• Proceedings of the KIEE Conference
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• 2005.05a
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• pp.128-130
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• 2005

This paper proposes a modified IMC-PID controller that introduces controlling factor of the system identification to the standard IMC-PID controller in order to meet the design specifications such as gain, phase margin and maximum magnitude of sensitivity function in the frequency domain as well as the design specifications in time domain, settling, rising time and overshoot, and so on.

• Corrosion Science and Technology
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• v.23 no.5
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• pp.383-392
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• 2024

The presence of transition metals V, Cr or Mn in a 55%Al-Zn based coating metal can modify the equilibrium intermetallic phase, τ5c, by diffusion of transition metals and substituting for iron in the τ5c phase. We experimentally confirmed the modification of the IMC phase using various analytical techniques to characterize IMC phases. Experimental results confirmed the formation of a modified τ5c-Al₂₀(Fe,V)₅Si₂(+Zn) intermetallic phase. The modified IMC phase showed periodic repeating layers with varying concentrations of V while still maintaining a constant (Fe+V)/Fe ratio within the homogeneity range of Fe in the equilibrium IMC phase. We proposed a reaction-diffusion mechanism for forming a modified IMC phase and a periodic layered structure. The initial reaction of the steel strip resulted in the formation of Fe₄Al₁₃ IMC phase. Al, Si, and Zn diffused and reacted with Fe₄Al₁₃ to form the equilibrium bcc phase, τ5c. The Fe₄Al₁₃ phase was consumed in the reaction, followed by diffusion of V into the newly formed phase by substitution of Fe by V, resulting in formation of the modified IMC phase. At 600 ℃, the τ5c phase could dissolve up to 4.13 wt% (2.73 at.%) V without changing its overall bcc crystal structure.

• Journal of Institute of Control, Robotics and Systems
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• v.12 no.5
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• pp.505-508
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• 2006

This paper presents a new analytical approach for designing multiloop PI controllers for disturbance rejection in multivariable processes with time delay. The proposed method is based on IMC-PID design approach. To overcome a sluggish load response by dominant pole in the process, the IMC filter is modified to compensate the dominant pole effect. Based on the modified IMC filter, an analytical tuning rule for multiloop PI controller is driven by extending the generalized IMC-PID method for single input/single output (SISO) systems [1] to multi input/multi output (MIMO) systems. Simulation results show that the proposed method gives a satisfactory load performance as well as servo performance in the multiloop system.

• Proceedings of the KAIS Fall Conference
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• 2006.05a
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• pp.348-351
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• 2006

This paper proposes a modified IMC-PID controller that introduces controlling factor of the system identification to the standard IMC-PID controller in order to meet the design specifications such as gain, phase margin and maximum magnitude of sensitivity function in the frequency domain as well as the design specifications in time domain, settling, rising time and overshoot, and so on.

• Journal of Astronomy and Space Sciences
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• v.24 no.3
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• pp.235-248
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• 2007

We developed a software for simulations and analyses of the Image Navigation and Registration (INR) system, and compares the characteristics of Image Motion Compensation (IMC) algorithms for the INR system. According to the orbit errors and attitude errors, the capabilities of the image distortions are analyzed. The distortions of images can be compensated by GOES IMC algorithm and Modified IMC (MIMC) algorithm. The capabilities of each IMC algorithm are confirmed based on compensated images. The MIMC yields better results than GOES IMC although both the algorithms well compensate distorted images. The results of this research can be used as valuable asset to design of INR system for the Communication, Ocean, Meteorological Satellite (COMS).

• Proceedings of the KIEE Conference
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• 1990.11a
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• pp.396-401
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• 1990

The objective is to explore design concept for MIESF(Modified Integral error and State Feedback) controller. A method is outlined for designing MIESF controller that provides robust performance despite real parameter uncertainties in the process model. Insight into the design process is gained by viewing the MIESF from the perspective of IMC(Internal Model Control).

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Resources Recycling
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• v.22 no.2
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• pp.62-70
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• 2013

Electric arc furnace slag is made in ironworks during steel refining, it is been increasing chemical and physical resistibility using ageing method of unstable state of melting steel slag for using concrete's fine aggregates. Which is been changing stable molecular structure of aggregates, it restrains moving of ion and molecule. In Korea, KS F 4571 has been prepared for using the electric arc furnace slag to concrete aggregates. In this study, Electric arc furnace slag is used in the PMC(Polymer Modified Concrete) which is applied a bridge pavement of rehabilitation, largely. In that case, this study evaluates the structural safety about increasing the specific weight. The 4-type bridges(RC slab bridge, RC rigid-frame bridge, PSC Beam bridge, Steel box girder bridge) pavement's increasing the total dead load is in 1 ~ 2%. Design moments in a load combination are increased less then 2%. safety factor is decreased less than 3%. Therefore, the structural safety has no problem for applying the electric arc furnace slag within PMC in bridge.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.87-92
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• 2008

The interface microstructure of Sn-3.5Ag/Cu joint was modified by electroplating varying amount of Zn on Cu UBM. As the amount of Zn dissolved in Sn-3.5Ag solder increased with the electroplating Zn thickness, Cu-Sn IMCs such as $Cu_6Sn_5$ and $Cu_3Sn$ were replaced by Zn-containing IMCs such as $Cu_5Zn_8$ and $Ag_5Zn_8$, which increased the drop reliability of solder joints significantly. When the amount of Zn dissolved in solder was about 3.8wt%, drop resistance was best due to the effective suppression of Cu-Sn IMC and voids at the interface.