• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.9
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• pp.849-854
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• 2005

In this paper, the cooling performance of a microchannel heat sink with nano-particle-fluid suspensions ('nanofluids') is numerically investigated. By using theoretical models of thermal conductivity and viscosity of nanofluids that account for the fundamental role of Brownian motion respectively, we investigate the temperature contours and thermal resistance of a microchannel heat sink with nanofluids such as 6nm copper-in-water and 2nm diamond-in-water. The results show that a microchannel heat sink with nanofluids has high cooling performance compared with the cooling performance of that with water, the classical coolant. Nanofluids reduce both the thermal resistance and the temperature difference between the heated microchannel wall and the coolant.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.12
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• pp.986-993
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• 2007

The microchannel heat sink is promising heat dissipation method far high density electronic devices. The cross-sectional shape of MEMS based microchannel heat sink is limited to triangular, trapezoidal, and rectangular due to their fabrication method. And heat is added to one side surface of heat source. Therefore, those specific conditions make some complexity of heat transfer in microchannel heat sink. Though many previous research of conjugate heat transfer in microchannel was conducted, most of them did not consider heat loss. In this study, numerical investigation of conjugate heat transfer in rectangular microchannel was conducted. The method of heat loss evaluation was verified numerically. Heat distribution was different for each wall of rectangular microchannel due to thermal conductivity and distance from heat source. However, the ratio of heat from each channel wall was correlated. Therefore, the effective area correction factor could be proposed to evaluate accurate heat flux in one side heating condition.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1189-1194
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• 2004

In this paper, the effect of tip clearance on the cooling performance of the microchannel heat sink is presented under the fixed pumping power condition. For the various types of microchannel heat sink having different size of fin width and channel width, experimental study is conducted. Through the experiment, the tip clearance effect is investigated by increasing tip clearance from zero. As a result, it is shown that cooling performance of heat sink with tip clearance is better than that of heat sink without tip clearance. For the microchannel heat sink with tip clearance, the optimum conditions for cooling performance is also studied.

• Journal of the Korean Society of Visualization
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• v.22 no.1
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• pp.79-84
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• 2024

As microchips' degree of integration is getting higher, its cooling problem becomes important more than ever. One of the promising methods is using fractal microchannel heat sink by mimicking nature's Murray networks. However, most of the related works have been progressed only by numerical analysis. Perhaps such lack of direct experimental studies is due to the technical difficulty of the temperature and heat flux measurement in complex geometric channels. Here, we demonstrate the direct visualization of in situ temperature profile in a fractal microchannel heat sink. By using the temperature-sensitive fluorescent dye and a transparent Polydimethylsiloxane window, we can map temperature profiles in silicon-based fractal heat sinks with various fractal scale factors (a=1.5-3.5). Then, heat transfer rates and pressure drops under a fixed flow rate were estimated to optimize hydrodynamic and thermal characteristics. Through this experiment, we found out that the optimal factor is a=1.75, given that the differences in heat transfer among the devices are marginal when compared to the variances in pumping power. This work is expected to contribute to the development of high-performance, high-efficiency thermal management systems required in various industrial fields.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2666-2671
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• 2007

This work presents microchannel heat sink shape optimization procedure using Kriging method. Design variables relating to microchannel width, depth and fin width are selected, and thermal resistance has been taken as objective function. Design points are selected through a three-level fractional factorial design of sampling method. Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with experimental results. Using the numerically evaluated objective function, a surrogate model (Kriging) is constructed and optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of microchannel heat sink under constant pumping power.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.9
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• pp.733-740
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• 2007

Microchannel heat sink shape optimization is performed using Kriging method. Design variables relating to microchannel width, depth and fin width are selected, and thermal resistance has been taken as objective function. Design points are selected through a three-level fractional factorial design of sampling method. Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with experimental results. Using the numerically evaluated objective function, a surrogate model (Kriging) is constructed and optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of microchannel heat sink under constant pumping power.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2544-2547
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• 2008

A micro channel heat sink has been studied and optimized for mixed pressure driven and electroosmotic flows through three-dimensional numerical analysis. The effects of ionic concentration represented by zeta potential and Debye thickness are studied with the various steps of externally applied electric potential. Optimization of the micro channel heat sink has been performed considering two design variables related to the micro channel width, depth and fin width. The surrogate-based optimization is performed using a search algorithm taking overall thermal resistance as objective function. The thermal resistance is found to be more sensitive to channel width-to-depth ratio than fin width-to-depth of channel ratio.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.1870-1875
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• 2007

The microchannel heat sink is promising heat dissipation method for high heat flux source. Contrary to conventional circular channel, MEMS based microchannel had rectangular or trapezoidal cross-sectional shape. In our study, we conducted three dimensional conjugate heat transfer calculation for rectangular shape microchannel. First, we simulated that channel was completely drained with known heating power. As a result we obtained calibration line, which indicates heat loss was function of temperature. Second, we simulated single phase heat transfer with various mass flux, 100-400 $kg/m^2s$. In conclusion, the single phase test verified that the present heat loss evaluation method is applicable to micro scale heat transfer devices. Heat fluxes from each side wall shows difference due to non-uniform heating. However those ratios were correlated with supplied total heat. Finally, we proposed effective area correction factor to evaluate appropriate heat flux.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.24 no.12
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• pp.1635-1643
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• 2000

The present work investigates a heat transfer phenomenon at the interface between a porous medium and an impermeable wall. In an effort to appropriately describe the heat transfer phenomenon at the interface, the heat transfer at the interface between the microchannel heat sink, which is an ideally organized porous medium, and the finite-thickness substrate is examined. From the examination, it is clarified that the he heat flux distribution at the interface is not uniform for the impermeable wall with finite thickness. On the other hand, the first approach, based on the energy balance for the representative elementary volume in the porous medium, is physically reason able. When the first approach is applied to the thermal boundary condition, and additional boundary condition based on the local thermal equilibrium assumption at the interface is used. This additional boundary condition is applicable except for the very th in impermeable wall. Hence, for practical situations, the first approach in combination with the local thermal equilibrium assumption at the interface is suggested as an appropriate thermal boundary condition. In order to confirm our suggestion, convective flows both in a microchannel heat sink and in a sintered porous channel subject to a constant heat flux condition are analyzed. The analytically obtained thermal resistance of the microchannel heat sink and the numerically obtained overall Nusselt number for the sintered porous channel are shown to be in close agreement with available experimental results when our suggestion for the thermal boundary conditions is applied.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1247-1252
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• 2004

The present paper is devoted to the modeling method based on an averaging approach for thermal analysis of microchannel heat sinks subjected to the uniform wall temperature condition. Solutions for velocity and temperature distributions are presented using the averaging approach. When the aspect ratio of the microchannel is higher than 1, these solutions accurately evaluate thermal resistances of heat sinks. Asymptotic solutions for velocity and temperature distributions at the high-aspect-ratio limit are alsopresented by using the scale analysis. Asymptotic solutions are simple, but shown to predict thermal resistances accurately when the aspect ratio is higher than 10. The effects of the aspect ratio and the porosity on the friction factor and the Nusselt number are presented. Characteristics of the thermal resistance of microchannel heat sinks are also discussed.