• Applied Microscopy
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• v.50
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• pp.17.1-17.9
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• 2020

Recent advances in fabrication have enabled radial-junction architectures for cost-effective and high-performance optoelectronic devices. Unlike a planar PN junction, a radial-junction geometry maximizes the optical interaction in the three-dimensional (3D) structures, while effectively extracting the generated carriers via the conformal PN junction. In this paper, we report characterizations of radial PN junctions that consist of p-type Si micropillars created by deep reactive-ion etching (DRIE) and an n-type layer formed by phosphorus gas diffusion. We use electron-beam induced current (EBIC) microscopy to access the 3D junction profile from the sidewall of the pillars. Our EBIC images reveal uniform PN junctions conformally constructed on the 3D pillar array. Based on Monte-Carlo simulations and EBIC modeling, we estimate local carrier separation/collection efficiency that reflects the quality of the PN junction. We find the EBIC efficiency of the pillar array increases with the incident electron beam energy, consistent with the EBIC behaviors observed in a high-quality planar PN junction. The magnitude of the EBIC efficiency of our pillar array is about 70% at 10 kV, slightly lower than that of the planar device (≈ 81%). We suggest that this reduction could be attributed to the unpassivated pillar surface and the unintended recombination centers in the pillar cores introduced during the DRIE processes. Our results support that the depth-dependent EBIC approach is ideally suitable for evaluating PN junctions formed on micro/nanostructured semiconductors with various geometry.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2097-2101
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• 2007

This paper presents an optimal design of a micro evaporator which maximizes the heat transfer coefficient. Number of gaps, spanwise distance and streamwise distance are selected as the geometric design parameters. Mass flow rate of the refrigerant is selected as the non-geometric design parameter. Temperature at the surface of the heater is measured to valuate the heat transfer coefficient. Nine experiments are conducted using $L_9(3^4)$ orthogonal array. Maximum heat transfer coefficient is 640 W/$m^2K$ at the parameters of 2 gaps, 0.2 mm spanwise distance, 1.0 mm streamwise distance and 0.72 g/s mass flow rate. Among the 3 geometric parameters, the spanwise distance is the most sensitive parameter influencing the heat transfer coefficient. We conduct a second stage of experiment to increase the heat transfer coefficient by reselecting the mass flow rate. We concluded that 0.87 g/s is the optimized flow rate for an active micro cooler resulting in a heat transfer coefficient of 651 W/$m^2K$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.10
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• pp.993-998
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• 2007

To verify the 2D or 3D positioning accuracy of a multi-axes stage is not easy, particularly, in the case the moving path of the stage is not linear. This paper is a study on a measuring method for the curved path accurately. A machine vision technique is used to trace the moving path of two-axes stage. To improve the accuracy of machine vision, a zoom lens is used for the 2D micro moving path. The accuracy of this method depends of the CCD resolution and array align accuracy with the zoom lens system. Also, a further study for software algorithm is required to increase the tracing speed. This technique will be useful to trace a small object in the 2D micro path in real-time accurately.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.71-74
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• 1995

Diamond shaping is one of the machining strategies to make the optical micro-groove molds,and it is especially useful when rhe component is an assembly of the linear micro-groove array. A mirror-like surface and arbitrary crose-sectional curve can be easily made by diamond. Howerver, the cutting speed of shaping is relatively lower than that of the other cutting methods, and there exist an unstable cutting conditions that generate the chatter. This study is focused on the modeling of the simplified self-induced chatter of the diamond shapping. Form the chatter model and experiments, it is found that the unstable cutting conditions exist wwhen the depth of cut is low and cutting speed is high.

• Journal of Electrical Engineering and information Science
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• v.3 no.2
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• pp.245-250
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• 1998

Novel fabrication process of vertical spring for micro mirror array is proposed. The proposed fabrication process adopts a shadow evaporation process using shielding screen structure on top of the sacrificial layer. The 50${\times}$50 micro mirror arrays are fabricated using the proposed process and ceramic packaged. The static and dynamic characteristics of mirror are measured. The mirror plate touches substrate at 16V and the response time of about 16.8 ${\mu}\textrm{s}$. The resonant frequency of mirror is 16kHz. The spring thickness is calculated from static characteristic to be 1075${\AA}$.

