• Journal of Powder Materials
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• v.22 no.3
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• pp.181-186
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• 2015

In this study, the effect of the friction stir welding (FSW) was compared with that of the gas tungsten arc welding (GTAW) on the microstructure and microhardness of Cu-Ni alloy weldment. The weldment of 10 mm thickness was fabricated by FSW and GTAW, respectively. Both weldments were compared with each other by optical microstructure, microhardness test and grain size measurement. Results of this study suggest that the microhardness decreased from the base metal (BM) to the heat affected zone (HAZ) and increased at fusion zone (FZ) of GTAW and stir zone (SZ) of FSW. the minimum Hv value of both weldment was obtained at HAZ, respectively, which represents the softening zone, whereas Hv value of FSW weldment was little higher than that of GTAW weldment. These phenomena can be explained by the grain size difference between HAZs of each weldment. Grain size was increased at the HAZ during FSW and GTAW. Because FSW is a solid-state joining process obtaining the lower heat-input generated by rotating shoulder than heat generated in the arc of GTAW.

• Transactions on Electrical and Electronic Materials
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• v.16 no.5
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• pp.268-273
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• 2015

While analyzing the specimens before and after the thermal shock test, we found that the power drop rate of the bare cell was 5.08%, while the power drop rate of the ribboned cell was 16.49%. In comparative terms, the efficiency was lower at the ribboned cell than at the bare cell. While analyzing through EL (Electroluminescence) shots and cross sections, we tried to decipher the exact cause of the power drop. Although mere color change of the cell was observed at the surface of the bare cell, no abnormality could be found inside the cell. On the surface of the ribboned cell, the short circuit of gridfinger extended from the front part of the front electrode of the ribboned cells. Therefore, cracks occurred on the surface of the cell. Cracks also appeared inside the cell. While analyzing the I-V curve, we determined an increase in the leakage current and an increase of resistances in series in the bare cell. In the ribboned cell, the resistances in parallel reduced remarkably. An increase of resistances in series could also be verified. Conclusively, we deduced that the power drop rate in the bare cell is a life span of the cell itself; aging is the cause of power drop rate in cells. In case of ribboned cell, the power drop rate was directly influenced by internal cracks and an intermetallic compound layer joining the ribbon at the front electrode.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.53-58
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• 2002

Electrical insulation and mechanical properties of the plasma sprayed oxide ceramic coatings were studied before and after the sealing treatment of the ceramic coatings. Plasma sprayed A1$_2$O$_3$-TiO$_2$ coating as the reference coating was sealed using three commercial sealants based on polymer. Penetration depth of the sealants to the ceramic coating was evaluated directly from the optical microscope using a fluorescent dye. It is estimated that the penetration depth of the sealants to the ceramic coating is from 0.2 to 0.5 mm depending on the sealants used. The preliminary test results with a DC puncture tester imply that the dielectric breakdown voltage mechanism of plasma sprayed ceramic coatings has been determined to be a corona mechanism. Dielectric breakdown voltage of the as-sprayed and as-ground samples have shown a linear trend with regard to the thickness showing an average dielectric strength of 20 kV/mm for the thickness scale studied. It is also shown that grinding the coating before sealing and adding fluorescent dye do not agent the penetration depth of sealants. All of the microhardness, two-body abrasive wear resistance, bond strength, and surface roughness of the ceramic coating after the sealing treatment are improved. The extent of improvement is different from the sealants used. However, three-point bending stress of the ceramic coating after the sealing treatment is decreased. This is attributed to the reduced micro-crack toughening effect since the cracks propagate easily through the lamellar of the coating without crack deflection and/or branching after the sealing treatment.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.561-569
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• 2002

