• Title/Summary/Keyword: Microchannel Heat Sink

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Study on the Averaging Approach for Microchannel Heat Sinks for Electronics Cooling (평균 접근법을 이용한 전자 장치 냉각용 마이크로 채널 히트 싱크에 대한 연구)

  • Kim, Dong-Kwon;Kim, Sung-Jin
    • Proceedings of the KSME Conference
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    • 2004.04a
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    • pp.1430-1435
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    • 2004
  • The present paper is devoted to the modeling based on an averaging approach for microchannel heat sinks. Firstly, analytic solutions for velocity and temperature distributions for low-aspect-ratio microchannel heat sinks are presented by using the averaging approach. When the aspect ratio of the microchannel is smaller than 1, analytic solutions accurately evaluate thermal resistances of heat sinks while the previous model cannot predict thermal resistances. Secondly, asymptotic solutions for velocity and temperature distributions at low-aspect-ratio limit and at high-aspect-ratio limit are presented by using the scale analysis. Asymptotic solutions are very simple, but shown to predict thermal resistances accurately.

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Study of Chip-level Liquid Cooling for High-heat-flux Devices (고열유속 소자를 위한 칩 레벨 액체 냉각 연구)

  • Park, Manseok;Kim, Sungdong;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.2
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    • pp.27-31
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    • 2015
  • Thermal management becomes a key technology as the power density of high performance and high density devices increases. Conventional heat sink or TIM methods will be limited to resolve thermal problems of next-generation IC devices. Recently, to increase heat flux through high powered IC devices liquid cooling system has been actively studied. In this study a chip-level liquid cooling system with TSV and microchannel was fabricated on Si wafer using DRIE process and analyzed the cooling characteristics. Three different TSV shapes were fabricated and the effect of TSV shapes was analyzed. The shape of liquid flowing through microchannel was observed by fluorescence microscope. The temperature differential of liquid cooling system was measured by IR microscope from RT to $300^{\circ}C$.

Study on Local Thermal Equilibrium in a Porous Medium (다공성 매질에서 Local Thermal Equilibrium에 관한 연구)

  • Jang, Seok-Pil;Kim, Seong-Jin
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.26 no.8
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    • pp.1172-1182
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    • 2002
  • In the present study a general criterion for local thermal equilibrium is presented in terms of parameters of engineering importance which include the Darcy number, the effective Prandtl number of fluid, and the Reynolds number. For this, an order of magnitude analysis is performed for the case when the effect of convection heat transfer is dominant in a porous structure. The criterion proposed in this study is more general than the previous criterion suggested by Carbonell and Whitaker, because the latter is applicable only when conduction is the dominant heat transfer mode in a porous medium while the former can be applied even when convection heat transfer prevails. In order to check the validity of the proposed criterion for local thermal equilibrium, the forced convection phenomena in a porous medium with a microchanneled structure subject to an impinging jet are studied using a similarity transformation. The proposed criterion is also validated with the existing experimental and numerical results for convection heat transfer in various porous materials that include some of the parameters used in the criterion such as a microchannel heat sink with a parallel flow, a packed bed, a cellular ceramic, and a sintered metal. It is shown that the criterion presented in this work well-predicts the validity of the assumption of local thermal equilibrium in a porous medium.

Numerical Study on Flow and Heat Transfer Enhancement during Flow Boiling in Parallel Microchannels (병렬 미세관 흐름비등의 유동특성 및 열전달 향상에 대한 수치적 연구)

  • Jeon, Jin-Ho;Lee, Woo-Rim;Suh, Young-Ho;Son, Gi-Hun
    • 한국전산유체공학회:학술대회논문집
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    • 2008.03b
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    • pp.472-473
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    • 2008
  • Flow boiling in parallel microchannels has received attention as an effective heat sink mechanism for power-densities encountered in microelectronic equipment. the bubble dynamics coupled with boiling heat transfer in microchannels is still not well understood due to the technological difficulties in obtaining detailed measurements of microscale two-phase flows. In this study, complete numerical simulation is performed to further clarify the dynamics of flow boiling in microchannels. The level set method for tracking the liquid-vapor interface is modified to include the effects of phase change and contact angle. The method is further extended to treat the no-slip and contact angle conditions on the immersed solid. Also, the reverse flow observed during flow boiling in parallel microchannels has been investigated. Based on the numerical results, the effects of channel shape and inlet area restriction on the bubble growth, reverse flow and heat transfer are quantified.

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