• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.98-102
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• 1994

There are many difficulties in automatic polishing for die & mold surfaces. Even though the process has been studied in the past 15 years, it has not been achieved yet, but by the process of actual hand work of well-skilled workers. A new magentic assisted polishing process, which is one of the potential method for automation of surface finishing has been studied in the past 10 years by colleagues. The process has many merits, but on the other hand also has demerits, one being low efficiency of gridability by comparision with grinding wheel polish. Therefore, some attempts were tried to improve the grindability by adopting electropolishing, ultra-high speed milling, 5-axis controlled machine etc... most recently by collegues. This study also aims to improve the efficiency of polishing by introducing the easily-polished shape surface milling method equalizing the tool feed per tooth to the pick feed. This milling method was experimentally confirmed to have sufficient grindability to polish milled surface (with 10 .mu. mRmax surface roughness) into mirror surface (with 0.4 .mu. mRmax surface roughness).

• Journal of Mechanical Science and Technology
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• v.19 no.8
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• pp.1576-1581
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• 2005

Generally, the optical components are fabricated by grinding, lapping, and polishing. And, those processes take long time to obtain such a high surface quality. Therefore, in the case of large optical component, the on-machine inspection (OMI) is essential. Because, the work piece is fragile and difficult to set up for fabricating and measuring. This paper is concerned about a swing-arm method for measuring surface profile of large optical concave mirror. The measuring accuracy and uncertainty for suggested method are studied. The experimental results show that this method is useful specially in lapping process with the accuracy of $3\~5\;{\mu}m$. Those inspection data are provided for correcting the residual figuring error in lapping or polishing processes.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1996.03a
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• pp.124-131
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• 1996

The use of small hemispherical high-speed precision bearing has increased drastically these days in the field of computer disk driver, highteech devices as well as communication and electronic device drivers. It was suggested that the new polishing process adopting the diamond grinding wheel and polishing tool instead of multi stage lapping processes, which enables the mass production of the bearing by reduction of polishing time. Polishing mechanism was analysed and the results were applied to the design and manufacturing of the polishing system. Experiments for selection of optimal polishing conditions were carried out using the polishing system.

• Journal of Korean Medical classics
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• v.22 no.3
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• pp.321-336
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• 2009

Objectives : The purpose of our study was to discuss about the scholarship value and contents of the transcription of Correction of the Classic of Materia Medica that was obtained recently. Methods : We analysed the transcription of Correction of the Classic of Materia Medica itself and compared form and matter with Shennong's Classic of Materia Medica[神農本草經], Compendium of Materia Medica[本草綱目]. Results : 1. It is obvious that the transcription of Correction of the Classic of Materia Medica is one of the book works of Lee Gyujun. 2. The transcription of Correction of the Classic of Materia Medica was written to recover the original figure of Shennong's Classic of Materia Medica standing on Compendium of Materia Medica. Lee Gyujun corrected qi, flavor and main effects of herbs according to his medical sight, and classified herbs into three grade. Conclusions : The transcription of Correction of the Classic of Materia Medica is not an original book but an interim book on working process. But it reflects the medical sight of Lee Gyujun and the medical level of those days sufficiently. Also it is the only study of Shennong's Classic of Materia Medica in Chosun dynasty.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.89-93
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• 2020

Complex warpage behavior of the electronic packages causes internal stress so many kinds of mechanical failure occur such as delamination or crack. Efforts to predict the warpage behavior accurately in order to prevent the decrease in yield have been approached from various aspects. For warpage prediction, silicon is generally treated as a homogeneous material, therefore it is described as showing no warpage behavior due to thermal loading. However, it was reported that warpage is actually caused by residual stress accumulated during grinding and polishing in order to make silicon wafer thinner, which make silicon wafer inhomogeneous through thickness direction. In this paper, warpage behavior of the single-side polished wafer at solder reflow temperature, the highest temperature in packaging processes, was measured using 3D digital image correlation (DIC) method. Mechanism was verified by measuring coefficient of thermal expansion (CTE) of both mirror-polished surface and rough surface.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.11
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• pp.51-57
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• 2001

