• Title/Summary/Keyword: Millimeter-wave device

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A Systematic Method for SPICE Simulation of Electrical Characteristics of Poly-Si TFT-LCD Pixel (SPICE를 사용한 다결정 실리콘 TFT-LCD 화소의 전기적 특성 시뮬레이션 방법의 체계화)

  • Son, Myung-Sik;Ryu, Jae-Il;Shim, Seong-Yung;Jang, Jin;Yoo Keon-Ho
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.12
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    • pp.25-35
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    • 2001
  • In order to analyze the electrical characteristics of complicated thin film transistor-liquid crystal display (TFT-LCD) array circuits, it is indispensible to use simulation programs such as PSPICE and AIM-SPICE. In this paper, we present a systematic method of extracting the input parameters of poly-Si TFT for SPICE simulations. This method was applied to two different types of poly-Si TFTs, fabricated by excimer laser annealing and silicide mediated crystallization methods, and yielded good fitting results to experimental data. Among the SPICE simulators, PSPICE has the graphic user interface feature making the composition of complicated circuits easier. We added successfully a poly-Si TFT device model to the PSPICE simulator, and analyzed easily the electrical characteristics of pixels considering the line RC delay. The results of this work would contribute to efficient simulations of poly-Si TFT-LCD arrays.

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Development of a Comprehensive Performance Test Facility for Small Millimeter-wave Tracking Radar (소형 추적 레이다용 종합성능시험 시설 개발)

  • Kim, Hong-Rak;Kim, Youn-Jin;Woo, Seon-Keol;An, Se-Hwan
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.20 no.3
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    • pp.121-127
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    • 2020
  • The small tracking radar targets the target in a real-time, fast-moving, fast-moving target against aircraft with a large RCS that is maneuvering at low speed and a small RCS aircraft maneuvering at high speed (fighters, drones, helicopters, etc.) It is a pulsed radar that detects and tracks. Performing a performance test on a tracking radar in a real environment is expensive, and it is difficult to quantitatively measure performance in a real environment. Describes the composition of the laboratory environment's comprehensive performance test facility and the main requirements and implementation of each configuration.Anechoic chambers to simulate the room environment, simulation target generator to simulate the signal of the room target, target It is composed of a horn antenna driving device to simulate the movement of a vehicle and a Flight Motion Simulatior (FMS) to simulate the flight environment of a tracking radar, and each design and implementation has been described.

Analysis of PHEMT's Characteristics by Gate Recesses (게이트 리세스 식각 방법에 따른 PHEMT 특성 분석)

  • 임병옥;이성대;김성찬;설우석;신동훈;이진구
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.40 no.9
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    • pp.644-650
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    • 2003
  • In this paper, we have studied characteristics of PHEMT's fabricated by two difference types of gate recess for improving performance of the device in millimeter wave applications. PHEMT's were fabricated using wide and narrow recesses. Maximum transconductance(g$_{m}$) of PHEMT's using the wide recess was 332.7 mS/mm, and that of PHEMT's using narrow recess was 504.6 mS/mm. From small signal performance measurements, cutoff frequency(f$_{T}$) and maximum stable oscillation frequency(f$_{max}$) of PHEMT's using wide recess were 113 GHz and 172 GHz, respectively. f$_{T}$ and f$_{max}$ of PHEMT using narrow recess were 101 GHz and 142 GHz, respectively. The measured data of the fabricated PHEMTs' were carefully studied and analyzed.d.tudied and analyzed.

Transmit-receive Module for Ka-band Seekers using Multi-layered Liquid Crystal Polymer Substrates (다층 액정폴리머 기판을 이용한 Ka대역 탐색기용 송수신 모듈)

  • Choi, Sehwan;Ryu, Jongin;Lee, Jaeyoung;Lee, Jiyeon;Nam, ByungChang
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.20 no.5
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    • pp.63-70
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    • 2020
  • In this paper, the transmit-receive module for military seekers has been designed and fabricated in 35 GHz. To increase the performance of substrates and high integration of circuits in millimeter-wave band, a 4-layer LCP(Liquid Crystal Polymer) substrate was developed. This substrate was implemented with three FCCL substrates and two adhesive layers, and a process using the difference in melting point between the substrates was used for lamination. Using a strip line and a microstrip line was confirmed by the transmission loss along the length of the substrate, and the performance of LCP substrates was validated with a power divider in 35 GHz. After confirming the performance of individual blocks such as power amplifier and low noise amplifier, a single channel Ka-band transmission/reception module was developed using a 4-layer liquid crystal polymer substrate. The transmit power of this module has above 1.1W in pulse duty 10% and has an output power of 1.1W and it has receive noise figure less than 8.5 dB and receive gain more than 17.6 dB.

The Study on the Embedded Active Device for Ka-Band using the Component Embedding Process (부품 내장 공정을 이용한 5G용 내장형 능동소자에 관한 연구)

  • Jung, Jae-Woong;Park, Se-Hoon;Ryu, Jong-In
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.3
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    • pp.1-7
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    • 2021
  • In this paper, by embedding a bare-die chip-type drive amplifier into the PCB composed of ABF and FR-4, it implements an embedded active device that can be applied in 28 GHz band modules. The ABF has a dielectric constant of 3.2 and a dielectric loss of 0.016. The FR-4 where the drive amplifier is embedded has a dielectric constant of 3.5 and a dielectric loss of 0.02. The proposed embedded module is processed into two structures, and S-parameter properties are confirmed with measurements. The two process structures are an embedding structure of face-up and an embedding structure of face-down. The fabricated module is measured on a designed test board using Taconic's TLY-5A(dielectric constant : 2.17, dielectric loss : 0.0002). The PCB which embedded into the face-down expected better gain performance due to shorter interconnection-line from the RF pad of the Bear-die chip to the pattern of formed layer. But it is verified that the ground at the bottom of the bear-die chip is grounded Through via, resulting in an oscillation. On the other hand, the face-up structure has a stable gain characteristic of more than 10 dB from 25 GHz to 30 GHz, with a gain of 12.32 dB at the center frequency of 28 GHz. The output characteristics of module embedded into the face-up structure are measured using signal generator and spectrum analyzer. When the input power (Pin) of the signal generator was applied from -10 dBm to 20 dBm, the gain compression point (P1dB) of the embedded module was 20.38 dB. Ultimately, the bare-die chip used in this paper was verified through measurement that the oscillation is improved according to the grounding methods when embedding in a PCB. Thus, the module embedded into the face-up structure will be able to be properly used for communication modules in millimeter wave bands.