• Journal of Information Processing Systems
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• v.8 no.2
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• pp.331-346
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• 2012

Task-based programming is becoming the state-of-the-art method of choice for extracting the desired performance from multi-core chips. It expresses a program in terms of lightweight logical tasks rather than heavyweight threads. Intel Threading Building Blocks (TBB) is a task-based parallel programming paradigm for multi-core processors. The performance gain of this paradigm depends to a great extent on the efficiency of its parallel constructs. The parallel overheads incurred by parallel constructs determine the ability for creating large-scale parallel programs, especially in the case of fine-grain parallelism. This paper presents a study of TBB parallelization overheads. For this purpose, a TBB micro-benchmarks suite called TBBench has been developed. We use TBBench to evaluate the parallelization overheads of TBB on different multi-core machines and different compilers. We report in detail in this paper on the relative overheads and analyze the running results.

• Proceedings of the Korea Information Processing Society Conference
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• 2014.04a
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• pp.671-674
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• 2014

최근 MicroRNA(miRNA)가 질병 발생과 밀접한 연관성이 있다고 밝혀진 이래, 이와 관련된 연구가 활발히 진행되고 있다. 하지만 각종 질병 관련 miRNA의 기능과 역할 그리고 질병 발생 메카니즘 등이 명백히 밝혀진 것이 없는 실정이다. 본 논문에서는 여러 종류의 miRNA 데이터베이스(miRecords, miRTarBase, miR2Disease 등)를 통합하고, 본 논문에서 새로이 제안하는 scoring 방법과 특정 질병과 관련된 miRNA의 순위결정과정을 통하여 질병과 연관성이 높은 miRNA을 밝혀내는 방법을 제안한다. 새로이 제안하는 방법을 바탕으로 miRNA와 특정 질병과의 연관성을 효과적으로 밝혀냈다.

• Proceedings of the Korea Information Processing Society Conference
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• 2001.04a
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• pp.545-548
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• 2001

3GPP2 방식에서는 Macro Mobility 지원을 위하여 MIP를 이용하며 PDSN은 FA의 기능을 수행한다. PDSN 관리 영역 내의 하나의 RN에서 다른 RN으로 이동시에 지원되는 이동성을 Micro Mobility라 한다. Micro Mobility에서 Seamless한 핸드오프를 위해 RN간에 멀티캐스트 그룹 메커니즘을 이용할 경우, 핸드오프 예상시간에 따라 등급별로 버퍼를 다르게 할당하여 멀티캐스트 하는 방법과 단순 멀티캐스트 하는 방법이 있다. 본 논문은 Micro Mobility를 지원하기 위한 멀티캐스트 그룹 메커니즘 기반의 Seamless 핸드오프 알고리즘에서 등급별로 버퍼를 다르게 할당할 경우와 단순 멀티캐스트 할 경우의 블록킹 확률을 비교 분석한다.

• Journal of Ceramic Processing Research
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• v.19 no.5
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• pp.424-427
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• 2018

The effect of oxygen pressure in the synthesis of $SnO_2$ micro/nanocrystals through thermal evaporation of Sn powder was investigated. The thermal evaporation process was performed at $1000^{\circ}C$ for 1 hr under various oxygen pressures. The pressure of oxygen changed from 10 to 500 Torr. The morphology of $SnO_2$ crystals changed drastically with oxygen pressure. $SnO_2$ nanoparticles with an average diameter of 120 nm were formed at oxygen pressure lower than 10 Torr. $SnO_2$ nanowires were grown under an oxygen pressure of 100 Torr. The nanowires have diameters in the range of 100 ~ 500 nm and lengths of several tens of micrometers. As increasing the oxygen pressure to 500 Torr, the sizes of wires increased. A strong visible emission peak centered at about 500 ~ 600 nm was observed in the room temperature cathodoluminescence spectra of all the products.

