• Transactions of Materials Processing
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• v.24 no.2
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• pp.83-88
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• 2015

For chromaticity correction, it is necessary to dispense high viscosity phosphor slurry since it greatly affects the performance of white LEDs. However, it is quite difficult to dispense high viscosity fluorescent materials. In the current study, micro-discharge electrostatic printing has been used for dispensing various high viscosity phosphor slurries. We have achieved dispersions of up to 50 µg using drop on demand (DOD) discharge experiments. The experiments were conducted with different combinations of process variables such as applied voltage, pneumatic pressure, and frequency.

• Journal of the Optical Society of Korea
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• v.11 no.3
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• pp.113-117
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• 2007

A LED light coupler is proposed for coupling light from a mini side LED of 0.4 mm height to a very thin (${\sim}0.3 mm$) light guide. Due to the ultra thinness of the light guide, conventional light couplings between LEDs and light guides do not provide adequate coupling efficiency. The designed LED coupler is a compound lens of 3.5 mm length, 1.2 mm height, and 3.3 mm width. The courier first collimates the light from the LED and then concentrates the light in a manner similar to a compound parabolic concentrate, (CPC) into the light guide. The exit surface of the coupler is additionally textured to have micro patterns in order to control the radiance profile.

• Journal of Digital Convergence
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• v.13 no.6
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• pp.267-273
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• 2015

Recently, a wide range of products incorporating cutting-edge technology are being introduced in various sectors of design. Belkin's WeMo or Phillips' Hue are representative examples. In this context, the color-responsive lighting bookcase is a design product that would satisfy the needs of contemporary consumers who seek entertainment in their purchases. By installing lightings that change color according to the user's behavior, this design reconceptualizes the bookcase as a source of entertainment rather than a mundane object of household furnishing. The lighting apparatus can be detached and reattached, serving as stand-alone equipment. The lighting bookcase is modularized, comprising extensions equipped with MCU (Micro Controller Unit), RGB LED and color sensors. The bookcase as a whole is extendable towards four directions up to nine units with the lighting bookcase at the center. The extended, multiple lighting bookcases are wired to receive power from the main bookcase, and are equipped with RGB LEDs but not with MCUs or color sensors. Receiving power and color signals from the main lighting bookcase, the sub-bookcases feature changing shades of color. Also, it includes IoT(internet of Things). This study is a proposal of a design product, modularized to control the shades of the bookcase lighting using these sensors.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.8
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• pp.760-765
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• 2008

Low power laser therapy is internationally certified and is known to be effective in stimulating DNA in living organisms, increasing protein synthesis and activating cell division, smoothing blood circulation, promoting cell activation, cell regeneration and function. It also has anti-inflammatory, anti-edemic, anti-fibrous dysplastic and neuralogic hyperfunctional effects. This study was intended to verify the effect of LED irradiation therapy on wound healing in cell and animal tests by applying LED irradiator using a laser and laser diode, which was independently designed and developed to emit beams of similar wavelength to that of a laser. This equipment was fabricated using a micro-controller and a high brightness LED, and designed to enable us to control light irradiation time, intensity and reservation. In case of cell proliferation experiment, each experiment was performed to irradiation group and non-irradiation group for tissue cells. MTT assay method was chosen to verify the cell increase of two groups and the effect of irradiation on cell proliferation was examined by measuring 590 nm transmittance of micro-plate reader. In the wound healing experiment, 1$cm^2$ wounds on the skin wound of SD-Rat(Sprague-Dawley Rat) were made. Light irradiation group and none light irradiation group divided, each group was irradiated one hour a day for 9 days. As a result, the cell increase of tissue cells was verified in irradiation group as compared to non-irradiation group. And, compared with none light irradiation group, the lower incidence of inflammation and faster recovery was shown in light irradiation group.

• Korean Chemical Engineering Research
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• v.46 no.6
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• pp.1081-1086
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• 2008

QDs-LEDs(quantum dot light emitting device) should contain well-organized arrays of QDs on an electron transport layer. Thin films of CdSe/ZnS core-shell QDs were successfully fabricated on $TiO_2$ substrates by using PDMS stamp and micro contact printing method. 2-Carboxyethylphosphonic acid(CAPO) and 1,6-hexanedithiol(HDT) were employed as molecular linkers in assembling CdSe/ZnS core-shell QDs with high-density and uniform array. The CAPO increased the binding strength between the QDs and the substrates, and the HDT induced the strong inter-particle attractions of assembled QDs. The assembling properties of QDs thin films were characterized by SEM, AFM, optical microscope and photoluminescence spectroscope(PL).

