• 대한기계학회논문집A
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• 제26권7호
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• pp.1302-1308
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• 2002

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) package are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed for several bending loads and temperatures. At the temperature higher than $100^{\circ}C$, the inelastic deformation in solder balls become more dominant, so that the bending of the molding compound decreases while temperature increases. The deformation caused by thermally induced bending is compared with that caused by mechanical bending. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder.

• Journal of Advanced Marine Engineering and Technology
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• 제12권4호
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• pp.32-45
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• 1988

The scanning moire method, in which the master grating is replaced by the scanning line of television camera and in which the moire pattern is obtained by thining out some scanning line, is discussed by the sampling theory. It is determined also by the sampling theory that relationship between the fringe pattern. The programs that analyze the strain by the scanning moire method have been developed. For the simulation model in which we are able to calculate analytically the distribution of strains, the scanning moire method is discussed. It is shown that the small strains and the large strains are analyzed from the same picture by the thinning out technique and that the accuracy of analysis is improved by change of the phase in the thinning out technique.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 춘계학술대회 논문집
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• pp.175-180
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• 1999

Generally, When we measure of object 3D surfaces with phase shifting shadow moire method, it is use of optical system consist of light source, grating, and ccd camera. At this time, it is important parameter that vertical distance of grating and camera, grating and light source, and horizontal distance of camera and light source. When use camera consist of complex lens vertical distance of grating and camera is unknown parameter. From this cause equivalent wave length of moire fringe is uncertain. In this study, We exactly obtain a vertical distance of grating and camera so improve on measurement accuracy.

• 대한기계학회논문집
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• 제3권4호
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• pp.164-172
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• 1979

Experimental and numerical results concerning the flat punch indentation to semi-infinite body with partially constrained free surface are presented The distributions of slip line directions are predicted by Moire fringe analysis using Vinckier's method. A mumerical study is made of the same problem by finite element method and the results are compared with the experimental results. It is shown that the contour feature of possible slip line field is similar to that of well-known Prandtl indentation sloution.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
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• pp.170-175
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• 1999

Noncontact measuring methodology of 3-dimensional profile using CCD camera are very attractive because of it's high measuring speed and its's high sensitivity. Especially, when projecting a grid pattern over the object the captured image have 3 dimensional information of the object. Projection moire extract 3-D information with another grid pattern in front of CCD camera. However phase measuring profilometry(PMP) obtain similar results without additional grid pattern. In this paper, new method for grid pattern generation system by polygonal mirror and Laser Diode. This system is applied the projection moire and the PMP.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.19-22
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• 2000

Noncontact measuring methodology of 3-dimensional profile using CCD camera are very attractive because of it's high measuring speed and its's high sensitivity. Especially, when projecting a grid pattern over the object the captured image have 3 dimensional information of the object. Projection moire extract 3-D information with another grid pattern in front of CCD camera. However phase measuring profilometry(PMP) obtain similar results without additional grid pattern. In this paper, new method for grid pattern generation system by polygonal mirror and Laser Diode. This system is applied the projection moire and the PMP.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.28-32
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• 2003

Thermo-mechanical behavior of a ceramic ball grid array(CBGA) package assembly and wire bond ball grid array(WB-PBGA) package assemblies are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation(warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. The locations of the critical solder ball in WB-PBGA package assemblies are documented.

• 대한기계학회논문집A
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• 제26권1호
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• pp.160-170
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• 2002

Many of aged and damaged concrete structure have been revitalized with composite reinforcement. Flexural behaviors of composite-patched concrete specimens are characterized by high-sensitivity moire interferometry. The three-mirror, four-beam interferometry system and a compact loading system are used for obtaining singe patterns representing whole-field contour maps of in-plane displacements. It is seen from the calibration test for the loading system that the measured bending displacement is in excellent agreement with the displacement calculated by the beam theory. The crack opening displacement as well as the bending and the horizontal displacement fur the notched and unnotched specimen are investigated. The results also show that the notched specimen reinforced by a composite sheet has sufficient stiffness and strength compared to the original concrete specimen.

• 대한기계학회논문집A
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• 제28권11호
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• pp.1646-1655
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• 2004

A description of the basic principles of moire interferometry leads to the design of a eight-mirror four-beam interferometer for obtaining fringe patterns representing contour-maps of in-Plane displacements. The technique is implemented by the optical system using an environmental chamber for submicro-displacement mesurement. In order to estimate the reliability and applicabili쇼 of the system developed, the measurement of coefficient of thermal expansion (CTE) for a aluminium block is performed. Consequently, the system is applied to the measurement of thermal deformation of a WB-PBGA package assembly. Temperature dependent analyses of global and local deformations are presented to study the effect of the mismatch of CTE between materials composed of the package assemblies. Bending displacements of the packages and average strains of solder balls are documented. Thermal induced displacements calculated by FEM agree quantitatively with experimental results.

• 대한조선학회지
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• 제7권2호
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• pp.27-40
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• 1970

The distribution of stress and strain in elastic stages is investigated by the experiments of two dimensional photoelastic coating and Moire fringe method. Center block type and cover plate type of fillet welds are used as specimens in the test. The results are as follows. 1) Center block type gets less uniform stress distribution than cover plate type. And its stress concentration factor, especially at root, is larger than that at toe. 2) When main plate and cover plate closely contact and it cause friction, stress concentration decreases more than that in case of slit. That is because stress can be transmitted on the contact surface. 3) When slit is made, the outside of fillet gets more stress than the inside of it. 4) While the plastic strain distribution of center block type reaches the maximum at root and differs very slightly from that under lower loading, the plastic strain distribution of cover plate type is inclined to get the maximum at the outside of fillet rather than at root. 5) When the plastic strain value of cover plate type is compared with that of center block type at toe and root, the relations between the former and the latter shows root<toe and root>toe. 6) Because stress distribution becomes changed according to loading, fracture angle cannot be estimated by the peaks of elastic stress distribution. 7) The strain distribution just before fracture can be found by Moire fringe method.