• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.8
• /
• pp.89-96
• /
• 2004

Micro-tensile testing system, consisting of a micro tensile loading system and micro-ESPI(Electronic Speckle Pattern Interferometry) system, has been developed for measurement of micro-tensile properties of thin micro-materials. Micro-tensile loading system had a load cell with the maximum capacity of 50N and micro actuator with resolution of 4.5nm in stroke. The system was used to apply a tensile load to the micro-sized specimen. During tensile loading, the micro-ESPI system acquired interferornetric speckle patterns in the deformed specimen and measured the in-plane tensile strain. The ESPI system consisted of a CCD-camera with a lens and the window-based program developed for this experiment. Using this system, stress-strain curves for 4 kinds of electrolytic copper foil 18$\square$m thick were obtained. From these curves, tensile properties, including the elastic modulus. yielding strength and tensile strength, were determined and also values of the plastic exponent and coefficient based on Ramberg-Osgood relationship were evaluated.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.45-48
• /
• 2008

The mechanical behavior of small-sized materials has been investigated for many industrial applications, including MEMS and semiconductors. It is challenging to obtain accurate mechanical properties measurements for thin films due to several technical difficulties, including measurement of strain, specimen alignment, and fabrication. In this work, we used the micro-tensile testing unit with the real-time DIC (Digital Image Correlation) strain measurement system. This system has advantages of real time strain monitoring up to 50 nm resolution during the micro-tensile test, and ability to measure the young's modulus and Poisson's ratio at the same time. The mechanical properties of SCS (Single Crystal Silicon) are measured by uniaxial tension test from freestanding SCS which are $2.5{\mu}m$ thick, $200-500{\mu}m$ wide specimens on the (100) plane. Young's modulus, Poisson's ratio and tensile strength in the <110> direction are measured by micro-tensile testing system.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2002.10a
• /
• pp.38-42
• /
• 2002

An apparatus was developed to repetitively apply a $-196^{\circ}C$ thermal load to coupon-sized mechanical test specimens. Using this device, IM7/5250-4 (carbon / bismaleimide) cross-ply and quasi-isotropic laminates were submerged in liquid nitrogen ($LN_2$) 400 times. Ply-by-ply micro-crack density, laminate modulus, and laminate strength were measured as a function of thermal cycles. Quasi-isotropic samples of IM7/977-3 (carbon / epoxy) composite were also manually cycled between liquid nitrogen and an oven set at $120^{\circ}C$ for 130 cycles to determine whether including elevated temperature in the thermal cycle significantly altered the degree or location of micro-cracking. In response to thermal cycling, both materials micro-cracked extensively in the surface plies fellowed by sparse cracking of the inner plies. The tensile modulus of the IM7/5250-4 specimens was unaffected by thermal cycling, but the tensile strength of two of the lay-ups decreased by as much as 8.5%.

• Journal of Powder Materials
• /
• v.21 no.2
• /
• pp.97-101
• /
• 2014

The 304 stainless steel powders were prepared by high energy ball milling and subsequently sintered by spark plasma sintering, and the microstructural characteristics and micro-hardness were investigated. The initial size of the irregular shaped 304 stainless steel powders was approximately 42 ${\mu}m$. After high energy ball milling at 800 rpm for 5h, the powders became spherical with a size of approximately 2 ${\mu}m$, and without formation of reaction compounds. From TEM analysis, it was confirmed that the as-milled powders consisted of the aggregates of the nano-sized particles. As the sintering temperature increased from 1073K to 1573K, the relative density and micro-hardness of sintered sample increased. The sample sintered at 1573K showed the highest relative density of approximately 95% and a micro-hardness of 550 Hv.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2004.05a
• /
• pp.245-249
• /
• 2004

Transparent materials such as fused silica are important materials in optical and optoelectronics field because of its outstanding properties, such as transparency in a wide wavelength range, strong damage resistance for laser irradiation, and high thermal and chemical stability. However, these properties make it difficult to micromachine silica in micro-sized quantities. In this study, we fabricated a micro patterns on the surface of fused silica plate using laser induced wet etching. KrF excimer laser was used as a light source. There were no burrs and micro cracks on the etched surface of fused silica and the flatness of the etched surface was fairly good. We investigated the influence of etchant upon the etch rate and quality in laser induced wet etching. Pyrene-acetone, toluene, and pyrene-toluene solution were used as etchant. In the side of etch rate, toluene and pyrene-toluene solution were better than pyrene-acetone solution.

• Transactions of Materials Processing
• /
• v.21 no.3
• /
• pp.179-185
• /
• 2012

In this paper, it is proposed to produce high precision screws with a diameter of $800{\mu}m$ and a thread pitch of $200{\mu}m$ ($M0.8{\times}P0.2$) by means of a cold thread rolling process. In this part II of the study, the focus is on the production and reliability testing of the prototype $M0.8{\times}P0.2$ micro-screw. Designs for two flat dies were developed with the aid of the literature and previous studies. Process parameters during the cold thread rolling process were established through FE simulations. The simulation results showed that the threads of the micro-screw are completely formed through the rolling process. Prototype $M0.8{\times}P0.2$ micro-screw were fabricated with a high precision thread rolling machine. In order to verify the simulation results, the deformed shape and dimensions obtained from the experiment were compared with those from the simulations. Hardness and failure torque of the fabricated micro-screw were also measured. The values obtained indicate that the CAE based process design used in this paper is very appropriate for the thread rolling of micro-sized screws.