• ETRI Journal
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• v.46 no.2
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• pp.347-359
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• 2024

A simultaneous transfer and bonding (SITRAB) process using areal laser irradiation is introduced for high-yield and cost-effective production of mini- or micro-light-emitting diode (LED) display panels. SITRAB materials are special epoxy-based solvent-free pastes. Three types of pot life are studied to obtain a convenient SITRAB process: Room temperature pot life (RPL), stage pot life (SPL), and laser pot life (LPL). In this study, the RPL was found to be 1.2 times the starting viscosity at 25℃, and the SPL was defined as the time the solder can be wetted by the SITRAB paste at given stage temperatures of 80℃, 90℃, and 100℃. The LPL, on the other hand, was referred to as the number of areal laser irradiations for the tiling process for red, green, and blue LEDs at the given stage temperatures. The process windows of SPL and LPL were identified based on their critical time and conversion requirements for good solder wetting. The measured RPL and SPL at the stage temperature of 80℃ were 6 days and 8 h, respectively, and the LPL was more than six at these stage temperatures.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.8
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• pp.731-735
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• 2007

We developed the 4channel Light Medical Therapy Apparatus for External Injury Cure using a high brightness LED. This equipment was fabricated using a micro-controller and a high brightness LED, and designed to enable us to control light irradiation time, intensity, frequency and so on, Especially, to control the light irradiation frequency, FPGA was used, and to control the change of output value, TLC5941 was used. Control stage is divided into 4 levels by program. Consequently, the current value could be controlled by the change of level in Continue Wave(CW) and the output of a high brightness LED could be controlled stage by stage. Compared with one LED irradiation, several LEDs irradiation could increase optical power.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.432-432
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• 2007

We studied optical simulation method for ultra slim backlight system. We designed 0.7mm thickness light guide plate and combined 48 white color LEDs for 12 inch wide size TFT-LCD. We designed flat shape PMMA light guide plate with both side patterned. It have vertical prism shape on upper side and ellipse dot pattern on the other side. We targeted 4500 nit brightness and uniform emission characteristic without hot spot or dark area. At first, we designed uniform emission area with more high brightness in center area and then, debugged light entering hot spot zone and direction of outgoing light flux. Although it was designing step, we obtained good result with reverse prism optical sheet and it had good repeatability because it was based on the stamper method in injection process without laser engraving or micro groove engraving method.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.3
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• pp.241-252
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• 2024

With the recent development of emerging technologies, information acquisition and delivery between users has been actively conducted, and inorganic thin film transfer technology that effectively transfers various materials and devices is being studied to develop flexible electronic devices accordingly. This is aimed at innovative structural changes and functional improvement of electronic devices in the era of the Internet of Things (IoT). In particular, advanced technologies such as microLEDs are used to realize high-resolution flexible displays, and the possibility of heterogeneous integrated technologies can be presented by precisely transferring materials to substrates through various transfer process. This paper introduced physical, chemical, and self-assembly transfer methods based on inorganic thin film materials to implement heterogeneous integrated flexible semiconductor systems and introduces the results of application studies of semiconductor devices obtained through different transfer technologies. These studies are expected to bring about innovative changes in the field of smart devices, medical technology, and user interfaces in the future.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.69-77
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• 2024

Due to the miniaturization and multifunctionality of electronic devices, a surface mount technology in the form of molded interconnect devices (MID), which directly forms electrodes and circuits on the plastic injection parts and mounts components and parts on them, is being introduced to overcome the limitations in the mounting area of electronic components. However, when using plastic injection parts with low thermal stability, there are difficulties in mounting components through the conventional reflow process. In this study, we developed a process that utilizes induction heating, which can selectively heat specific areas or materials, to melt solder and mount components without causing any thermal damage to the plastic. We designed the shape of an induction heating Cu coil that can concentrate the magnetic flux on the area to be heated, and verified the concentration of the magnetic flux and the degree of heating on the pad part through finite element method (FEM). LEDs, capacitors, resistors, and connectors were mounted on a polycarbonate substrate using induction heating to verify the mounting process, and their functionality was confirmed. We presented the applicability of a selective heating process through magnetic induction that can overcome the limitations of the reflow method.