• Transactions of Materials Processing
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• v.16 no.4 s.94
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• pp.299-303
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• 2007

Dry sliding wear behavior of ultra-fine grained(UFG) plain low carbon dual phase steel, of which microstructure consists of hard martensite in a ductile ferrite matrix, has been investigated. The wear characteristics of the UFG dual phase steel was compared with that of a coarse grained dual phase steel under various applied load conditions. Dry sliding wear test were carried out using a pin-on-disk type tester at various loads of 1N to 100N under a constant sliding speed condition of 0.20m/s against an AISI 52100 bearing steel ball at room temperature. The sliding distance was fixed as 1000m for all wear tests. The wear rate was calculated by dividing the weight loss, measured to the accuracy of 10-5g by the specific gravity and sliding distance. The worn surfaces and wear debris were analyzed by SEM, EDS and profilometer. Micro-vickers hardness of the cross section of worn surfaces were conducted to analyze strain hardening underneath the contact surfaces. The wear mechanism of the UFG dual phase steel was investigated with emphasis on the unstable nature of the grain boundaries of the UFG microstructure.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.107.1-107.1
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• 2012

Because of beautiful glossy and color, the value of gold leverage is very high in Europe. For improve the quality of white gold, we performed heat treatment on 14K white gold alloys at various age-hardening conditions. Age-hardening behavior and the related phase transformation changes were studied to elucidate the hardening mechanism of 14K white gold alloys. For solid solution treatment [ST], casted 14K white gold alloy specimens were treated at high temperature ($750^{\circ}C$) during 30 minute, and the specimens dropped to water for quenching immediately. For Age-hardening treatment [AT], the specimens were treated at various temperatures ($250^{\circ}C{\sim}300^{\circ}C$). After the heat treatment, we observed increased hardness from 144 Hv to 214 Hv by Vicker's hardness tester. Variation of the grain size measured by optical microscopy (OM) and scanning electron microscopy (SEM) images. By electron probe micro-analysis (EPMA) mapping analysis, we investigated that irregular particles were changed uniformly. After heat treatment, 14K white gold alloys showed improved hardness and became uniformity of grain size by age-hardening treatment.

• Journal of the Korean Society for Heat Treatment
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• v.13 no.4
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• pp.239-245
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• 2000

Effect of tin and iron content on the recrystallization behavior of temary Zr-0.8Sn-x%Nb alloys were studied. The specimens with 0.1, 0.2 and 0.4 wt.% of iron were prepared under various annealing temperatures from $400^{\circ}C$ to $800^{\circ}C$ and times from 30 to 5000 minutes after vacuum arc remelting. The recrystallization behavior was observed using a polarized optical microscope, TEM and micro-vickers hardness tester. The recrystallization temperature of the alloys slightly increased with iron content due to increase of activation energy. The grain growth of the alloys with 0.1 and 0.2 wt.% of iron occured rapidly, however, that of the alloys with 0.4 wt.% iron was gradually retarded due to precipitation. The hardness of the alloy with a high iron slightly increased by the precipitation of beta phase after annealing at $800^{\circ}C$.

• Journal of the Korean institute of surface engineering
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• v.44 no.5
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• pp.190-195
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• 2011

Diamond-like carbon (DLC) has many outstanding properties such as low friction, high wear resistance and corrosion resistance. However, it is difficult to achieve enough adhesion on the metal substrates because of weak bonding between DLC film and the metal substrate. The purpose of this study is to enhance an adhesion of DLC film. For improving adhesion, the substrate was treated by active screen plasma nitriding before DLC film deposing. Nitrided substrates were investigated by Glow Discharge Spectrometer (GDS), Micro-Vickers Hardness. DLC films were deposited on several metals by linear ion source, and characteristics of the films were investigated using nano-indentation, Field Emission Scanning Electron Microscope (FESEM). The adhesion was measured by scratch tester. The adhesion of DLC films was increased when nitriding layer was formed before DLC deposition. Therefore, the adhesion of DLC film can be enhanced as increasing the hardness of materials.

