• 제목/요약/키워드: Modulus coefficient

검색결과 465건 처리시간 0.031초

Residual Stress and Elastic Modulus of Y2O3 Coating Deposited by EB-PVD and its Effects on Surface Crack Formation

  • Kim, Dae-Min;Han, Yoon-Soo;Kim, Seongwon;Oh, Yoon-Suk;Lim, Dae-Soon;Kim, Hyung-Tae;Lee, Sung-Min
    • 한국세라믹학회지
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    • 제52권6호
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    • pp.410-416
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    • 2015
  • Recently, a new $Y_2O_3$ coating deposited using the EB-PVD method has been developed for erosion resistant applications in fluorocarbon plasma environments. In this study, surface crack formation in the $Y_2O_3$ coating has been analyzed in terms of residual stress and elastic modulus. The coating, deposited on silicon substrate at temperatures higher than $600^{\circ}C$, showed itself to be sound, without surface cracks. When the residual stress of the coating was measured using the Stoney formula, it was found to be considerably lower than the value calculated using the elastic modulus and thermal expansion coefficient of bulk $Y_2O_3$. In addition, amorphous $SiO_2$ and crystalline $Al_2O_3$ coatings were similarly prepared and their residual stresses were compared to the calculated values. From nano-indentation measurement, the elastic modulus of the $Y_2O_3$ coating in the direction parallel to the coating surface was found to be lower than that in the normal direction. The lower modulus in the parallel direction was confirmed independently using the load-deflection curves of a micro-cantilever made of $Y_2O_3$ coating and from the average residual stress-temperature curve of the coated sample. The elastic modulus in these experiments was around 33 ~ 35 GPa, which is much lower than that of a sintered bulk sample. Thus, this low elastic modulus, which may come from the columnar feather-like structure of the coating, contributed to decreasing the average residual tensile stress. Finally, in terms of toughness and thermal cycling stability, the implications of the lowered elastic modulus are discussed.

2차원 QAM 신호에서 적응 등화를 위한 FC-MMA와 RMMA 알고리즘의 성능 평가 (Performance Evaluation of FC-MMA and RMMA Algorithm for Adaptive Equalization in 2-dimensional QAM Signals)

  • 임승각;강대수
    • 한국인터넷방송통신학회논문지
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    • 제16권5호
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    • pp.91-97
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    • 2016
  • 본 논문에서는 통신 채널에서 발생되는 찌그러짐에 의한 부호간 간섭을 보상하기 위한 FC-MMA (Fast Convergence-Multiple Modulus Algorithm)과 RMMA (Region based Multiple Modulus Algorithm) 등화 알고리즘의 성능을 평가하였다. 적응 등화를 위한 오차 신호를 얻기 위하여 FC-MMA 는 신호 심볼의 레벨수를 고려한 수정된 dispersion constant를 이용하지만, RMMA에서는 모든 신호점들이 존재하는 지역을 4개로 분할한 후 이를 기반으로 신호점을 축소한다. 이와 같이 오차 신호를 얻는 상이한 원리를 적용하여 적응 등화기의 탭 계수 갱신을 수행하게 되지만 이들은 각기 다른 등화 성능을 갖게 되므로, 논문에서는 이들의 성능을 컴퓨터 시뮬레이션을 통해 확인한다. 성능 비교를 위한 지수로는 등화기 출력 신호 성상도, 수렴 특성을 나타내는 잔류 isi, 최대 찌그러짐 및 채널의 신호대 잡음비에 따른 SER을 사용하였으며, 시뮬레이션 결과 RMMA는 정상 상태 이후 출력 신호 성상도와 잔류 isi 및 최대 찌그러짐과 SER 성능이 FC-MMA보다 우월하지만, 정상 상태에 도달하기 위한 수렴 속도에서는 FC-MMA가 빠름을 확인하였다.

Adaptive Modulus와 Adaptive Stepsize를 이용한 Hybrid-DSE-MMA 적응 등화 알고리즘의 성능 분석 (A Performance Analysis of Hybrid-DSE-MMA Adaptive Equalization Algorithm based on Adaptive Modulus and Adaptive Stepsize)

