• Korean Journal of Materials Research
• /
• v.11 no.10
• /
• pp.879-888
• /
• 2001

The effects of final annealing temperature on the microstructure and creep characteristics were investigated for the Zr-lNb-0.2X (X=0, Mo, Cu) and Zr-lNb- 1Sn-0.3Fe-0.1X (X=0, Mo, Cu) alloys. The microstructures were observed by using TEM/EDS, and grain size and distributions of precipitates were analyzed using a image analyzer. The creep test was performed at $400^{\circ}C$ under applied stress of 150 MPa for 10 days. The $\beta$-Zr was observed at annealing temperature above $600^{\circ}C$. In the temperature above$ 600^{\circ}C$, the grain sizes of both alloy systems appeared to be increased with increasing the final annealing temperature. The creep strengths of Zr-1Nb-1Sn-0.3Fe-0.1X alloys were higher than those of Zr-1Nb-0.2X ones due to the effect of solid solution hardening by Sn in Zr-lNb-lSn-0.3Fe-0.1X alloy system. Also, Mo addition showed the strong effect of precipitate hardening in both alloy systems. The creep strength rapidly decreased with increasing the annealing temperature up to $600^{\circ}C$. However, a superior creep resistance was obtained in the sample that annealed to have a second phase of $\beta$-Zr. It was considered that the appearance of $\beta$-Zr would play an important role in the strengthening mechanism of creep deformation.

• Journal of the Korean Ceramic Society
• /
• v.33 no.3
• /
• pp.251-258
• /
• 1996

The reactions between an active metal brazing alloy and interlayers together with the effects of interlayer type on the interfacial microstructure change were investiaged for silicon nitride/stainless steel joint. The bending strengths were measured for joints with Mo, Cu, Ni interlayer type of different thicknesses. It was found that the interlayer with a low yield strength value is effective to improve the bending strength of the Si3N4/stainless steel joint. The maximum joint strength obtained at room temperature for a laminated Cu/Mo interlayer was about 460 MPa. The combined use of Mo and thin Cu layer was found to be effective in enhancing the bending strength for the Si3N4/S.S.316 joint.

• Journal of Powder Materials
• /
• v.1 no.1
• /
• pp.60-65
• /
• 1994

When a commercial prealloyed Fe-powder(Fe-5Cr-lMo-2Cu-0.5P-3C) is liquid phase sintered at 116$0^{\circ}C$, liquid precipitates with various shapes form within solid grains during the initial stage of sintering. The shape of a liquid precipitate changes pith the increment of their size from sphere(with radius<0.3$\mu\textrm{m}$), a transient polyhedron with more than 7 faces(1~2 $\mu\textrm{m}$), cuboid(3~5 $\mu\textrm{m}$), and finally to sphere(>5 $\mu\textrm{m}$). The shapes of liquid precipitates closely resemble the growth shapes predicted on the basis of solid-liquid interfacial energy and the coherency strain energy with anisotropic elastic constants in the diffusion zone around the precipitates.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2007.05a
• /
• pp.20.2-20.2
• /
• 2007

• Journal of Powder Materials
• /
• v.23 no.3
• /
• pp.207-212
• /
• 2016

In this study, Fe-Cu-Ni-Mo-C low alloy steel powder is consolidated by spark plasma sintering (SPS) process. The internal structure and the surface fracture behavior are studied using field-emission scanning electron microscopy and optical microscopy techniques. The bulk samples are polished and etched in order to observe the internal structure. The sample sintered at $900^{\circ}C$ with holding time of 10 minutes achieves nearly full density of 98.9% while the density of the as-received conventionally sintered product is 90.3%. The fracture microstructures indicate that the sample prepared at $900^{\circ}C$ by the SPS process is hard to break out because of the presence of both grain boundaries and internal particle fractures. Moreover, the lamellar pearlite structure is also observed in this sample. The samples sintered at 1000 and $1100^{\circ}C$ exhibit a large number of tiny particles and pores due to the melting of Cu and aggregation of the alloy elements during the SPS process. The highest hardness value of 296.52 HV is observed for the sample sintered at $900^{\circ}C$ with holding time of 10 minutes.