• Proceedings of the Korea Information Processing Society Conference
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• 2009.11a
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• pp.49-50
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• 2009

본 논문에서는 국산 임베디드 프로세서인 Core-A에서 동작하는 실시간 운영체제 이식에 대해 설명한다. 운영체제 이식을 위해서는 코드 작성에 앞서 컴파일과 디버깅을 위한 개발 환경을 구축하고 운영체제 이식을 위해 새로 작성할 부분을 파악할 필요가 있다. 이식할 운영체제인 MicroC/OS-II는 교육용으로 널리 쓰이는 실시간 운영체제로 C와 Assembly로 작성되어 있으며, 프로세서에 독립적인 코드와 프로세서에 의존적인 코드가 분리되어 있어 이식이 용이하다. Core-A로의 운영체제 이식은 Context Switching이나 Critical Section과 같이 레지스터를 직접 다루어야 하는 프로세서에 의존적인 코드를 수정하여 이루어졌다

• Proceedings of the Korea Information Processing Society Conference
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• 2008.05a
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• pp.593-596
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• 2008

최근에는 임베디드 시스템의 규모가 점차 커지고, 시스템이 노드단위로 분산되어 협업을 통한 작업을 하는 경향이 많아져, 시스템 디자인에 객체지향적인 패러다임이 필요하게 되었다. TMO 모델은 90년대초반부터 U.C Irvine의 Kane.Kim 등에 의해 연구되고 있는 실시간 객체모델이다. TMO 모델은 SvM과 SpM의 두가지 메소드 타입으로 실시간 클럭에 의한 수행이나, 이벤트 발생에 의한 메소드 수행을 지원함으로써 분산 실시간 시스템의 설계를 용이하게 해준다. 본 논문에서는 적은 용량의 실시간 운영체제인 MicroC/OS-II에 TMO 모델의 적용 방안을 제안한다.

• Proceedings of the KIEE Conference
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• 1979.08a
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• pp.94-103
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• 1979

A 16-bit computer system, called X77, is designed and constructed using bit-slice micro-slice microprogrammable. A cross-assembler/simulator software has been implemented and used to debug the entire system design including actual microcodes prior to hardware realizations. Prototypes of X77 CPU, I/O processing subsystem and their interconnections have been constructed and are in the process of being debugged.

• Transactions of Materials Processing
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• v.18 no.2
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• pp.144-149
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• 2009

Recently, the monitoring technology of machining process is very important to improve productivity and quality in manufacturing filed. Such monitoring technology has been performed to measurement using vibration signal, acoustic emission signal and tool dynamometer. However, micro machining is limited small-scale parts machining because micro tool is very small and weakness to generate signal in micro machining process. Therefore, this study has efficient sensing technology for real monitoring system in micro machine that is proposed to supplement a disadvantage of single-sensor by multi sensor. From experimental result, it was evaluated tool wear and cutting situation according to repetitive slot cutting condition and changing cutting condition, and it was performed monitoring spindle rpm and condition according to compare acceleration signal with current signal.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.48-52
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• 2004

Ultrasonic machining is effective for machining of extreme hard and brittle materials, including glass, ceramic, carbide, graphite. The major machining principle involves the direct hammering as well as the impact of abrasive panicles on the workpiece. Also, it involve cavitation erosion. The general workpiece is flat side. This study attempted micro hole machining of a curved surface of glass tube. Ultrasonic machining is fault of the slow machining speed. An experiment does and got 16 seconds validity machining time as increasing the processing speed. Moreover, entrance crack and surface roughness was similar both machining speed is slow and fast. Several micro hole of glass tube machined using one micro tool, but tool wear is infinitesimal.

• Transactions of Materials Processing
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• v.17 no.8
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• pp.649-656
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• 2008

Springback is one of factors affecting precision in metal forming. Its effect is particularly prominent in bending process. In this study, bending and forging process are used in order to manufacture a micro spring with two bending region from $60{\mu}m$ diameter wire. Springback in the process lowers the precision of the micro spring. Overbending for springback compensation has wide usage in a general way. However, this method requires repeated modifications of press dies until the tolerance is allowable, which causes that production cost and time increase. In this paper, we analyzed the mechanism of springback in the forming process of the micro spring using finite element method. In addition, a simple method to control springback without modifying dies was proposed by performing numerical analysis with various parameters.