the response surface method for reverse engineering. This methodology can be applied to various fields to obtain a valid and accurate numerical analysis. Ultrasonic vibration is generally applied between an extruder and the entrance of a mold for improvement the flow rate in injection molding. In comparison with the general ultrasonic process, the mode shape of the mold must be also considered when the ultrasonic vibration is applied on the mold. The mode shape is defined as the periodic and spatial deformation of the structure owing to the effect of the vibration, and it varies greatly according to vibration conditions such as the forcing frequency. Therefore, we considered new index and found the forcing frequency for obtaining the highest flow rate within the range from 20 to 60 kHz on the basis of the index. Ultimately, we presented the methodology for not only obtaining a valid and accurate numerical analysis, but also for finding the forcing frequency to obtain the highest flow rate in injection molding using ultrasonic vibration.

소형 LCD 도광판의 사출성형에 관한 연구 (1) : 유한요소해석 및 금형설계 (A Study on the Injection Molding for the tight Guide Plate of a Small Sized LCD (1) : finite Element Analysis and Mold Design)

  • 이호상
    • 소성∙가공
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    • 제11권4호
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    • pp.332-340
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    • 2002
  • The light guide plate of the TFT-LCD reflects the light originated from the light source, and guides the light to the front side of LCD so that we can see images vividly. This paper is concerned with tile injection molding of the light guide plate for the reflective typed LCD related to IMT-2000. The finite element analysis has been carried out based on the pine stress theory to predict both the thermal stresses of the products in the post-filling stage and the in-plane deformation behavior of the products after ejection process. Based on the simulation results, the mold for the light guide plate of a 2inch sized LCD has been designed.

마이크로 패턴을 가진 초박육 사출성형의 성형성 개선 (Improvement of Moldability for Ultra Thin-Wall Molding with Micro-Patterns)

  • 윤재호;박근;권오경
    • 대한기계학회논문집A
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    • 제31권5호
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    • pp.556-561
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    • 2007
  • The rapid thermal response(RTR) molding is a novel process developed to raise the temperature of mold surface rapidly in the injection stage and then cool rapidly to the ejection temperature by air or water. The objectives of this paper are to investigate the effect of mold temperature, pressure and thickness of micro pattern molding and to provide a optimization of RTR injection molding for micro pattern from Moldflow simulation. Optimal minimum temperature and pressure was found without shortcut according to thickness. Filling percentage was influenced by glass transition temperature with the kinds of resin. Optimal temperature is slightly higher than glass transition temperature irrespectively of pressure, thickness, the kinds of resin in the micro pattern molding.

사출성형 공정에서 비정상 흐름에 의한 Mold Filling 현상 (Analysis of Mold Filling Associated with Unsteady Flow in Injection Molding Process)

  • 류민영;신희철;배유리
    • 폴리머
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    • 제24권4호
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    • pp.545-555
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    • 2000
  • 사출성형에서 수지의 불안정한 흐름에 의해 성형품에 표면결함이 발생되는데 이는 gate의 치수, 운전조건 그리고 고분자 용융물의 유변학적 성질과 밀접한 관련이 있다. 본 연구에서는 PC, PBT, 그리고 PC/ABS alloy에 대해 다양한 사출속도에서 성형품의 표면결함의 형성에 대해서 조사하였다. 표면결함의 형성을 조사하기 위해 여러 가지 cavity 모양, 즉 기계적 물성 측정에 쓰이는 인장, 굴곡 그리고 충격시편의 형상을 이용하여 이들의 cavity와 gate의 두께를 다양하게 하여 실험하였다. 본 연구를 통해 사출성형의 충진 과정에서 letting에 의한 표면결함은 die swell과 die swell의 지연에 크게 영향을 받음을 관찰할 수 있었다. 큰 die swell은 jetting을 없애는데 유리하나 die swell의 지연이 커지면 jetting을 촉진시킨다. Cavity와 gate의 두께 비를 작게 하면 수지의 종류에 관계없이 jetting과 표면결함을 줄이거나 없앨 수 있다. 또한 작은 두께비는 사출성형에서 고분자 용융물의 안정된 흐름을 유지시키기 위할 작업 조건들의 선택의 폭을 넓게 하여 준다.

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복합격자법을 이용한 수지이동성형의 충전공정에 대한수치모사 (Simulation for the Filling Process of Resin Transfer Molding by Incorporating Composity Grids)

  • 이성재
    • 유변학
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    • 제9권3호
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    • pp.103-110
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    • 1997
  • 고분자 복합재료 제조방법의 하나인 수지이동성형의 충전공정을 모사하기 위한 수 치모사 코드를 개발하였다. 수지이동성형의 충정공정문제를 수학적 공식으로 표현하기 위하 여 비등방성 다공질체를 통과하는 유동에 대한 이론을 사용하였다. 과도상태로 진행하는 자 유표면의 동적 충전거동을 묘사하기 위하여 수치격자 생성을 포괄하는 경계적합 좌표계의 계산기법을 적용하였다. 이와 아울러 불규칙적인 구저와 다중으로 연결된 금형면의 충전모 사에 저합한 복합격자의 개념을 도입하였다. 복합격자들 간의 가상의 경계에 대해서는 검사 체적 기법을 이용하여 물질보존을 만족시켜 주었다. 임의의 금형 두께와 투과도를 가지는 다수의 금형면이 결합된 두 개의 입구를 지닌 금형을 대상으로 하여 몇가지 예를 시험해 보 았다. 수치모사의결과 복합격자의 개념을 도입한 수치모사 코드는 수지이동성형의 복잡한 충전공정을 보다 정교하게 모사하는데 응용될수 있음을 보여주었다.

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