• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 심포지엄 논문집 정보 및 제어부문
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• pp.128-130
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• 2005

This paper proposes a modified IMC-PID controller that introduces controlling factor of the system identification to the standard IMC-PID controller in order to meet the design specifications such as gain, phase margin and maximum magnitude of sensitivity function in the frequency domain as well as the design specifications in time domain, settling, rising time and overshoot, and so on.

• Corrosion Science and Technology
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• 제23권5호
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• pp.383-392
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• 2024

The presence of transition metals V, Cr or Mn in a 55%Al-Zn based coating metal can modify the equilibrium intermetallic phase, τ5c, by diffusion of transition metals and substituting for iron in the τ5c phase. We experimentally confirmed the modification of the IMC phase using various analytical techniques to characterize IMC phases. Experimental results confirmed the formation of a modified τ5c-Al₂₀(Fe,V)₅Si₂(+Zn) intermetallic phase. The modified IMC phase showed periodic repeating layers with varying concentrations of V while still maintaining a constant (Fe+V)/Fe ratio within the homogeneity range of Fe in the equilibrium IMC phase. We proposed a reaction-diffusion mechanism for forming a modified IMC phase and a periodic layered structure. The initial reaction of the steel strip resulted in the formation of Fe₄Al₁₃ IMC phase. Al, Si, and Zn diffused and reacted with Fe₄Al₁₃ to form the equilibrium bcc phase, τ5c. The Fe₄Al₁₃ phase was consumed in the reaction, followed by diffusion of V into the newly formed phase by substitution of Fe by V, resulting in formation of the modified IMC phase. At 600 ℃, the τ5c phase could dissolve up to 4.13 wt% (2.73 at.%) V without changing its overall bcc crystal structure.

• 제어로봇시스템학회논문지
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• 제12권5호
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• pp.505-508
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• 2006

This paper presents a new analytical approach for designing multiloop PI controllers for disturbance rejection in multivariable processes with time delay. The proposed method is based on IMC-PID design approach. To overcome a sluggish load response by dominant pole in the process, the IMC filter is modified to compensate the dominant pole effect. Based on the modified IMC filter, an analytical tuning rule for multiloop PI controller is driven by extending the generalized IMC-PID method for single input/single output (SISO) systems [1] to multi input/multi output (MIMO) systems. Simulation results show that the proposed method gives a satisfactory load performance as well as servo performance in the multiloop system.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2006년도 춘계학술발표논문집
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• pp.348-351
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• 2006

This paper proposes a modified IMC-PID controller that introduces controlling factor of the system identification to the standard IMC-PID controller in order to meet the design specifications such as gain, phase margin and maximum magnitude of sensitivity function in the frequency domain as well as the design specifications in time domain, settling, rising time and overshoot, and so on.

• Journal of Astronomy and Space Sciences
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• 제24권3호
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• pp.235-248
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• 2007

이 연구는 통신해양기상위성의 영상위치유지 (Image Navigation and Registration, INR) 시스템의 시뮬레이션을 위한 프로그램을 개발하고, 영상오차보상(Image Motion Compensation, IMC) 알고리즘의 성능을 비교분석 하였다. 통신해양기상위성 궤도와 자세 요소를 모델링 하고 궤도오차와 자세오차를 계산하여 이러한 궤도 및 자세오차가 영상왜곡에 미치는 영향을 분석하였다. 또한 영상오차보상을 하지 않았을 경우와 GOES 위성의 영상오차보상 알고리즘을 적용하였을 경우, 그리고 선행 연구를 통해 개발되었던 개량된 영상오차보상 알고리즘을 적용하였을 경우의 영상들을 비교하여 각 알고리즘의 성능을 확인하였다. 개량된 영상오차보상 알고리즘은 GOES위성의 알고리즘보다 효율적으로 영상왜곡을 보상하였다. 이러한 연구는 통신해양기상위성의 INR시스템을 효과적으로 운용하고 그 성능을 향상시킬 수 있는 기술적 토대를 마련하는데 기여할 것이다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1990년도 추계학술대회 논문집 학회본부
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• pp.396-401
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• 1990

The objective is to explore design concept for MIESF(Modified Integral error and State Feedback) controller. A method is outlined for designing MIESF controller that provides robust performance despite real parameter uncertainties in the process model. Insight into the design process is gained by viewing the MIESF from the perspective of IMC(Internal Model Control).

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 자원리싸이클링
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• 제22권2호
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• pp.62-70
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• 2013

전기로 산화슬래그를 콘크리트용 잔골재로 사용하기 위해서는 제철소에서 제강과정에서 불안정한 용융상태의 제강슬래그를 에이징처리하여 안정된 구조로 변환시켜 이온이나 전자의 이동을 억제, 슬래그의 화학적 물리적 저항성을 증대시켜 사용하여야 한다. 우리나라에서는 전기로 산화슬래그 잔골재를 콘크리트용 잔골재로 활용하기 위한 제도적 기반으로서 KS F 4571이 제정되어 부산물의 자원화 시스템 기반이 마련되었다. 본 연구에서는, 전기로 산화슬래그 잔골재를 PMC(Polymer Modified Concrete) 포장공법에 잔골재로 치환하였을 경우, 콘크리트의 고정하중 증가에 따른 교량 상부에 미치는 영향에 대하여 연구하고자 하였다. 본 연구에서는 선정된 4가지 형식의 교량(RC 슬래브교, RC 라멘교, PSC Beam교, Steel Box girder교) 포장의 단위질량이 상향 적용시, 포장하중 증가에 따른 전체 고정하중은 약 1~2% 이내로 증가하고, 하중조합에 의한 부재력(설계모멘트)은 약 2% 이내로 증가하였다. 그리고 포장하중 증가에 따른 대상 구조물의 단면검토를 수행한 결과, 단면 안전율이 약 3% 이내로 감소하였다. 따라서, 포장의 단위질량 증가로 인해 구조물의 구조적 안전성에는 영향을 미치지 않을 것으로 판단된다.

• 마이크로전자및패키징학회지
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• 제15권4호
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• pp.87-92
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• 2008

본 논문에서는 Cu위에 Zn를 전기도금 한 후, Sn-3.5Ag 솔더와 반응에 의해서 형성되는 계면의 금속간 화합물의 변화를 관찰하였으며, 그에 따른 계면의 충격 신뢰성을 분석하였다. Sn-3.5Ag 솔더와 Zn 표면층이 반응하는 동안, Zn 표면층은 솔더 내부로 들어가며, 그 양은 Zn의 도금 두께에 비례하였다. 특히, Zn가 솔더 내로 들어가면서, 계면에서 Cu-Sn 금속간화합물을 억제하는 대신, $Cu_5Zn_8$와 $Ag_5Zn_8$이 형성되고, 이로 인해 계면의 충격 신뢰성이 크게 증가하였다. 또한, 솔더 내에 Zn가 약 3.8wt%정도 들어갔을 때 가장 우수한 계면 신뢰성을 유도하였다.