Laser has been called a "Quantum Machine" because of its mechanism of generation since the development on July 7,1960.by T.H.Maiman. We can now use this machine as a tool for manufacturing in industries. At present, 45kW CO2 laser, 10kW Nd:YAG laser, 6kW LD pumped YAG laser and 4kW direct diode laser facilities are available for welding a heavy steel plate of 40mm in thickness and for cutting metals at high speed of 140m/min. Laser Materials Processing is no longer a scientific curiosity but a modern tool in industries. Lasers in manufacturing sector are currently used in welding, cutting, drilling, cladding, marking, cleaning, micro-machining and forming. Recently, high power laser diode, 10kW LD pumped YAG laser, 700W fiber laser and excimer laser have been developed in the industrialized countries. As a result of large numbers of research and developments, the modem laser materials processing has been realized and used in all kinds of industries now. In the present paper, metallurgical studies on laser materials processing such as porosity formation, hot cracking and the joint performances of steels and aluminum alloys and dissimilar joint are discussed after the introduction of laser facilities and laser applications in industries such as automotive industry, electronics industry, and steel making industry. The wave towards the use of laser materials processing and its penetration into many industries has started in many countries now. Especially, development of high power/quality diode laser will be accelerate the introduction of this magnificent tool, because of the high efficiency of about 50%, long life time and compact.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.30-30
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• 2010

고강도강의 용접성은 저온균열 저항성으로 대변되는데, TMCP강과 HSLA강 등이 개발되면서 고강도강의 저온균열저항성이 크게 향상되어 무예열 용접성이 확보되었다. 그러나 용접재료 측면에서는 그에 상응하는 재료의 개발이 지연되어 강재 개발로 인한 우수한 성능을 충분히 발휘하지 못하고 있으며 용접부의 건전성 문제가 심각하게 인식되고 있다. 이로 인해 고강도강에 적용시킬 수 있는 무예열 용접재료의 필요성이 대두되어 개발이 진행되고 있으며 상용화를 앞두고 있다. 이러한 용접재료의 개발단계에서 합금설계는 가장 중요한 항목으로 합금 조성에 따라 용착금속의 강도 및 인성에 상당한 변화를 가져오기 때문이다. 합금원소 중 Al은 강재의 탈산을 돕기 때문에 가능한 많은 양의 첨가를 요구하지만 적정량 이상을 초과하게 되면 오히려 용착금속의 저온인성 특성에 부정적인 영향을 미치게 된다. 본 연구에서는 고강도 GMA 용착금속의 Al함량을 단계적으로 변화시켜 용착금속 내 최적의 Al의 함량을 찾고자 하였다. 또한 높은 비용 및 많은 시간을 필요로 하는 와이어로드를 제작하지 않고도 Al함량을 조절 할 수 있는 방법을 고안하고자 하였다. 실험의 모재는 HSLA-100강을 사용하였으며 용접재료는 ER120S-G급의 GMA용접 재료를 사용하였다. 모재 성분과의 희석을 방지하기 위해 V-Groove 가공 후 6패스 Buttering 용접을 실시하였고, 다시 Buttering용접부에 V-Groove 가공을 하여 최종 용접을 실시하였다. 이 때 Al함량을 조절하기 위해 최종 용접 개선부 밑면에 홈을 판 후 Al fiber(직경 0.3mm)를 깔고 용접(입열량 20kJ/cm)하여 Al함유량을 총 3가지(0.003~0.04% Al)로 제어하였다. 용접 후 각각의 시편에 대해 미세조직, 충격시험, O/N분석, 성분분석 등의 시험을 수행하여 저온인성과의 상관관계를 알아보았다.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.47-47
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• 2009

