• Structural Engineering and Mechanics
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• v.84 no.2
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• pp.253-268
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• 2022

Using non-destructive Acoustic Emission (AE) and optical Digital Image Correlation (DIC) methods, the moment-curvature behavior of steel and GFRP bars reinforced concrete beams under flexure was explored in this study. In the tension zone, laboratory studies were carried out on steel-RC and GFRP-RC beams with varying percentages of longitudinal reinforcement ratios of 0.33 %, 0.52%, and 1.11%. The distinct mechanism of cracking initiation and fracture progression of failure in steel-RC and GFRP-RC beams were effectively correlated and picked up using AE waveform characteristics of the number of AE hits and their amplitudes, AE energy as well as average frequency and duration. AE XY event plots and longitudinal strain profiles using DIC gives an online and real-time visual display of progressive AE activity and strains respectively to efficaciously depict the crack evolution and their advancement in steel-RC and GFRP-RC beams. They display a close matching with the micro and macro-cracks visually observed in the actual beams at various stages of loading.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

• Journal of the Semiconductor & Display Technology
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• v.23 no.1
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• pp.52-55
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• 2024

In this paper, a state change study was conducted through Frequency Domain Reflectometry (FDR) technology for the process chamber of plasma equipment for semiconductor manufacturing. In the experiment, by direct connecting the network analyzer to the RF matcher input of the 300 mm plasma enhanced chemical vapor deposition (PECVD) chamber, S11 was measured in a situation where plasma was not applied, and the frequency domain reacting to the chamber state change was searched. Response factors to changes in the status, such as temperature, spacing of the heating chuck, internal pressure difference, and process gas supply state were confirmed. Through this, the frequency domain in which a change in the reflection value was detected through repeated experiments. The reliability of the measured micro-displacement was verified through reproducibility experiments.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.5
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• pp.215-219
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• 2004

The effects of ambient temperature on the discharge characteristics of Ne-Xe based micro discharge cells for ac-PDP (plasma display panel) have been studied. In ramp voltage driving, which is generally used as a reset method of PDP, two dissimilar modes of strong and weak discharge were found. As the interval between the former sustaining discharge and ramp voltage discharge becomes greater, the probability of a strong discharge increases. This suggests that a sufficient number of priming particles is necessary for initiating weak mode (Townsend discharge). It was discovered that under higher ambient temperatures, weak discharge occurs more frequently. The discharge time lag observed in square pulse driving of single cells becomes surprisingly smaller under higher ambient temperatures for the constant gas number density condition.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.10a
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• pp.10-13
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• 2006

This paper describes on the fabrication and characteristics of a 3C-SiC (Silicon Carbide) micro pressure sensor for harsh environment applications. The implemented micro pressure sensor used 3C-SiC thin-films heteroepitaxially grown on SOI (Si-on-insulator) structures. This sensor takes advantages of the good mechanical properties of Si as diaphragms fabricated by D-RIE technology and temperature properties of 3C-SiC piezoresistors. The fabricated pressure sensors were tasted at temperature up to $250^{\circ}C$ and indicated a sensitivity of 0.46 mV/V*bar at room temperature and 0.28 mV/V*bar at $250^{\circ}C$. The fabricated 3C-Sic/SOI pressure sensor presents a high-sensitivity and excel lent temperature stability.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.10a
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• pp.150-153
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• 2006

Micro vibration isolation, typically originated from ground, is always a prime concern for the nano-measurement instruments such as Atomic Force Microscopes. A four mount active vibration isolation system is proposed in this paper. Modeling and control of such a four mount system as analyzed. Combined active-passive isolation principle is used for vibration isolation by mounting the instrument on a passively damped isolation system made of Elastomer along with the active stage in parallel that consists of very soft actuation system, the Voice Coil Motor. The active stage works in combination with the passive stage for working as a very low frequency vibration attenuator.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1193-1195
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• 2008

We propose a novel light guide plate for an edge-lit LED backlight. Properly designed micro-prisms enable light to go out of the LGP in near vertical direction and luminance fluctuations in front of the LEDs to be invisible.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.907-912
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• 2005

Micro-patterns of $Pb(Zr_{0.53}Ti_{0.47})O_3$, PZT, thin films with a MPB composition were deposited on $Pt/Ti/SiO_2/Si$ substrate from molecular-designed PZT precursor solution by using self-assembledmonolayer(SAM) as a template. This method includes deposition of SAM followed by the optical etching by exposing the SAM to the UV-light, leading to the patterned SAM as a selective deposition template. The pattern of SAM was formed by irradiating UV-light to the SAM on a substrate and/or patterned PZT thin film through a metal mask for the selective deposition of patterned PZT or lanthanum nickel oxide (LNO) precursor films from alkoxide-based precursor solutions. As a result, patterned ferroelectric PZT and PZT/LNO thin film capacitors with good electrical properties in micrometer size could be successfully deposited.

• 한국전산유체공학회:학술대회논문집
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• 2008.03b
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• pp.679-682
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• 2008

The particle which has two different characteristics on both sides is called Janus particle which is emerging as a key material in microscale transport systems. For example, if one hemisphere has polarity and the other does not, then nonpolar sides would attract each other so that a complex cluster is formed. Thus, this fascinating material can be used as an element of twisting ball panel display, complex micro-scale clusters, drug delivery unit, and active detecting beads. The keywords in developing Janus particle are size and uniformity. Former researches solved uniformity but downsizing still remains a problem. There are three methods to generate small size particles in microchannels: co-flowing, cross-flowing, and elongational flows. In this research, we generate Janus particles smaller than 10-${\mu}$m in diameter using elongational flow in microchannels. And we use UV initiator with Hydrogen UV source to solidify micro size particles. One hemisphere of the particle is coated with rhodamin for visualization.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.79-82
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• 2005

Fresnel lens has number of applications in the optical systems because of its advantages. It is nearly flat lens that has small weight. It is conventionally used in lighthouse beacons, condensing unit of overhead projector and etc. Recently, demands of small size optical systems such as display units, information storage systems, optical detecting units had increased. Conventional manufacturing process of high quality Fresnel lens is direct machining. But it is not suitable for mass production because of high cost and long cycle time. Replication process is more suitable for mass production. But the Fresnel lens has number of sharp blade shape prism. In the replication process, this blade shape causes defects that can affect optical efficiency. In this study, replication process of blade shape pattern that has maximum height of $280{\mu}m$, aspect ratio 1.4 for Fresnel lens application.