  • 임승각
    • 한국인터넷방송통신학회논문지
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    • 제21권4호
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    • pp.75-80
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    • 2021
  • 본 논문은 DSE-MMA (Dithered Sign Error-MMA) 적응 등화기에서 adaptive modulus와 adaptive stepsize를 이용하여 등화 성능을 개선할 수 있는 Hybrid-DSE-MMA에 관한 것이다. DSE-MMA는 탭 계수 갱신을 위한 오차 신호를 얻을 때 dither 신호를 부가한 후 이의 부호만을 이용하므로 SE-MMA의 외부 잡음에 대한 robustness 성능을 개선시키지만, 고정 modulus와 stepsize를 이용하므로 수렴 속도와 잔류 isi 성능이 저하되는 단점이 있다. 논문에서는 등화기 출력 신호의 전력에 비례하는 adaptive modulus와 adaptive stepsize를 DSE-MMA에 적용하므로서 저하되는 등화 성능을 개선할 수 있음을 컴퓨터 시뮬레이션을 통해 확인한다. 개선된 등화 성능을 기존 DSE-MMA와 비교하기 위하여 수신측에서의 등화기 출력 신호인 복원된 신호 성상도, 잔류 isi, MD (Maximum Distortion), MSE 및 외부 잡음에 대한 알고리즘의 강인성을 알 수 있는 SER 성능을 사용하였다. 컴퓨터 시뮬레이션 결과 Hybrid-DSE-MMA 알고리즘은 모든 잔류 isi와 MD, MSE 및 SER등의 모든 성능 지수에서 DSE-MMA 보다 개선 되지만 수렴 속도가 늦어짐을 알 수 있었다.

응력 분포에 따른 압전 유니모프 작동기의 성능 평가 (Performance Evaluation for Piezoelectric Unimorph Actuator with Stress Distribution)

  • 이종원;강래형;한재흥;정상준;고한영
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2008년도 춘계학술대회논문집
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    • pp.127-131
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    • 2008
  • This paper deals with the performance evaluation of piezoelectric unimorph actuator. In the unimorph design, the thickness ratio of substrate to piezoelectric material and the elastic modulus ratio of substrate to piezoelectric material are important parameters. There exists only one structural configuration that satisfies the optimal condition among them, and actuators using that configuration exhibit better actuating displacements. Another design parameter is the piezoelectric coefficient which can be improved due to the induced tensile stress and voltages. The application of the tensile stress to the piezoelectric material makes it get higher piezoelectric coefficient and the total displacement performance of the unimorph actuator is improved. Finally, the piezoelectric actuator system with spring elements is fabricated and it shows higher actuating displacement capability.

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유한요소 해석을 이용한 현장 콘크리트 부착강도 측정조건 (Measurement Conditions of Concrete Pull-off Test in Field from Finite Element Analysis)

  • 김성환;정원경;권혁;김현오;이봉학
    • 산업기술연구
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    • 제22권A호
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    • pp.185-192
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    • 2002
  • The performance of old and the new concrete construction depends upon bond strength between old and the new concrete. Current adhesive and strength measurement method ignores the effect of stress concentration from shape of specimens. Therefore, this research calculates stress concentration coefficient as the ratio of drilling depth to drilling diameter($h_s/D$), the ratio of overlay thickness to drilling diameter($h_0/D$), the ratio of steel disk thickness to drilling diameter(t/D), the ratio of overlay elastic modulus to substrate modulus($E_1/E_0$), the distance from core to corner border(L_$_{corner}$) and the distance between cores(L_$_{coic}$) vary. The finite element method is adapted to analysis The results from 'the F.E.M analysis are as follows. The stress concentration effects can be minimized when the ratio of drilling depth to drilling diameter($h_s/D$) is 0.20~0.25, the elastic modulus ratio($E_1/E_0$) is 06~1.0, and the ratio of steel disk thickness to drilling diameter(t/D) is 3.0. The overlay thickness, the distance from specimens to corner border(L_$_{corner}$), the distance between cores(L_$_{coic}$) almost do not affect to the stress concentration.

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Effect of Slab-base Friction on Response of JCP Slab with Different Material and Geometric Properties

  • Sun, Ren-Juan;Lim, Jin-Sun;Jeong, Jin-Hoon
    • 한국방재학회 논문집
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    • 제7권5호
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    • pp.99-110
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    • 2007
  • A single slab concrete pavement has been modeled and analyzed by ABAQUS program. The stress and displacement of the JCP slab under traffic load with frictionless contact interaction between slab and base calculated by ABAQUS program have been compared with the results obtained by KENSLABS program. The results of the stresses of the two modeling show similar tendency and the difference of the two modeling is very small however the results of the displacement of the two modeling show some dissimilarity. In order to analyze the effects of material and geometric properties on the responses of slab, some varying parameters were chosen as input for the modeling. The changing parameters include the thickness and elastic modulus of the concrete slab, the thickness and elastic modulus of base and the elastic modulus of the subgrade. The contact interaction between the slab and base layer had been also studied and different friction coefficient 0, 2.5, 6.6, 7.5, 8.9 had been used to simulate the different friction interface condition. The results of the analysis showed that the responses of the concrete slab vary with the material and geometric properties of the pavement structure and the slab-base friction condition.

