• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.1
• /
• pp.35-41
• /
• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of micro-electronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder bump and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6/Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Journal of Electrical Engineering and Technology
• /
• v.13 no.1
• /
• pp.501-512
• /
• 2018

Radio frequency identification (RFID) sensor tag provides several advantages including battery-less operation and low cost, which are suitable for long-term monitoring. This paper presents a self-powered RFID temperature sensor tag for online temperature monitoring in substation. The proposed sensor tag is used to measure and process the temperature of high voltage equipments in substation, and then wireless deliver the data. The proposed temperature sensor employs a novel phased-locked loop (PLL)-based architecture and can convert the temperature sensor in frequency domain without a reference clock, which can significantly improve the temperature accuracy. A two-stage rectifier adopts a series of auxiliary floating rectifier to boost its gate voltage for higher power conversion efficiency. The sensor tag chip was fabricated in TSMC $0.18{\mu}m$ 1P6M CMOS process. The measurement results show that the proposed temperature sensor tag achieve a resolution of $0.15^{\circ}C$/LSB and a temperature error of $-0.6/0.7^{\circ}C$ within the range from $-30^{\circ}C$ to $70^{\circ}C$. The proposed sensor tag achieves maximum communication distance of 11.8 m.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11a
• /
• pp.171-175
• /
• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics and metal, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter level dielectrics and metal. Especially, defects like (micro-scratch) lead to severe circuit failure, and affects yield. Current conditioning method - bladder type, orbital pad motion - usually provides unsuitable pad profile during ex-situ conditioning near the end of pad life. Since much of the pad wear occurs by the mechanism of bladder tripe conditioning and its orbital motion without rotation, we need to implement new ex-situ conditioner which can prevent abnormal regional force on pad caused by bladder-type and also need to rotate the pad during conditioning. Another important study of ADPC is related to the orbital scratch of which source is assumed as diamond grit dropped from the strip during ex-situ conditioning. Scratch from diamond grit damaged wafer severely so usual1y scraped. Figure 1 shows the typical shape of scratch damaged from diamond. We suspected that intensive forces to the edge area of bladder type stripper accelerated the drop of Diamond grit during conditioning, so new designed Flat stripper was introduced.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.17 no.5
• /
• pp.269-274
• /
• 2016

This paper proposes the development of a low frequency electronic hammer drive system that is used to prevent scaling or clogging in the hopper process. The electro-mechanical hammering driving method involves the generation of vibration and impact energy. The operation principles of the electromagnetic hammer were considered by parallel/series spring coefficient analysis and the amount of kinetic energy generated was calculated from the product of the equivalent spring constant, which is coupled with the E core and the gap of between the E core and I core. In addition, the Pulsation Driving algorithm was applied to the proposed electromagnetic hammer to obtain the maximizing kinetic energy. This algorithm was then implemented by a logical AND operation process and micro-controller (atmega128) built in functions with a timer interrupt and PWM generation function. The driving circuit of the electromagnetic hammer was designed using the H-bridge type IGBT circuit. The experimental test was performed by usefulness of the developed electromagnetic hammer systems with the acceleration measurement method. The experimental result showed that the proposed system has good kinetic energy generation performance and can be applied to the hopper process.

• Journal of Welding and Joining
• /
• v.23 no.6
• /
• pp.49-54
• /
• 2005

Inner Structured and Bonded(ISB) panel, a kind of metallic sandwich panel, consists of two thin skin plates bonded to a micro-patterned inner structure. Its overall thickness is $1\~3mm$and it has attractive properties such as ultra-lightweight, high efficiency in stiffness-to-weight and strength-to-weight ratio. In many previous studies, resistance welding, brazing and adhesive bonding are studied for joining the panel. However these methods did not consider productivity, but focused on structural characteristics of joined panels, so that the joining process is very complicated and expensive. In this paper, a new joining process with resistance welding is developed. Curved surface electrodes are used to consider the productivity and the stopper is used between electrodes during welding time to maintain the shape of inner structure. Welding time, gap of electrodes and distance between welding points are selected as the process parameters. By measuring the tensile load with respect to the variation of welding time and gap of electrodes, proper welding conditions are studied. Welding time is proper between 1.5-2.5cycle. If welding time is too long, then inner structures are damaged by overheating. Gap of electrode should be shorter than threshold value fur joint strength, when total thickness of inner structure and skin plate is 3.3mm, the threshold distance is 3.0mm.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.23 no.7
• /
• pp.771-778
• /
• 2019

The traditional illuminance intensity detection method using a single sensor has a problem that uniformity of illuminance detection is deteriorated depending on the measurement position due to the narrow FOV characteristic. In order to overcome this problem, a method of detecting an average illuminance value through a plurality of illuminance sensors is used, but the complexity and detection error are increased. In this paper, we propose a illuminance intensity detection method based on a single image sensor with wide FOV. The proposed method can solve the problems such as system complexity and error increase of existing illuminance sensor. The test results show that the difference of average value is 12% using a illuminance sensor, 10.7% using five illuminance sensors, and 6.2% using an image sensor compared with the reference value using the color difference illuminometer. It is confirmed that the proposed method can easily and accurately detect the space illuminance with improved uniformity.

