• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2544-2547
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• 2008

A micro channel heat sink has been studied and optimized for mixed pressure driven and electroosmotic flows through three-dimensional numerical analysis. The effects of ionic concentration represented by zeta potential and Debye thickness are studied with the various steps of externally applied electric potential. Optimization of the micro channel heat sink has been performed considering two design variables related to the micro channel width, depth and fin width. The surrogate-based optimization is performed using a search algorithm taking overall thermal resistance as objective function. The thermal resistance is found to be more sensitive to channel width-to-depth ratio than fin width-to-depth of channel ratio.

• Journal of computational fluids engineering
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• v.19 no.4
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• pp.1-7
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• 2014

A numerical study of transient conjugate heat transfer on micro heater in a micro-channel substrate under a sinusoidal heat load was conducted. It was found that the time constant is not affected by the maximum heating magnitude of the sinusoidal heat load. However, the time constant increases with low duration of the sinusoidal heating period and low Reynolds number. Moreover, there is a threshold where a heater temperature do not reach to time constant at low thermal diffusivity, low flow rate, and low pulse duration of the sinusoidal heating. The time constant should be considered for transient convective heat transfer under transient sinusoidal heat load in a micro heat sink.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.31-36
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• 2015

The demand for multi-functionality, high density, high performance, and miniaturization of IC devices has caused the technology paradigm shift for electronic packaging. So, thermal management of new packaged chips becomes a bottleneck for the performance of next generation devices. Among various thermal solutions such as heat sink, heat spreader, TIM, thermoelectric cooler, etc. on-chip liquid cooling module was investigated in this study. Micro-channel was fabricated on Si wafer using a deep reactive ion etching, and 3 different micro-channel designs (straight MC, serpentine MC, zigzag MC) were formed to evalute the effectiveness of liquid cooling. At the heating temperature of $200^{\circ}C$ and coolant flow rate of 150ml/min, straight MC showed the high temperature differential of ${\sim}44^{\circ}C$ after liquid cooling. The shape of liquid flowing through micro-channel was observed by fluorescence microscope, and the temperarue differential of liquid cooling module was measuremd by IR microscope.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.24 no.12
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• pp.1635-1643
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• 2000

The present work investigates a heat transfer phenomenon at the interface between a porous medium and an impermeable wall. In an effort to appropriately describe the heat transfer phenomenon at the interface, the heat transfer at the interface between the microchannel heat sink, which is an ideally organized porous medium, and the finite-thickness substrate is examined. From the examination, it is clarified that the he heat flux distribution at the interface is not uniform for the impermeable wall with finite thickness. On the other hand, the first approach, based on the energy balance for the representative elementary volume in the porous medium, is physically reason able. When the first approach is applied to the thermal boundary condition, and additional boundary condition based on the local thermal equilibrium assumption at the interface is used. This additional boundary condition is applicable except for the very th in impermeable wall. Hence, for practical situations, the first approach in combination with the local thermal equilibrium assumption at the interface is suggested as an appropriate thermal boundary condition. In order to confirm our suggestion, convective flows both in a microchannel heat sink and in a sintered porous channel subject to a constant heat flux condition are analyzed. The analytically obtained thermal resistance of the microchannel heat sink and the numerically obtained overall Nusselt number for the sintered porous channel are shown to be in close agreement with available experimental results when our suggestion for the thermal boundary conditions is applied.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.1870-1875
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• 2007

The microchannel heat sink is promising heat dissipation method for high heat flux source. Contrary to conventional circular channel, MEMS based microchannel had rectangular or trapezoidal cross-sectional shape. In our study, we conducted three dimensional conjugate heat transfer calculation for rectangular shape microchannel. First, we simulated that channel was completely drained with known heating power. As a result we obtained calibration line, which indicates heat loss was function of temperature. Second, we simulated single phase heat transfer with various mass flux, 100-400 $kg/m^2s$. In conclusion, the single phase test verified that the present heat loss evaluation method is applicable to micro scale heat transfer devices. Heat fluxes from each side wall shows difference due to non-uniform heating. However those ratios were correlated with supplied total heat. Finally, we proposed effective area correction factor to evaluate appropriate heat flux.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2666-2671
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• 2007

This work presents microchannel heat sink shape optimization procedure using Kriging method. Design variables relating to microchannel width, depth and fin width are selected, and thermal resistance has been taken as objective function. Design points are selected through a three-level fractional factorial design of sampling method. Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with experimental results. Using the numerically evaluated objective function, a surrogate model (Kriging) is constructed and optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of microchannel heat sink under constant pumping power.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.9
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• pp.733-740
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• 2007

Microchannel heat sink shape optimization is performed using Kriging method. Design variables relating to microchannel width, depth and fin width are selected, and thermal resistance has been taken as objective function. Design points are selected through a three-level fractional factorial design of sampling method. Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with experimental results. Using the numerically evaluated objective function, a surrogate model (Kriging) is constructed and optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of microchannel heat sink under constant pumping power.