• Journal of Powder Materials
• /
• v.11 no.3
• /
• pp.193-201
• /
• 2004

1960년 Au-Si계 합금에서 처음으로 비정질상이 급속 응고법에 의해 보고된 이래/sup 1)/ 지난 40년 간 많은 합금계에서 비정질상이 보고되어졌다. 대표적으로 Fe-, Ni-, Co기 합금 등 많은 합금계에서 비정질상이 보고되었으나, 비정질상의 형성을 위해서는 약 105 K/s이상의 높은 냉각속도를 필요로 하였다. 1980년대 수백 K/s의 낮은 냉각속도 하에서도 비정질상이 형성될 수 있는 다원계 합금(multi-component alloy)이 Mg-Ln-(Ni, Cu, Zn), Ln-Al-TM 합금에서 보고되어 졌으나 많은 관심을 받지 못하다가 1993년 Zr-Ti-Ni-Cu-Be 합금에서 수 ㎝ 크기의 비정질합금 제조가 보고되면서 전 세계적으로 많은 관심을 받게 되었다. Zr-Ti-Ni-Cu-Be계 벌크 비정질 합금이 보고된 후 Zr-(Nb,Pd)-Al-TM, Pd-Cu-Ni-P, Fe-Co-Zr-Mo-W-B, Ti-Zr-Ni-Cu-Sn등 여러 합금계에서 벌크 비정질 합금이 보고되었다. (중략)

• Journal of Technologic Dentistry
• /
• v.28 no.2
• /
• pp.321-329
• /
• 2006

The popularity of Ni-Cr-Mo based metal alloys for metal-ceramic crown have increased recently because of low price, superior yield strength and rigidity. the use of these alloys give them the potential advantage of thinner copping with the required rigidity for long span bridges. The purpose of this study was to assess the microstructures and mechanical properties of Ni-Cr-Mo-(Si,Al,Nb,Zr,Ti.Cu,Mm) based Alloys not containing beryllium(Be) related toxic effects. The abtained results indicated that as-cast these specimen alloys showed compositional and microstructural differences, and mechanical properties values of Ni69Cr20Mo5Si2Al4 alloy among these specimen alloys was found to be superior to those of commercial Ni-Cr based alloy using in market place today.

• Journal of the Korean institute of surface engineering
• /
• v.42 no.6
• /
• pp.260-266
• /
• 2009

The anodic oxidation behaviour of a cast component of AC2A Al alloy with machined surface and ascast surface was investigated in sulfuric acid solution. The anodized specimen showed relatively uniform and thick anodic oxide films on the as-cast surface, while non-uniform and very thin oxide films were formed on the machined surface. Non-anodized as-cast surface was observed to be covered with thick oxide scales and showed a number of second-phase particles containing Si, while non-anodized machined surface showed no oxide scales and relatively very small number of Si particles. Thus, the very limited growth of anodic oxide films on the as-cast surface was attributed to the presence of thick oxide scales and Si-containing second-phase particles on its surface.

• Journal of Industrial Technology
• /
• v.28 no.A
• /
• pp.195-198
• /
• 2008

Graphite and $MoS_2$ were added respectively to the Cu/Sn bond materials of the same composition as a lubricant in order to find out the effect of lubricants on the mechanical properties and the increase in density of the sintered products for microblades. The addition of $MoS_2$ as a lubricant was more beneficial to strength, fracture toughness, and hardness as well as densification than graphite. $MoS_2$ seemed to be more effective in reducing the friction between the metallic powders and die wall during hot pressing process. Due to the better wettability of MoS2 with bond metal alloy, less amount of interfacial defects which is detrimental to mechanical properties use observed.

• Transactions of the Korean Society of Automotive Engineers
• /
• v.21 no.1
• /
• pp.145-153
• /
• 2013

In this study, shear punch-creep (SP-Creep) at Sn-4Ag/Cu pad the joint was tested by using environment-friendly Pb-free solder alloy Sn-4Ag of electronic components. Pb eutectic alloy (Sn-37Pb) joints limited to environmental issues with reflow time (10sec, 30sec, 100sec, 300sec) according to two types of solder alloy joints are compared and evaluated by creep strain rate, rupture time and IMC (Intermetallic Compound) behavior. As the results, reflow time increases with increasing thickness of IMC can be seen at overall 100sec later in case of two solder joints on the IMC thickness of Sn-4Ag solder joints thicker than Sn-37Pb solder joints. In addition, when considering creep evaluation factors, lead-free solder alloy Sn-4Ag has excellent creep resistance more than Pb eutectic alloy. For this reason, the two solder joints, such as in the IMC (Cu6Sn5) was formed. However, the creep resistance of Sn-4Ag solder joints was largely increased in the precipitation strengthening effect of dispersed Ag3Sn with interface more than Sn-37Pb solder joints.