• International journal of advanced smart convergence
• /
• v.7 no.4
• /
• pp.50-56
• /
• 2018

The Internet of Things (IoT) and Visible Light Communication (VLC) is opening up new services in lighting industry by integrating sensory network features in addition to standard illumination functionality. In this progressive developments, the next generation lighting devices for smart homes are capable to sense the environmental conditions and transfer the captured data through lights to gateway controller to access remotely. The smart home environmental sensor information's are few kbps only so VLC systems need to built-in with low rate light connectivity to transfer data to the gateway. To provide error free communication, the quality of a received light signal is important to be considered when designing an VLC receiver. Therefore, this paper proposes the design of robust low rate IoL receiver design using NCP302 voltage detector for micro controller to adapt the IoT/IoL front end module for system integration. To evaluate the proposed system performance, the Arduino UNO based IoT/IoL controller designed with lighting, sensors and lights connectivity interfaces. The experimental result shows that the robust interference rejection is feasible on proposed VOL receiver and possible to have an error-free communication up to 10 kbps at a low SNR using OOK modulation.

• The Journal of the Korea institute of electronic communication sciences
• /
• v.14 no.3
• /
• pp.619-626
• /
• 2019

The advances of semiconductor and circuitry technology dovetailed with nano processing techniques have further enhanced micro-miniaturization, sensitivity, longevity and reliability in MID(Medical Implant Device). Nevertheless, one of the remaining challenges is whether power can sufficiently and continuously be supplied for the operation of the MID. Self-powered MID that harvest biomechanical energy from human motion, respiratory and muscle movement are part of a paradigm shift. In this paper, we developed a rechargeable pacemaker through self-power generation with the triboelectric nanogenerator. We demonstrate a fully implanted pacemaker based on an implantable triboelectric nanogenerator, which act as a storage as well as active movement on a large-animal(dog) scale. The self-power pacemaker harvested from animal motion is 2.47V, which is higher than the required pacemaker device sensing voltage(1.35V).

• Current Optics and Photonics
• /
• v.5 no.2
• /
• pp.147-154
• /
• 2021

Microfluidic chip technology is a research focus in biology, chemistry, and medicine, for example. However, microfluidic chips are rarely applied in imaging, especially in ghost imaging. Thus in this work we propose a ghost-imaging system, in which we deploy a novel microfluidic chip modulator (MCM) constructed of double-layer zigzag micro pipelines. While in traditional situations a spatial light modulator (SLM) and supporting computers are required, we can get rid of active modulation devices and computers with this proposed scheme. The corresponding simulation analysis verifies good feasibility of the scheme, which can ensure the quality of data transmission and achieve convenient, fast ghost imaging passively.

• Journal of the Semiconductor & Display Technology
• /
• v.20 no.2
• /
• pp.92-97
• /
• 2021

The importance of processes in cryogenic environments is increasing in a way to address problems such as critical dimension (CD) narrow and bottlenecks in micro-processing. Accordingly, in this paper, we proceed with the design and analysis of Electrostatic Chuck(ESC) and Coolant in cryogenic environments, and present optimal model conditions to provide the temperature distribution analysis of ESC in these environments and the appropriate optimal design. The wafer temperature uniformity was selected as the reference model that the operating conditions of the refrigerant of the liquid nitrogen in the doubled aluminum path were excellent. Design of simulation (DOS) was carried out based on the wheel settings within the selected reference model and the classification of three mass flow and diameter case, respectively. The comparison between factors with p-value less than 0.05 indicates that the optimal design point is when five turns of coolant have a flow rate of 0.3 kg/s and a diameter of 12 mm. ANOVA determines the interactions between the above factor, indicating that mass flow is the most significant among the parameters of interests. In variable selection procedure, Case 2 was also determined to be superior through the two-Sample T-Test of the mean and variance values by dividing five coolant wheels into two (Case 1 : 2+3, Case 2: 3+2). Finally, heat transfer analysis processes such as final difference method (FDM) and heat transfer were also performed to demonstrate the feasibility and adequacy of the analysis process.