• The Journal of the Korea Contents Association
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• v.20 no.4
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• pp.396-405
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• 2020

In this study, we used the big data of Voice of Customer (VOC) related to high-speed Internet products to look at the causes of perceived quality and the possibility of proactive service. In order to verify the possibility of proactive service, we collected VOC data from 13 facilities and equipment of a mobile communication service company, and then conducted 𝒙² test to verify that there was a statistically significant difference between the actual VOC observation values and expected values. We found statistical evidence that proactive service is possible through real-time monitoring for the six disability alarms among the 13 facilities and equipment, which are FTTH-R Equipment ON/OFF, FTTH-EV Line Error Detection, Port Faulty, FTTH-R Line Error Detection, Network Loop Detection, and Abnormal Limiting Traffic. Companies are able to adopt the proactive service to improve their market share and to reduce customer service costs. The results of this study are expected to contribute to the actual application of industry in that it has diagnosed the possibility of proactive service in the telecommunication service sector and further suggested suggestions on how to provide effective proactive service.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• The Journal of the Convergence on Culture Technology
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• v.4 no.1
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• pp.337-351
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• 2018

This paper discusses 5G IOT, Augmented Reality, Cloud Computing, Big Data, Future Autonomous Driving Vehicle technology, and presents 5G utilization of Pyeongchang Winter Olympic Games and Jeju Smart City model. The reason is that 5G is the main artery of the 4th industry.5G is the fourth industrial aorta because 5G is the core infrastructure of the fourth industrial revolution. In order for the AI, autonomous vehicle, VR / AR, and Internet (IoT) era to take off, data must be transmitted several times faster and more securely than before. For example, if you send a stop signal to LTE, which is a communication technology, to a remote autonomous vehicle, it takes a hundredth of a second. It seems to be fairly fast, but if you run at 100km / h, you can not guarantee safety because the car moves 30cm until it stops. 5G is more than 20 gigabits per second (Gbps), about 40 times faster than current LTE. Theoretically, the vehicle can be set up within 1 cm. 5G not only connects 1 million Internet (IoT) devices within a radius of 1 kilometer, but also has a speed delay of less than 0.001 sec. Steve Mollenkov, chief executive officer of Qualcomm, the world's largest maker of smartphones, said, "5G is a key element and innovative technology that will connect the future." With 5G commercialization, there will be an economic effect of 12 trillion dollars in 2035 and 22 million new jobs We can expect to see the effect of creation.

• Economic and Environmental Geology
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• v.53 no.5
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• pp.609-617
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• 2020

After introducing the industry 4.0 policy, Korean government announced 'Digital New Deal' and 'Green New Deal' as 'Korean New Deal' in 2020. We analyzed Korea Institute of Geoscience and Mineral Resources (KIGAM)'s research projects related to that policy and conducted markets analysis focused on Digital Twin and environmental monitoring technologies. Regarding 'Data Dam' policy, we suggested the digital geo-contents with Augmented Reality (AR) & Virtual Reality (VR) and the public geo-data collection & sharing system. It is necessary to expand and support the smart mining and digital oil fields research for '5th generation mobile communication (5G) and artificial intelligence (AI) convergence into all industries' policy. Korean government is suggesting downtown 3D maps for 'Digital Twin' policy. KIGAM can provide 3D geological maps and Internet of Things (IoT) systems for social overhead capital (SOC) management. 'Green New Deal' proposed developing technologies for green industries including resource circulation, Carbon Capture Utilization and Storage (CCUS), and electric & hydrogen vehicles. KIGAM has carried out related research projects and currently conducts research on domestic energy storage minerals. Oil and gas industries are presented as representative applications of digital twin. Many progress is made in mining automation and digital mapping and Digital Twin Earth (DTE) is a emerging research subject. The emerging research subjects are deeply related to data analysis, simulation, AI, and the IoT, therefore KIGAM should collaborate with sensors and computing software & system companies.

• Journal of Korea Entertainment Industry Association
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• v.14 no.3
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• pp.201-210
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• 2020

The aim of this thesis is to investigate exhibition spaces which are being expanded and transformed concurrently with social phenomena that are also the result of rapid changes, all of which are reflective of a modern society in transition. Such investigation would also include an analysis of changes in the viewing public and artworks themselves, and also an assessment of the public nature of art and its effective aspects. Expansion of exhibition spaces and the increasing connection between art and the public have very important ramifications, in many respects. They present opportunities for the viewing public to immerse themselves in artistic spaces, with some reaching further into other activities - activities that they often share with other individuals. This also leads them to expand their range of activities, turning them into more mobile, proactive audiences. In connection, many corporations have turned their attention to this public aspect of art, which has resulted in a display of art in different types of spaces. The government also began to adopt 'public art' as a matter of policy, using it as a medium of communication between the state and its populace. The public aspect of art, being highlighted as a result of expansion and diversification of exhibition spaces, will have a significant impact not only on the viewing public, but also on the art market. This represents a momentous change for creators of art, which naturally warrants close scrutiny and research.

• Journal of the Korea Society for Simulation
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• v.18 no.3
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• pp.73-82
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• 2009

Due to the many advantages including low price, low power consumption, and miniaturization, the CMOS camera has been utilized in many applications, including mobile phones, the automotive industry, medical sciences and sensoring, robotic controls, and research in the security field. In particular, the 360 degree omni-directional camera when utilized in multi-camera applications has displayed issues of software nature, interface communication management, delays, and a complicated image display control. Other issues include energy management problems, and miniaturization of a multi-camera in the hardware field. Traditional CMOS camera systems are comprised of an embedded system that consists of a high-performance MCU enabling a camera to send and receive images and a multi-layer system similar to an individual control system that consists of the camera's high performance Micro Controller Unit. We proposed the SL-AVS (Small Size/Low power Around-View System) to be able to control a camera while collecting image data using a high speed synchronization technique on the foundation of a single layer low performance MCU. It is an initial model of the omni-directional camera that takes images from a 360 view drawing from several CMOS camera utilizing a 110 degree view. We then connected a single MCU with four low-power CMOS cameras and implemented controls that include synchronization, controlling, and transmit/receive functions of individual camera compared with the traditional system. The synchronization of the respective cameras were controlled and then memorized by handling each interrupt through the MCU. We were able to improve the efficiency of data transmission that minimizes re-synchronization amongst a target, the CMOS camera, and the MCU. Further, depending on the choice of users, respective or groups of images divided into 4 domains were then provided with a target. We finally analyzed and compared the performance of the developed camera system including the synchronization and time of data transfer and image data loss, etc.