A light beam reflected from a machined surface generally containes information concerning about its surface roughness. This study examines and proposes a surface roughness measurement technique for on-machine measurement of machined surfaces. The technique is based on the measurement of a reflected laser beam pattern and the statistical analysis of its light intensity distribution. The surface roughness was found to be closely related to the standard deviation of the light intensity on the primary axis of the reflected pattern. An image acquisition device is made up of a laser diode, a half mirror, a screen, and a CCD camera. The exact image with the primary and secondary axes of a reflected laser beam pattern is calculated through such image processing algorithm as thresholding, edge detection, image rotation, segmentation, etc. A median filter and a surrounding light correction algorithm are improve the image quality and reduce the measuring error. Using the developed measuring device the effect of screen materials and workpiece and workpiece materials was investigated. Experimental results regarding to relatively high-quality surfaces machined by grinding, polishing, lapping processes have shown the measurement error is within 10% in the range of $0.1{mu}m~0.8{\mu}m R_q.$Therefore, the proposed method is thought to be effectively used when quick measurements is needed with workpieces fixed on the machine.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.5
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• pp.20-28
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• 2014

The high velocity oxygen fuel spraying (HVOF) is a kind of surface modification process technology to form the sprayed coating layer after spraying the powder to molten or semi-molten state by the ultra-high speed at the high-temperature heat source and conflicting with a substrate. It is desirable to melt completely the thermal spray powder in order to produce the coating layer with an optimal adhesion, however, because a semi-molten powder in a spray process has the low efficiency and become a factor that degrades the mechanical property by the inducement of pore-forming within the coating layer. To improve the wear resistance, corrosion resistance and heat resistance, in this study, the plungers of high-speed and ultra-high pressure reciprocating hydraulic pumps for oil and water used in ironwork are produced with $420J_2$ and the coating layers of plungers are formed by the powders of WC-Co-Cr and WC-Cr-Ni including the high hardness WC. The surface of these plungers is modified by the super-mirror face grinding machine using variable air pressure developed in this laboratory, and then the characteristics of cross-sectional microstructure, and surface roughness and hardness values between no operation and 100 days-operation are examined and made a comparison. The fine tops and bottoms on surface roughness curve of oil-hydraulic pump plunger sprayed by WC-Cr-Ni are molded more and higher than those of water-hydraulic pump sprayed by WC-Co-Cr because the plunger diameter of oil-hydraulic pump is 0.4 times smaller than that of water-hydraulic pump and the pressure of oil-hydraulic pump exerted on the plunger is operated with the 70 bars higher than that of water-hydraulic pump. As a result, it is found that the values of centerline average surface roughness and maximum height for oil-hydraulic pump plunger are bigger than those of water-hydraulic pump plunger.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.779-784
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• 2011

This study was carried out on the crack healing of three types of SiC ceramics based on a $SiO_2$ additive, taking into account the roughness of the polishing plate used for polishing the specimens. The mixtures were subsequently hot-pressed in $N_2$ gas for one hour under 35 MPa at 2053 K. In these specimens, the optimized crack-healing condition was 1373 K for one hour in air. The crack-healing material of the cracked part was the glassy phase of $SiO_2$ that was formed by the oxidation of SiC. In the optimum healing condition, the bending strength of non-polished SiC ceramics was not completely recovered. However, the bending strength of the SAY specimen was excellent, considering the economic aspects of SAY, SAYS-1, and SAYS-2. The SAY specimen is definitely superior to the others after an hour of heat treatment. There was a decrease in the number and size of defects in the specimen polished by using a $125-{\mu}m$ polishing plate; however, the micro-surface defects were not completely repaired. The specimen polished by using a 40-${\mu}m$ polishing plate showed little voids or surface defects after an hour of heat treatment. The bending strength of the specimen mirror-polished by using a 6-${\mu}m$ polishing plate was completely recovered.