• 한국기계가공학회지
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• 제8권2호
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• pp.53-59
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• 2009

The analysis of injection molding process by CAE is widely used in development of plastic products. That comes from the fact that CAE analysis can reduce trial and error based on optimized design. On this study, by use of MOLDFLOW, the causes of product defects were found and solved by trade-off study. CAE analysis includes Flow-Cool-Warpage Analyses and finally a new mold-die design with better product quality was suggested. On injection molding of round-shaped plastic fan, new mold-die system with 4-tunnel gates located on the edge of a fan disc shows better quality rather than pin-point gate located on the center of a disc. That was effective in terms of flow mark removal and flatness improvement of the product.

• Design & Manufacturing
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• 제18권2호
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• pp.41-50
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• 2024

In this study, experimental design methods were used to derive optimal process conditions for improving the thickness uniformity of a 0.40 mm, 3.5 inch light guide panel. Process mapping and expert group analysis were used to identify factors that influence the thickness of injection molded products. The key factors identified were mold temperature, mold temperature, injection speed, packing pressure, packing time, clamp force, and flash time. Considering the resin manufacturer's recommended process conditions and the process conditions for similar light guide plates, a three-level range was selected for the identified influencing factors. L27 orthogonal array process conditions were generated using the Taguchi method. Injection molding was performed using these L27 orthogonal array to mold the 3.5 inch light guide plates. Thickness measurements were then taken, and the results were analyzed using the signal-to-noise ratio to maximize the CpK value, leading to the determination of the optimal process conditions. The thickness uniformity of the product was analyzed by applying the derived optimum process conditions. The results showed a 97.5% improvement in the Cpk value of 3.22 compared to the process conditions used for similar light guide plates.

• 정보저장시스템학회:학술대회논문집
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• 정보저장시스템학회 2005년도 추계학술대회 논문집
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• pp.17-21
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• 2005

High-density image sensors have microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using W transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.

• 정보저장시스템학회논문집
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• 제2권2호
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• pp.91-95
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• 2006

High-density image sensors rave microlens array to improve photosensitivity. It is conventionally fabricated by reflow process. The reflow process has some weak points. UV imprinting process can be proposed as an alternative process to integrate microlens array on photodiodes. In this study, the UV imprionting process to integrate microlens array on image sensor was developed using UV transparent flexible mold and simulated image sensor substrate. The UV transparent flexible mold was fabricated by replicating master pattern using siliconacrylate photopolymer. The releasing property and shape accuacy of siliconacrylate mold was analysed. After UV imprinting process, replication quality and align accuracy was analysed.

• 소성∙가공
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• 제16권2호
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• pp.113-119
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• 2007

Rapid mold heating has been recent issue to enable the injection molding of thin-walled parts or micro/nano structures. Induction heating is an efficient way to heat material by means of an electric current that is caused to flow through the material or its container by electromagnetic induction. It has various applications such as heat treatment, brazing, welding, melting, and mold heating. The present study covers a finite element analysis of the induction heating process which can rapidly raise mold temperature. To simulate the induction heating process, the electromagnetic field analysis and transient heat transfer analysis are required collectively. In this study, a coupled analysis connecting electromagnetic analysis with heat transfer simulation is carried out. The estimated temperature changes are compared with experimental measurements for various heating conditions.

• Progress in Superconductivity
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• 제7권1호
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• pp.97-101
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• 2005

Bi-22l2 tubes for fault current limiter (FCL) were fabricated by centrifugal melting process. $SrSO_4$ ($10\;wt.\;\%$) was added to Bi-2212 powder to lower the melting point of Bi-22l2 and to improve the mechanical properties. The BSCCO powder was completely melted at $1300\;^{\circ}C$ using the RF furnace and then poured into rotating steel mold. The steel mold, preheated at $450\;{\circ}C{\sim}550^{\circ}C$ for 2 hour was rotated at $1020{\sim}2520\;RPM$. The solidified BSCCO tube was cooled down to room temperature in the furnace for 48 hours and separated from the mold between Bi-2212 and the mold. $ZrO_2$ solution was used to separate it easily from the mold and Ag tape was attached in the mold inner wall of the mold to analysis electrical property. Bi-22l2 tube was often cracked when the cooling rate was high. BSCCO tubes with $70{\Phi}{\times}100\;mm,\;50{\Phi}{\times}100\;mm$ and $30{\Phi}{\times}150\;mm$ size were fabricated by centrifugal melting process. The $J_{c}s$ of tubes with $50{\Phi}{\times}100\;mm{\times}4.0\;t$ and $50{\Phi}{\times}100\;mm{\times}4.l\;t$ were 178 and $74.2\;A/cm^2$ at 77K, respectively. The processing condition for Bi-2212 tube fabrication was investigated using XRD and SEM analyses.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.17-20
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• 2003

The EMC's rheological effects on molding process are evaluated in this study. When considering mold processing for IC packages, the major concerning items in current studies are incomplete fill, severe wire sweeping and paddle shifts etc. To simulate EMC's fast curing rheokinetics with 3D mold flow behavior, one should select appropriate rheometry which characterize each EMC's rheological motion and finding empirical parameters for numerical analysis current studies present the new rheometry with parallel plate rheometry for reactive rheokinetic experiments, the experiment and numerical analysis is done with the commercial higher filler loaded EMC for the case of Thin Quad Plant Packages (TQFP) with package thickness below 1.0 mm. The experimental results and simulation results based on new rheometry matches well in point of the prediction of wire sweep, filling behavior of melt front advancement and void trapping position.

• Design & Manufacturing
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• 제8권1호
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• pp.31-34
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• 2014

The Injection molding is used more than 70% of total production in plastic products. The injection molding process has 4 processes such as filling, packing, cooling and ejecting. It spends most of times in the cooling process. Therefore, it is important to control the mold temperature in producing plastic products. The cooling system and time affect the product's quality and productivity. Especially, cooling time has about 60% of total injection cycle time. Therefore, we can improve a productivity by shortening cooling time. In this study, the rapid cooling system was developed and performed a efficiency test. This system could refrigerate coolant to $1^{\circ}C$ and had to need 10 minutes for normal operating. However, if response time of temperature controller and sensor will be increased, the performance of this system will increase.

• 한국CDE학회논문집
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• 제5권1호
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• pp.50-60
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• 2000

XML and CORBA have vast potential to improve software interoperability and to facilitate data exchange across applications and people from various disciplines and vendors. This Paper describes a framework for the integration and validity evaluation of injection mold design problems in a network-oriented design environment, based on In and CORBA. An overview of the framework is provided and an application to a design phase of injection mold is illustrated. The example illustrates how design validities are notified and design directions are provided to the designer during design process.

• 한국정밀공학회지
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• 제18권3호
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• pp.75-83
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• 2001

RIM(Reaction Injection Molding) is a widely used method to manufacture middle-large size outfit-part for a prototype car. The main advantage of RIM is the capability of manufacturing a small number of prototype parts with less cost and lead time than injection molding which is the most popular method to manufacture plastic parts. Generally, epoxy resin and RTV(Room Temperature Vulcanization) silicon are used as mold materials for RIM, and the selection of mold materials is usually depended upon the industrial environment of manufactures and it decides overall mold making process and part quality. This paper suggests a new mold making process by consolidating the advantages of epoxy resin and RTV silicon based RIM mold to enhance the parts quality while reducing the manufacturing cost and time and shows the competitiveness of the suggested process compared with conventional methods.