• International journal of advanced smart convergence
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• v.8 no.3
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• pp.39-45
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• 2019

This paper presents an optical technique for the three-dimensional (3D) shape inspection of micro solder balls used in ball-grid array (BGA) packaging. The proposed technique uses an optical source composed of spatially arranged light-emitting diodes (LEDs) and the results are derived based on the specular reflection characteristics of the micro solder balls for BGA A vision system comprising a camera and LEDs is designed to capture the reflected images of multiple solder balls arranged arbitrarily on a tray and the locations of the LED point-light-source reflections in each ball are determined via image processing, for shape inspection. The proposed methodology aims to determine the presence of defects in 3D BGA shape using the statistical information of the relative positions of multiple BGA balls, which are included in the image. The presence of the BGA balls with large deviations in relative position imply the inconsistencies in their shape. Experiments were conducted to verify that the proposed method could be applied to inspection without sophisticated mechanism and productivity problem.

• Korean Journal of Optics and Photonics
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• v.14 no.4
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• pp.466-472
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• 2003

In this paper, we proposed an optical true time-delay (TTD) feeder system for phased array antennas (PAAs). The system possesses high-speed beam scan capability since, in this scheme, different lengths of fiber delay-lines are selected by optical 2${\times}$2 MEMS switches at high speed. An optical TTD capable of beam scanning in one of eight different directions has been built for 10 GHz linear PAA systems. Experimental results on time delay measurements show that the maximum time delay error is less than 0.2 ps corresponding to a scan angle error of less than 0.84o. We have also designed a 10 GHz linear PAA composed of eight micro-strip patch antenna elements driven by the proposed TTD, and the radiation patterns of this PAA have been analyzed by simulation.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.2
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• pp.315-322
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• 2002

A thin film oxide semiconductor micro gas sensor array which shows only 60㎽ of power consumption at an operating temperature of 30$0^{\circ}C$ has been fabricated using microfabrication and rnicrornachining techniques. Excellent thermal insulation of the membrane is achieved by the use of a double la! or structure of 0.1${\mu}{\textrm}{m}$ thick Si$_3$N$_4$ and 1${\mu}{\textrm}{m}$ thick phosphosilicate glass(PSG) prepared by low pressure chemical vapor deposition(LPCVD) and atmospheric－pressure chemical-vapor deposition(APCVD), respectively. The sensor way consists of such thin film oxide semiconductor sensing materials as 1wt.％ Pd-doped SnO$_2$, 6wt.% AI$_2$O$_3$-doped ZnO, WO$_3$ and ZnO. The thin film oxide semiconductor micro gas sensor array exhibited resistance changes usable for subsequent data processing upon exposure to various gases and the sensitivity strongly depended on the sensing layer materials. Heater Part of the sensor structure has been modified in order to improve the process yield of the sensor, and as a result of modified heater structure improved process yield has been achieved.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.11
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• pp.7-13
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• 2002

BSCT 320${\times}$240 IRFPA detector module is implemented, which is a key component in uncooled thermal imaging systems. The detector module consists of two parts, infrared sensitive pixel array and read-out integrated circuit(ROIC). The BSCT 320${\times}$240 pixels are made by laser scribe process and 10-${\mu}m$ micro-bump to satisfy 50-${\mu}m$ pitch and 95-% fill-factor. The ROIC has been designed to electrically address the pixels sequentailly and to improve signal-to-noise ratio with single transistor amplifier, HPF, tunable LPF and clamp circuit. The fabricated hybrid chip of detector and ROIC has been mounted on the TEC built-in ceramic package for more stable operation and tested for lots of electrical and optical properties. The IRFA sample has shown successful properties and met with good results of fill-factor, detectivity and responsivity.

• Journal of Sensor Science and Technology
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• v.24 no.6
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• pp.379-384
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• 2015

An infrared image sensor is a core device in a thermal imaging system. The fabrication method of a focal plane array (FPA) is a key technology for a high resolution infrared image sensor. Each pixels in the FPA have $Si_3N_4/SiO_2$ membranes including legs to deposit bolometric materials and electrodes on Si readout circuits (ROIC). Instead of polyimide used to form a sacrificial layer, the feasibility of an amorphous silicon (${\alpha}-Si$) was verified experimentally in a $8{\times}8$ micro-bolometer array with a $50{\mu}m$ pitch. The elimination of the polyimide sacrificial layer hardened by a following plasma assisted deposition process is sometimes far from perfect, and thus requires longer plasma ashing times leading to the deformation of the membrane and leg. Since the amorphous Si could be removed in $XeF_2$ gas at room temperature, however, the fabricated micro-bolomertic structure was not damaged seriously. A radio frequency (RF) sputtered nickel oxide film was grown on a $Si_3N_4/SiO_2$ membrane fabricated using a low stress silicon nitride (LSSiN) technology with a LPCVD system. The deformation of the membrane was effectively reduced by a combining the ${\alpha}-Si$ and LSSiN process for a nickel oxide micro-bolometer.