• 반도체디스플레이기술학회지
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• 제12권4호
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• pp.39-44
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• 2013

In the semiconductor heat-treatment process, the temperature uniformity determines the film quality of a wafer. This film quality effects on the overall yield rate. The heat transfer of the wafer surface in the heat-treatment process equipment is occurred by convection and radiation complexly. Because of this, there is the nonlinearity between the wafer temperature and reactor. Therefore, the accurate prediction of temperature on the wafer surface is difficult without the direct measurement. The thermal camera and the T/C wafer are general ways to confirm the temperature uniformity on the heat-treatment process. As above ways have limit to measure the temperature in the precise domain under the micro-scale. In this study, we developed the thin film type temperature sensor using the MEMS technology to establish the system which can measure the temperature under the micro-scale. We combined the experiment and numerical analysis to verify and calibrate the system. Finally, we measured the temperature on the wafer surface on the semiconductor process using the developed system, and confirmed the temperature variation by comparison with the commercial T/C wafer.

• 반도체디스플레이기술학회지
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• 제21권3호
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• pp.119-124
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• 2022

Top emission organic light-emitting diode (TEOLED) is commonly used because of high efficiency and good color purity than bottom - emission organic light-emitting device (BEOLED). Unlike BEOLED, TEOLED contain semitransparent metal cathode and capping layer. Because there are many characteristics to consider just simple thickness change, optimizing organic thickness of TEOLED for microcavity is difficult. So, in this study, we optimized Device capping layer at unoptimized micro-cavity structure TEOLED device. And we compare only capping layer with unoptimized microcavity structure can overcome optimized micro-cavity structure device. We used previous our optimized micro-cavity structure to compare each other. As a result, it has been found that the efficiency can be obtained almost the same or higher only capping layer, which is stacked on top of the device and controls only the thickness and refractive index, without complicated structural calculations. This means that higher efficiencies can be obtained more easily in laboratories with limited organic materials or when optimizing new structures etc.

• 반도체디스플레이기술학회지
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• 제21권1호
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• pp.91-94
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• 2022

Top emission organic light-emitting diode is commonly used because of high efficiency and good color purity than bottom - emission organic light-emitting device. Unlike BEOLED, TEOLED contain semi-transparent metal cathode. Because of semi-transparent cathode, micro cavity effect occurs in TEOLED. We optimized this effect by changing the thickness of hole injection layer. Device consists of is indium-tin-oxide / N,N'-Di-[(1-naphthyl)-N,N'-diphenyl]-1,1'-biphenyl-4,4'-diamine (x nm) / tris-(8-hydroxyquinoline) aluminum (50nm) / LiF(0.5nm) / Mg:Ag (1:9), and we changed NPB thickness which is used as HTL in our device in order to study how micro cavity effects are changed by optical path. As the results, NPB thickness at 35nm showed the current efficiency of 8.55Cd/A.

• 공학기술논문지
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• 제5권4호
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• pp.349-353
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• 2012

Recently, Mobile multimedia equipments as smart phone and tablet pc requirement is increasing and this market is also being expanded. These mobile equipments require large multi-media function, so more power consumption is required. For these reasons, the needs of power management IC as switching type dc-dc converter and linear regulator have increased. DC-DC buck converter become more important in power management IC because the operating voltage of VLSI system is very low comparing to lithium-ion battery voltage. There are many people to be concerned about digital DC-DC converter without using external passive device recently. Digital controlled DC-DC converter is essential in mobile application to various external circumstance. This paper proposes the DC-DC Buck Converter using the AVR RISC 8-bit micro-processor control. The designed converter receives the input DC 18-30 [V] and the output voltage of DC-DC Converter changes by the feedback circuit using the A/D conversion function. Duty ratio is adjusted to maintain a constant output voltage 12 [V]. Proposed converter using the micro-processor control was compared to a typical boost converter. As a result, the current loss in the proposed converter was reduced about 10.7%. Input voltage and output voltage can be displayed on the LCD display to see the status of the operation.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1125-1128
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• 2007

