• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권8호
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• pp.414-418
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• 2001

Failure modes of Mo-tip FEA were investigated in detail as a preliminary study for the application of Mo-tip FEA to the CRT electron-gun as a cold cathode. It was identified that the destruction of Mo-tip FEA was originated from reflowing of arc-current during the spot-knocking process followed by secondary arc between gate electrode and cathode substrate. In order to prevent Mo-tip FEA from destruction due to arc-current, two kinds of methods were suggested, that is one is to provide the by-pass of the reflow current and the other is to install a current limiter in the path of gate connection line.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권1호
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• pp.19-22
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• 1999

N-doped and low-hydrogenated DLC thin films were coated on the Mo-tip FEAs in order to improve the field emission performance and their electrical properties were evaluated. The fabricated devices showed improved field emission performance in terms of turn-on voltage, emission current and current fluctuation. This result might be caused both by the shift of Fermi level toward conduction band by N-doping and by the inherent stability of DLC material. Furthermore, the transconductance of the DLC-coated Mo-tip FEA and electrical conductivity and optical band-gap of the deposited DLC films were investigated.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권7호
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• pp.525-529
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• 1999

The influence of ambient gases on field emission performance of Mo-field emitter array(FEA) in the frit-sealing step of field emission display(FED) packaging process was investigated. Mo-tip FEA was mounted on the glass substrate having a surrounded frit(Ferro FX11-137) and fired at $415^{\circ}C$ in the ambient gases of air, $N_2$ and Ar. The Ar gas was proved to be most proper ambient among the used gases through evaluating the turn-on voltage and field emission current of the fired Mo-tip FEA devices. It was confirmed that the Mo surface fired in Ar ambient was less oxidized when compared with another ones annealed in air and Ar ambient by the AFM, XPS, AES and SIMS analysis. Finally, the 3.5 inch-sized Mo-tip FED, which was packaged using frit-sealing process in the Ar ambient, was proposed.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권10호
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• pp.532-535
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• 2001

The sputtering condition of Cr thin film was established in order to get Cr gate electrode having a vertical wall structure for Mo-tip FEA. In case of Mo-tip FEA which had a vertically-etched Cr gate electrode, the field enhancement factor, was relatively increased and so the field emission performance in terms of turn-on voltage, emission current and trans-conductance could be improved when compared with the devices having a tapered gate wall.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권2호
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• pp.76-79
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• 1999

Low-hydrogenated DLC films were coated on the Mo-tip FEAs by 'layer-by-layer' process based on the plasma-enhanced CVD method. The hydrogen content in the DLC film deposited by the 'layer-by-layer' process was appeared to be remarkably lowered through SIMS analysis. Also, the low-hydrogenated DLC-coated Mo-tip FEA showed good potentiality for FED applications in terms of turn-on voltage, emission current, emission stability and light emitting uniformity.

• 한국재료학회지
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• 제8권1호
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• pp.10-12
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• 1998

Si FEA 로부터 tip의 표면을 Ti금속으로 silicidation한 새로운 2극형 Ti-실리사이드 FEA를 제작하고 이의 전계방출 특성을 Si FEA의 경우와 비교하였다. 양극과 음극간의 거리를 10$\mu\textrm{m}$로 유지하고 $10^{-8}$Torr의 고진공 상태에서 측정한 실리사이드 FEA의 turn-on전압은 약 40V로, 전계방출전류와 정상상태 전류 변동율은 150V의 바이어스 아래에서 약 3x$10^{-2}$ $\mu$A/tip와 0.1%min로 나타났다. Ti-실리사이드 FEA는 Si FEA에 비해 낮은 turn-on 전압, 높은 전계방출전류 및 고내구특성을 나타내었다.

• 한국전기전자재료학회논문지
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• 제11권7호
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• pp.508-516
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• 1998

Mo-tip field emitter arrays(FEAs) were fabricated by conventional Spindt process and their life time characteristics and failure mode were evaluated. The fabricated Mo-tip FEA could generate at least $0.35\{mu} A/tip$ emission current for about 320 persistently under a constant gate bias of 140 V and was finally destroyed through self-healing mode. Thin diamond-like carbon films were coated on the M-tip by plasma-enhanced CVD and the dependence of emission properties upon the DLC thickness was investigated. By DLC coating, the turn-on voltage and emission current were appeared to be improved whereas the current fluctuation was increased in the DLC thickness range of $0~1,000\{AA}$.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권8호
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• pp.409-413
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• 2001

In the electron-gun of CRT, the Mo-tip FEA was employed as cold cathode in order to replace the conventional thermal cathode. The Mo-tip FEA was designed and fabricated according to CRT specification and mounted on the electron-gun. It was known that fabricated cold cathode electron-gun showed better performance in terms of maximum emission current and switch-on time when compared with the ones of thermal cathode electron-gun, but some geometrical structures in the inside of electron-gun must be changed to reduce the gate leakage current. Finally, the potential applicability was guaranteed by means of operating the 19 inch-sized LG-color CRT using the fabricated cold cathode electron-gun.

• 한국재료학회지
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• 제10권2호
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• pp.124-127
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• 2000

Si FEA로부터 tip의 표면을 Ti 금속으로 silicidation한 새로운 3극형 Ti-silicided Si FEA를 제작하고 이의 전계 방출특성을 조사하였다. 제작된 소자에서 단위 pixel(pixel area : $1000{\mu\textrm{m}}{\times}1000{$\mu\textrm{m}}$, tip array : $200{\mu\textrm{m}}{\times}200{$\mu\textrm{m}}$)을 통해 측정된 전계 방출 특성은 $10^8Torr$의 고진공 상태에서 turn-on 전압이 약 70V로, 아노드 방출전류의 크기와 current degradation이 $V_A=500V,\;V_G=150V$ 바이어스 아래에서 각각 2nA/tip와 0.3%/min로 나타났다. 3극형 Ti-silicided Si FEA의 낮은 turn-on 전압과 높은 전류안정성은 Si tip 표면에 형성된 실리사이드 박막의 열화학적 안정성과 낮은 일함수에 기인하는 것으로 판단된다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권9호
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• pp.656-661
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• 1999

As a fundamental study for FED tubeless packaging, sodalime-sodalime electrostatic bonding was performed by using on the developed bonding mechanism. Thebonding properties of the bonded sodalime-sodalime structure were investigated through SEM and SIMS analyses. Mo-tip FEA was vacuum-packaged by the developed bonding process and the packaged device generated the field emission current.