• 제목/요약/키워드: Micro-channel Heat Sink

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전기삼투를 이용한 미세열방출기의 수치해석 (Numerical Analysis of Electroosmotically Enhanced Microchannel Heat Sinks)

  • 후세인아프잘;김광용
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2544-2547
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    • 2008
  • A micro channel heat sink has been studied and optimized for mixed pressure driven and electroosmotic flows through three-dimensional numerical analysis. The effects of ionic concentration represented by zeta potential and Debye thickness are studied with the various steps of externally applied electric potential. Optimization of the micro channel heat sink has been performed considering two design variables related to the micro channel width, depth and fin width. The surrogate-based optimization is performed using a search algorithm taking overall thermal resistance as objective function. The thermal resistance is found to be more sensitive to channel width-to-depth ratio than fin width-to-depth of channel ratio.

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마이크로히터에서 반주기 정현곡선의 열부하에 의한 비정상 열전달 연구 (NUMERICAL STUDY OF UNSTEADY HEAT TRANSFER ON MICRO HEATER UNDER HALF-CYCLE SINUSOIDAL HEAT LOAD)

  • 김명준;이희준
    • 한국전산유체공학회지
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    • 제19권4호
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    • pp.1-7
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    • 2014
  • A numerical study of transient conjugate heat transfer on micro heater in a micro-channel substrate under a sinusoidal heat load was conducted. It was found that the time constant is not affected by the maximum heating magnitude of the sinusoidal heat load. However, the time constant increases with low duration of the sinusoidal heating period and low Reynolds number. Moreover, there is a threshold where a heater temperature do not reach to time constant at low thermal diffusivity, low flow rate, and low pulse duration of the sinusoidal heating. The time constant should be considered for transient convective heat transfer under transient sinusoidal heat load in a micro heat sink.

마이크로 채널 디자인에 따른 온 칩 액체 냉각 연구 (Study of On-chip Liquid Cooling in Relation to Micro-channel Design)

  • 원용현;김성동;김사라은경
    • 마이크로전자및패키징학회지
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    • 제22권4호
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    • pp.31-36
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    • 2015
  • 전자소자의 다기능, 고밀도, 고성능, 그리고 소형화는 전자 패키지 기술에 초미세 피치 플립 칩, 3D 패키지, 유연 패키지, 등 새로운 기술 패러다임 전환을 가져왔으며, 이로 인해 패키지 된 칩의 열 관리는 소자의 성능을 좌우하는 중요한 요소로 대두되고 있다. Heat sink, heat spreader, TIM, 열전 냉각기, 등 많은 소자 냉각 방법들 중 본 연구에서는 냉매를 이용한 on-chip 액체 냉각 모듈을 Si 웨이퍼에 제작하고, 마이크로 채널 디자인에 따른 냉각 효과를 분석하였다. 마이크로 채널은 딥 반응성 이온 에칭을 이용하여 형성하였고, 3 종류 디자인(straight MC, serpentine MC, zigzag MC)으로 제작하여 마이크로 채널 디자인이 냉각 효율에 미치는 영향을 관찰하였다. 가열온도 $200^{\circ}C$, 냉매 유동속도 150 ml/min의 경우에서 straight MC가 약 $44^{\circ}C$의 높은 냉각 전후의 온도 차를 보였다. 냉매의 흐름과 상 변화는 형광현미경으로 관찰하였으며, 냉각 전후의 온도 차는 적외선현미경을 이용하여 분석하였다.

다공성 매질과 비투과성 벽면 사이의 경계면에 대한 열적 경계 조건 (On the Thermal Boundary Conditions at the Interface Between the Porous Medium and the Impermeable Wall)

  • 김덕종;김성진
    • 대한기계학회논문집B
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    • 제24권12호
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    • pp.1635-1643
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    • 2000
  • The present work investigates a heat transfer phenomenon at the interface between a porous medium and an impermeable wall. In an effort to appropriately describe the heat transfer phenomenon at the interface, the heat transfer at the interface between the microchannel heat sink, which is an ideally organized porous medium, and the finite-thickness substrate is examined. From the examination, it is clarified that the he heat flux distribution at the interface is not uniform for the impermeable wall with finite thickness. On the other hand, the first approach, based on the energy balance for the representative elementary volume in the porous medium, is physically reason able. When the first approach is applied to the thermal boundary condition, and additional boundary condition based on the local thermal equilibrium assumption at the interface is used. This additional boundary condition is applicable except for the very th in impermeable wall. Hence, for practical situations, the first approach in combination with the local thermal equilibrium assumption at the interface is suggested as an appropriate thermal boundary condition. In order to confirm our suggestion, convective flows both in a microchannel heat sink and in a sintered porous channel subject to a constant heat flux condition are analyzed. The analytically obtained thermal resistance of the microchannel heat sink and the numerically obtained overall Nusselt number for the sintered porous channel are shown to be in close agreement with available experimental results when our suggestion for the thermal boundary conditions is applied.

MEMS 로 제작된 마이크로 채널에서의 3 차원 열전달 해석 (3D simulation of Heat transfer in MEMS-based microchannel)

  • 최치웅;허철;김동억;김무환
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회B
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    • pp.1870-1875
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    • 2007
  • The microchannel heat sink is promising heat dissipation method for high heat flux source. Contrary to conventional circular channel, MEMS based microchannel had rectangular or trapezoidal cross-sectional shape. In our study, we conducted three dimensional conjugate heat transfer calculation for rectangular shape microchannel. First, we simulated that channel was completely drained with known heating power. As a result we obtained calibration line, which indicates heat loss was function of temperature. Second, we simulated single phase heat transfer with various mass flux, 100-400 $kg/m^2s$. In conclusion, the single phase test verified that the present heat loss evaluation method is applicable to micro scale heat transfer devices. Heat fluxes from each side wall shows difference due to non-uniform heating. However those ratios were correlated with supplied total heat. Finally, we proposed effective area correction factor to evaluate appropriate heat flux.

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사다리꼴 미세유로의 형상최적화 (Shape Optimization of a Trapezoidal Micro-Channel)

  • 후세인 아프잘;김광욜
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회B
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    • pp.2666-2671
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    • 2007
  • This work presents microchannel heat sink shape optimization procedure using Kriging method. Design variables relating to microchannel width, depth and fin width are selected, and thermal resistance has been taken as objective function. Design points are selected through a three-level fractional factorial design of sampling method. Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with experimental results. Using the numerically evaluated objective function, a surrogate model (Kriging) is constructed and optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of microchannel heat sink under constant pumping power.

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크리깅 모델을 이용한 미세유로의 형상최적설계 (Shape Optimization of a Micro-Channel Using Kriging Model)

  • 후세인 아프잘;김광용
    • 대한기계학회논문집B
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    • 제31권9호
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    • pp.733-740
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    • 2007
  • Microchannel heat sink shape optimization is performed using Kriging method. Design variables relating to microchannel width, depth and fin width are selected, and thermal resistance has been taken as objective function. Design points are selected through a three-level fractional factorial design of sampling method. Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with experimental results. Using the numerically evaluated objective function, a surrogate model (Kriging) is constructed and optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of microchannel heat sink under constant pumping power.