The laminating technique for developing flexible liquid crystal display was demonstrated by using a thin UV curable polymer film and a plastic substrate with patterned polymer wall structure. We adopted the rigid wall structure to provide a solid mechanical support for the stable molecular alignment of liquid crystals (LCs) in the device. The cover film was prepared to have an ability of aligning LC molecules by patterning a micro-groove structure using the soft-lithographic process. These two substrates can be assembled tightly by the laminating and one-step UV irradiation process because of the adhesive nature of the used UV curable polymers. Proposed method can be used to fabricate the flexible LC display with simplicity and also be applicable for a cost-effective roll-to-roll process.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.733-736
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• 2007

We have proposed novel bonding technique of substrates for developing the flexible LCD with high quality. The gel type mixture of agarose and UV curable epoxy developed to obtain tight bonding ability and enhanced electro-optical characteristic simultaneously. This technique can be used to roll-to-roll process for fabricating the flexible LCDs.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.352-355
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• 2007

We have developed tight bonding of plastic LCD with new rigid spacer. For tight bonding of two plastic substrates, we designed structures to collect UV or thermal epoxy placed on the top of rigid spacer spontaneously by capillary effect. We confirmed that tight bonded plastic LCD has a good adhesion without induced defects and a high mechanical stability against the various external deformations. This method can be applicable to the fabrication of large plastic LCDs using stamping process.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.285-288
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• 2002

We propose the use of synchronously moving micro-optics (lenslet arrays) for image pickup and display in three-dimensional integral imaging to overcome the upper resolution limit imposed by the Nyquist sampling theorem. With the proposed technique, we present an all-optical three-dimensional integral imaging projector. An optically addressed spatial light modulator is used, which potentially provides better image resolution than the conventional CCD and liquid crystal display pair. We present experimental results using a liquid crystal light valve.

• Structural Engineering and Mechanics
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• 제45권4호
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• pp.543-568
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• 2013

This study explores the floor micro-vibrations induced by the automated guided vehicles (AGVs) in liquid-crystal-display (LCD) factories. The relationships between moving loads and both the vehicle weights and speeds were constructed by a modified Kanai-Tajimi (MKT) power spectral density (PSD) function whose best-fitting parameters were obtained through a regression analysis by using experimental acceleration responses of a small-scale three-span continuous beam model obtained in the laboratory. The AGV induced floor micro-vibrations under various AGV weights and speeds were then assessed by the proposed regressional MKT model. Simulation results indicate that the maximum floor micro-vibrations of the target LCD factory fall within the VC-B and VC-C levels when AGV moves at a lower speed of 1.0 m/s, while they may exceed the acceptable VC-B level when AGV moves at a higher speed of 1.5 m/s. The simulated floor micro-vibration levels are comparable to those of typical LCD factories induced by AGVs moving normally at a speed between 1.0 m/s and 2.0 m/s. Therefore, the numerical algorithm that integrates a simplified sub-structural multi-span continuous beam model and a proposed regressional MKT moving force model can provide a satisfactory prediction of AGV-induced floor micro-vibrations in LCD factories, if proper parameters of the MKT moving force model are adopted.

• 반도체디스플레이기술학회지
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• 제3권3호
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• pp.1-4
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• 2004

Fabrication and electrical and mechanical properties of piezoelectric micro bending actuators (PMBA) using sol-gel-multi-coated thick PZT films and MEMS processes were investigated. PMBA could be used for design and fabrication of micro fluidic devices, for example, micro-pumps, micro dispensers, and so on. PMBA were fabricated using 2 um thick PZT films on Pt (350 nm)/$SiO_2$ (500 nm)/Si ($300\mu\textrm{m}$) substrates and MEMS processes. 7 types of PMBA were fabricated with areas of silicon diaphragms, PZT films and top electrodes. When the sizes of silicon diaphragms, PZT films and Pt top electrodes were reduced from 3000$\times$$1389\mu\textrm{m}$, 4000$\times$$1000\mu\textrm{m}$ and 4000$\times$$900\mu\textrm{m}$ down to 14%, 14% and 11 % of them, respectively, the center displacements of PMBA were decreased from 0.68 um to 0.10 um at 5 Hz and 12 Vpp. So, PMBA with large areas showed larger displacements than PMBA with small areas and experimental results were also good agreement with the plate and shell theory.