• International Journal of Precision Engineering and Manufacturing
• /
• v.9 no.4
• /
• pp.3-10
• /
• 2008

Micro-electrical discharge machining (micro-EDM) is an effective method for machining all types of conductive materials regardless of hardness. Since micro-EDM is an electro-thermal process, the energy supplied by the pulse generator is an important factor in determining the effectiveness of the process. In this study, an investigation was conducted on the micro-EDM of tungsten carbide (WC) to compare the performance of transistor and resistance/capacitance (RC) pulse generators in obtaining the best quality micro-hole. The performance was measured by the machining time, material removal rate, relative tool wear ratio, surface quality, and dimensional accuracy. The RC generator was more suited for minimizing the pulse energy, which is a requirement for fabricating micro-parts. The smaller-sized debris formed by the low-discharge energy of RC micro-EDM could be easily flushed away from the machined zone, resulting in a surface free of burrs and resolidified molten metal. The RC generator also required much less time to obtain the same quality micro-hole in WC. Therefore, RC generators are better suited for fabricating micro-structures, producing good surface quality and better dimensional accuracy than the transistor generators, despite their higher relative tool wear ratio.

• Applied Microscopy
• /
• v.46 no.1
• /
• pp.27-31
• /
• 2016

It has been investigated what kind of characteristic X-ray in electron probe micro-analyzer (EPMA) is effective for the determination of compounds of Si series materials. After comparing the characteristic X-rays among the primary and secondary lines in $K_{\alpha}$ and $K_{\beta}$ obtained from the Si series standard samples, it was found that the secondary line of $K_{\alpha}$ exhibited the most informative spectrum although the intensity was considerably weak. As a result of analyzing the spectrum shapes of the Si series standard samples, the spectrum shape of the secondary line of $K_{\alpha}$ for SiC was different from those for other Si compounds. To grasp the characteristics of the shape, a line was perpendicularly drawn from the peak top to base line in order to divide a spectrum into two areas. The area ratio of right to left was defined to call as the asymmetry index here. As a result, the asymmetry index value of the SiC was greater than one, while those of other Si compounds were less than one. It was found from the EPMA analysis that identification of SiC became successful to distinguish from other Si compounds and this method was applicable for micro-sized compounds in a practical composite material.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.386-386
• /
• 2012

For white light emitting diode (LED) applications, it has been reported that Y3Al5O12:Ce3+ (YAG:Ce) in nano-sized phosphor performs better than it does in micro-sized particles. This is because nano-sized YAG:Ce can reduce internal light scattering when coated onto a blue LED surface. Recently, there have been many reports on the synthesis of nano-sized YAG particles using bottom-up method, such as co-precipitation method, sol-gel process, hydrothermal method, solvothermal method, and glycothermal method. However, there has been no report using top-down method. Top-down method has advantages than bottom-up method, such as large scale production and easy control of doping concentration and particle size. Therefore, in this study, nano-sized YAG:Ce phosphors were synthesized by a high energy beads milling process with varying beads size, milling time and milling steps. The beads milling process was performed by Laboratory Mill MINICER with ZrO2 beads. The phase identity and morphology of nano-sized YAG:Ce were characterized by X-ray powder diffraction (XRD) and field-emission scanning electron microscopy (FESEM), respectively. By controlling beads size, milling time and milling steps, we synthesized a size-tunable and uniform nano-sized YAG:Ce phosphors which average diameters were 100, 85 and 40 nm, respectively. After milling, there was no impurity and all of the peaks were in good agreement with YAG (JCPDS No. 33-0040). Luminescence and quantum efficiency (QE) of nano-sized YAG:Ce phosphors were measured by fluorescence spectrometer and QE measuring instrument, respectively. The synthesized YAG:Ce absorbed light efficiently in the visible region of 400-500 nm, and showed single broadband emission peaked at 550 nm with 50% of QE. As a result, by considering above results, high energy beads milling process could be a facile and reproducible synthesis method for nano-sized YAG:Ce phosphors.

• Transactions on Electrical and Electronic Materials
• /
• v.1 no.1
• /
• pp.40-44
• /
• 2000

Metal-ferroelectric-insulator-semoiconductor field effect transistor (MFISFETs) were fabricated using CMOS processes. The Pt/SBT/NO combined layers were etched for forming a conformal gate by using Ti/Cr metal masks and a two step etching method, By the method, we were able to fabricate a small-sized gate with the dimension of $16/4{\mu}textrm{m}$ in the width/length of gate. It has been chosen the non-self aligned source and drain implantation process, We have deposited inter-layer dielectrics(ILD) by low pressure chemical vapor deposition(LPCVD) at $380^{circ}C$ after etching the gate structure and the threshold voltage of p-channel MFISFETs were about 1.0 and -2.1V, respectively. It was also observed that the current difference between the $I_{ON}$(on current) and $I_{OFF}$(off current) that is very important in sensing margin, is more that 100 times in $I_{D}-V_{G}$ hysteresis curve.