용착금속의 미세조직은 크게 Acicular ferrite(AF), Ferrite with aligned second phase(FS), Primary ferrite(=Grain boundary Ferrite) 등으로 나눌 수 있다. 이 중 침상형 페라이트(AF)는 인성과 강도를 동시에 증가시킬 수 있으므로 이를 다량 확보하는 것이 용접산업의 관건이다. 본 연구에서는 침상형 페라이트 발생에 기여한다고 알려진 Ti 함량을 용착금속에서 단계적으로 조절하여 나타나는 미세조직과 특성변화를 관찰하였다. 모재는 HSB-600을 사용하였으며 용접재료는 ER100S-G급의 Ti가 함유되어 있는 것(A)과 미함유된 것(B)을 사용하였다. 모재 성분의 희석을 방지하기 위해 V-Groove 가공 후 Buttering 용접을 실시하였다. 중앙에 가공된 V-그루브에 이들 재료를 적절히 조합하고 용접(입열량 20kJ/cm)하여 Ti함유량을 총 4가지(0.002~0.025% Ti)로 제어하였다. 용접 후 각각의 시편에 대해 미세조직, 충격시험, O/N분석, 성분분석 등의 시험을 진행하였다. 미세조직 관찰결과 Ti함량이 증가할수록 AF는 증가하고 FS는 감소함을 확인할 수 있었으며 충격시험결과 Ti가 많이 함유된 시편일수록 더 낮은 연성취성 천이온도(DBTT)를 나타내었다. EDS와 SEM으로 관찰한 결과 Ti함량 증가에 따라 비금속개재물의 크기는 작아지고 밀도는 높아지는 것을 확인할 수 있었으며 개재물 내에서의 Ti함량도 더 많아지는 것을 확인 할 수 있었다.

• Molecules and Cells
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• v.23 no.2
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• pp.228-238
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• 2007

Since molecular structure of hnRNP is not available in foreseeable future, it is best to construct a working model for hnRNP structure. A geometric problem, assembly of $700{\pm}20$ nucleotides with 48 proteins, is visualized by a frame work in which all the proteins participate in primary binding, followed by secondary, tertiary and quaternary binding with neighboring proteins without additional import. Thus, 40S hnRNP contains crown-like secondary structure (48 stemloops) and appearance of 6 petal (octamers) rose-like architectures. The proteins are wrapped by RNA. Co-transcriptional folding for RNP fibril of FMR1 gene can produce 2,571 stem-loops with frequency of 1 stem-loop/15.3 nucleotides and 53 40S hnRNP beaded structure. By spliceosome driven reactions, there occurs removal of 16 separate lariated RNPs, joining 17 separate beaded exonic structures and anchoring EJC on each exon junction. Skipping exon 12 has 5'GU, 3'AG and very compact folding pattern with frequency of 1 stem-loop per 12 nucleotides in short exon length (63 nucleotides). 5' end of exon 12 contains SS (Splicing Silencer) element of UAGGU. In exons 10, 15 and 17 where both regular and alternative splice sites exist, SS (hnRNP A1 binding site) is observed at the regular splicing site. End products are mature FMR-1 mRNP, 4 species of Pri-microRNAs derived from introns 7,9,15 and 3'UTR of exon17, respectively. There may also be some other regulatory RNAs containing ALU/Line elements as well.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.6
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• pp.1099-1107
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• 1992

The apparent strain of temperature self-compensated strain gages at cryogenic temperature is presented. By joining the international round robin test on electrical strain gages at cryogenic temperatures, apparent strain curves of up to the fourth order with respect to the temperature are obtained with different strain gages and different materials. The liquid nitrogen and the liquid helium are employed to get the cryogenic environment. The results can be effectively utilized to determine the real strains by mechanical loading at cryogenic temperature. This paper also describes the optimal selection of strain gages and test materials for the use of strain gages at cryogenic temperature.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.7-16
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• 2022

Recently, the automobile industry is rapidly changing due to technological development. Next-generation cars with high technology and new functions are on the market. It is essential to develop electronic devices to meet the condition of next-generation cars. In this study, the authors have reviewed recent trends of automotive electronics and packaging technology. Automotive electronics are used in harsh environments compared with other industries. Thus, it is important to improve the reliability of device junctions that directly affect electronics performance. Soldering, TLP (transient liquid phase bonding), and sintering are introduced for the bonding methods in car electronics.