• Journal of the Korean institute of surface engineering
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• v.44 no.4
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• pp.149-154
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• 2011

Martensitic stainless steel STS 431 has been nitrided by active screen ion nitriding under the various temperature and time. The thickness of diffusion layer, case depth, hardness and composition phases were investigated using field emission scanning electron microscopy (FE-SEM), micro-Vickers hardness tester, X-ray diffraction (XRD) and glow discharge spectroscopy (GDS). It was observed that the thickness of diffusion layer depends strongly on the treatment temperature and time. A sample, which was nitrided at $450^{\circ}C$ for 8hours, was a maximum hardness of Hv0.01 1558 and nitride layer of $70{\mu}m$. As shown in XRD patterns, $\varepsilon(Fe_{2-3}N)$ and expanded martensite (${\alpha}_N$) phases which was saturated with nitrogen solid solution were in the nitrided layer treated at $450^{\circ}C$ for 2 hours. Composition phases of $\varepsilon$ $(Fe_{2-3}N)$ and ${\gamma}'$ ($Fe_4N$) were observed after active screen nitriding at $450^{\circ}C$ for 8 hours.

• Journal of the Korean institute of surface engineering
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• v.39 no.5
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• pp.235-239
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• 2006

The aluminum nitride(AlN) layer on Al7075 substrate has been formed through nitrogen ion implantation process. The implantation process was performed under the conditions : 100 keV energy, total ion dose up to $2{\times}10^{18}\;ions/cm^2$. XRD analysis showed that aluminum nitride layers were formed by nitrogen implantation. The formation of Aluminum nitride enhanced surface hardness up to 265HK(0.02 N) from 150HK(0.02 N) for the unimplanted specimen. Micro-Knoop hardness test showed that wear resistance was improved about 2 times for nitrogen implanted specimens above $5\;{\times}\;10^{17}\;ions/cm^2$. The friction coefficient was measured by Ball-on-disc type wear tester and was decreased to 1/3 with increasing total nitrogen ion dose up to $1\;{\times}\;10^{18}ions/cm^2$. The enhancement of mechanical properties was observed to be closely associated with AlN formation. AES analysis showed that the maximum concentration of nitrogen increased as ion dose increased until $5\;{\times}\;10^{17}\;ions/cm^2$.

• Journal of the Korean Ceramic Society
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• v.46 no.5
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• pp.515-519
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• 2009

Carbon layers were fabricated on silicon carbide by chlorination reaction at temperatures between $1000^{\circ}C$ and $1500^{\circ}C$ with $Cl_2/H_2$ gas mixtures. The effect of reaction temperature on the micro-structures and tribological behavior of SiC derived carbon layer was investigated. Tribological tests were carried out ball-on-disk type wear tester. Carbon layers were characterized by X-ray diffractometer, Raman spectroscopy and surface profilometer. Both friction coefficients and wear rates were maintained low values at reaction temperature up to $1300^{\circ}C$ but increased suddenly above this temperature. Variation of surface roughness as a function of reaction temperature was dominant factor affecting tribological transition behavior of carbon layer derived from silicon carbide at high temperature.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.21-26
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• 2002

Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.

• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.4
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• pp.113-120
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• 2005

In order to investigate the characteristics of penatration and the effect of surface treatment in A15052-H34, Al5082-Hl31 and titanium alloy laminates which were treated by anodizing and PVD(Physical Vapor Desposition) method, ballistic tests were conducted. Thickness of surface membrane in A15052-H34, Al5082-Hl31, were $25{\mu}m$ and that of titanium $0.9{\mu}m$ respectively. Surface hardness test was conducted using micro Vicker's hardness tester. Resistance to penetration is determined by the protection ballistic limit(V50), a statistical velocity with $50\%$ probability for complete penetration. Fracture behaviors and ballistic tolerance, described by penetration modes, are observed from the results of V50 test and Projectile Through Plate(PTP) test at velocities greater than protection ballistic limit, respectively. Present experimental results derived from this research help to optimize laminate impact behavior by varing the laminate thickness and surface treated materials.

• Journal of the Korean institute of surface engineering
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• v.43 no.2
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• pp.86-90
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• 2010

In this study, we conducted heat treatment on 14K, 18K yellow gold alloy at various temperature conditions for improving their hardness and moderating their surface defects. Also after the heat treatment we used EPMA (Electron Probe Micro Analyzer), XRF (x-ray Fluorescence spectroscopy) for qualitative analysis and OM (optical microscope), SEM (scanning electron microscope) to investigate the changes of surface grain boundary. We used Vickers hardness tester to verify the changes of hardness. After the heat treatment, 14K, 18K gold alloys showed improved hardness and moderated surface defects at specific temperatures and duration.