• Title/Summary/Keyword: Micro-grooving machine

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Effect of the Number of Nozzle Scanning in Micro-Line Grooving of Glass by Powder Blasting (Powder Blasting을 이용한 유리의 미세 선형 홈 가공시 노즐 주사 횟수의 영향)

  • 박경호;김광현;최종순;박동삼
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2001.04a
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    • pp.294-299
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    • 2001
  • The old technique of sandblasting which has been used for decoration of glass surface has recently been developed into a powder blasting technique for various materials, capable of producing micro structures larger than 100 m. This paper describes the performance of powder blasting technique in micro-line grooving of glass and the effect of the number of nozzle scanning on the depth and width of line groove. Experimental results showed that increasing the no. of nozzle scanning resulted in the increase of depth and width in grooves. Increase of width which may cause several problems in the precision machining results from wear of mask film.

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Minimization of Pattern Size on Polycarbonate Material in V-grooving (PC 폴리머 재료의 미세 V-홈 절삭가공 시 패턴 크기 최소화)

  • Kim, Gi-Dae
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.5
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    • pp.523-527
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    • 2011
  • Polycarbonate (PC) polymer is an engineering plastic which has large tensile strength and impact resistance and is wildly used as functional parts like micro mold. Direct machining of PC materials produces lots of burrs and rough surface due to large ductility and weak heat resistance and hence it is very difficult to machine PC materials using cutting tool to make micro-parts. In this study, elliptical vibration cutting (EVC) or 2-dimensional vibration cutting was performed to minimize the size of micro V-grooves on PC material. From the experimental results, it was observed that as the cutting depth and pattern size become smaller, the better machining quality was obtained, which is attributed to the positive effect of EVC that is dependent on the ratio of vibration amplitude to cutting depth. As the height of V-groove becomes less than $1.8{\mu}m$, however, the machining quality becomes lower as the pattern size decreases.

Micro-groove machining of SUS304 using by femto second laser (펨토초 레이저를 이용한 SUS304 의 마이크로 홈가공)

  • Kwak T.S.;Ohmori H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1179-1180
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    • 2005
  • 3D micro scaled shapes are fabricated with the method of direct writing and superposing grooving in ambient air using femto-second laser pulses and copper, aiming at establishing an industrially useful femto-second laser processing machine to be able to fabricate three dimensional micro-scale structures, especially micro scaled molds, and processing techniques. For the several advantages, there is no thermally influenced region around the area irradiated by the laser beam and surfaces irradiated laser beam are smooth and substances ablated to form are no attached on the surface of works and so on, the femto-second laser technology is anticipated for advanced micro/nano precision technology.

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Micro Turning on Face using Elliptical Vibration Cutting (타원궤적 진동절삭법을 이용한 미세 면선삭)

  • Kim, Gi-Dae;Loh, Byoung-Gook
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.1
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    • pp.82-88
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    • 2009
  • Ultra-precision turning is highly needed to manufacture molds for precision lens. In this study, micro-turning combined with elliptical vibration cutting (EVC), which is known to enhance micro- machining quality, was investigated by installing a rotary stage into the micro-grooving machine. From machining experiments involving materials of copper, brass, and aluminum and single and poly crystalline diamond tools, it was found that EVC produced thinner and curlier chips and that better surface finish could be achieved, compared with conventional turning, owing to prohibition of formation of burrs and built-up edges. Therefore, we found EVC micro turning could be readily utilized to manufacture precision mold.

A Study on the minimizing of cutting depth in sub-micro machining (초정밀 절삭에서의 가공깊이 최소화에 관한연구)

  • 손성민;허성우;안중환
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.04a
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    • pp.376-381
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    • 2003
  • Ultra precision diamond cutting is a very efficient manufacturing method for optical parts such as HOE, Fresnel lenses, diffraction lenses, and others. During micro cutting, the rake angle is likely to become negative because the tool edge radius is considerably large compared to the sub-micrometer-order depth of cut. Depending on the ratio of the tool edge radius to the depth of cut, different micro-cutting mechanism modes appear. Therefore, the tool edge sharpness is the most important factor affecting the qualities of machined parts. That is why diamond especially mono-crystal diamond, which has the sharpest edge among all other materials is widely used in micro-cutting. The question arises, given a diamond tool, what is the minimum (critical) depth of cut to get continuous chips while in the cutting process\ulcorner In this paper, the micro machinability around the critical depth of cut is investigated in micro grooving with a diamond tool, and introduce the minimizing method of cutting depth using vibration cutting. The experimental results show the characteristics of micro cutting in terms of cutting force ratio (Fx/Fy), chip shape, surface roughness, and surface hardeing around the critical depth of cut.

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Characterization of the Chemical Mechanical Micro Machining for Single Crystal Silicon (실리콘의 화학기계적 미세가공 특성)

  • Jeong, Sang-Cheol;Park, Jun-Min;Lee, Hyeon-U;Jeong, Hae-Do
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.1
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    • pp.186-195
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    • 2002
  • The mechanism of micro machining of reacted layer on silicon surface were proposed. The depth of reacted layer and the change of mechanical property were measured and analyzed. Depth of hydrated layer which is created on the surface of silicon by potassium hydrate was analyzed with SEM and XPS. The decrease of the micro victors hardness of silicon surface was shown with the increase of the concentration of potassium hydrate and the change of the dynamic friction coefficient by chemical reacted layer was measured due to the readiness of machining. The experiment of groove machining was done with 3-axis machine with constant load. With chemical mechanical micro machining the surface crack and burrs generated by both brittle and ductile micro machining were diminished. And the surface profile and groove depth was shown in accordance with the machining speed and reaction time with SEM and AFM.