Effect of Guar Gum on Rheological Properties of Acorn Flour Dispersions

  • Yoo, Byoung-Seung;Shon, Kwang-Joon;Chang, Young-Sang
    • Food Science and Biotechnology
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    • 제14권2호
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    • pp.233-237
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    • 2005
  • Rheological properties of acorn flour-guar gum mixtures (4% w/w) at different guar gum concentrations (0, 0.2, 0.4, 0.6, and 0.8% w/w) were evaluated in steady and dynamic shear. The acorn flour-guar gum mixtures at $25^{\circ}C$ showed high shear-thinning flow behavior (n= 0.20-0.27). Consistency index (K), apparent viscosity (${\eta}_{a,100}$), and Casson yield stress (${\sigma}_{oc}$) increased with the increase in guar gum concentration. Within the temperature range of $25-70^{\circ}C$, the {\eta}_{a,100}$ of mixtures obeyed the Arrhenius relationship with high determination coefficient ($R^2=\;0.974-0.994$). Activation energy values (5.37-6.77 kJ/mole) of acorn flour dispersions in the mixtures with guar gum (0.2-0.8%) were much lower than that (12.5 kJ/mole) of acorn flour dispersion (0% guar gum). Storage modulus (G'), loss modulus (G"), and complex viscosity (${\eta}^*$) increased with the increase in guar gum concentration. Dynamic rheological data of 1n (G', G") versus ln frequency (w) of guar gum-acorn flour mixtures had positive slopes with G' greater than G" over most of the frequency range, indicating that they exhibited weak gel-like behavior.

Effects of Silica Filler and Diluent on Material Properties of Non-Conductive Pastes and Thermal Cycling Reliability of Flip Chip Assembly

  • Jang, Kyung-Woon;Kwon, Woon-Seong;Yim, Myung-Jin;Paik, Kyung-Wook
    • 마이크로전자및패키징학회지
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    • 제10권3호
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    • pp.9-17
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    • 2003
  • In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

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Experimental & numerical investigation of mechanical properties in steel fiber-reinforced UHPC

  • Dadmand, Behrooz;Pourbaba, Masoud;Sadaghian, Hamed;Mirmiran, Amir
    • Computers and Concrete
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    • 제26권5호
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    • pp.451-465
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    • 2020
  • This paper presents experimental and numerical investigations on mechanical properties of ultra-high-performance fiber-reinforced concrete (UHPFRC) with four types of steel fibers; micro steel (MS), crimped (C), round crimped (RC) and hooked-end (H), in two fiber contents of 1% and 2% (by volume) and two lengths of 13 and 30 mm. Compression, direct tension, and four-point bending tests were carried out on four types of specimens (prism, cube, dog-bone and cylinder), to study tensile and flexural strength, fracture energy and modulus of elasticity. Results were compared with UHPC specimens without fibers, as well as with available equations for the modulus of elasticity. Specimens with MS fibers had the best performance for all mechanical properties. Among macro fibers, RC had better overall performance than H and C fibers. Increased fibers improved all mechanical properties of UHPFRC, except for modulus of elasticity, which saw a negligible effect (mostly less than 10%). Moreover, nonlinear finite element simulations successfully captured flexural response of UHPFRC prisms. Finally, nonlinear regression models provided reasonably well predictions of flexural load-deflection behavior of tested specimens (coefficient of correlation, R2 over 0.90).

Audio Data Hiding Based on Sample Value Modification Using Modulus Function

  • Al-Hooti, Mohammed Hatem Ali;Djanali, Supeno;Ahmad, Tohari
    • Journal of Information Processing Systems
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    • 제12권3호
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    • pp.525-537
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    • 2016
  • Data hiding is a wide field that is helpful to secure network communications. It is common that many data hiding researchers consider improving and increasing many aspects such as capacity, stego file quality, or robustness. In this paper, we use an audio file as a cover and propose a reversible steganographic method that is modifying the sample values using modulus function in order to make the reminder of that particular value to be same as the secret bit that is needed to be embedded. In addition, we use a location map that locates these modified sample values. This is because in reversible data hiding it needs to exactly recover both the secret message and the original audio file from that stego file. The experimental results show that, this method (measured by correlation algorithm) is able to retrieve exactly the same secret message and audio file. Moreover, it has made a significant improvement in terms of the following: the capacity since each sample value is carrying a secret bit. The quality measured by peak signal-to-noise ratio (PSNR), signal-to-noise ratio (SNR), Pearson correlation coefficient (PCC), and Similarity Index Modulation (SIM). All of them have proven that the quality of the stego audio is relatively high.