• 한국의류학회지
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• 제36권1호
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• pp.1-11
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• 2012

This paper reports on a prototype cooling garment applying a cooling module. The cooling module was composed of a Peltier device, a cold sink, a heat sink and two fans. A constant box was used to evaluate the cooling effect of the module. Two cooling modules were attached on each side of the garment. The wear trial was conducted using 10 male subjects in an environmental chamber maintained at $30{\pm}0.5^{\circ}C$, $50{\pm}5%$RH. Subjective sensations of thermal, humidity, and comfort were surveyed. Statistical package SPSS12.0 was used for the t-test and the Wilcoxon signed-rank test. The results showed that most effective cooling module decreased the temperature of the constant temperature box by $-4.9^{\circ}C$. The micro-temperature of the cooling garment with a Peltier device was lower than the control garment during the exercise. In particular, the chest skin temperature was $1.5^{\circ}C$ lower with the cooling garment than the control. The maximum temperature difference was $-2.57^{\circ}C$ on the sides of the $1^{st}$ layer. Subjective thermal sensation from wear trials of the Peltier device attached garment was lower than the control garment. Subjects felt more comfortable with the cooling garment in almost all the periods.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.430-431
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• 2006

Thermoelectric thick film was fabricated by screen printing process with using p-type Bi-Te-Sb powders. The powder was synthesized by melting, milling and sintering process and hydrogen reduced to enhance the thermoelectric property. The thick film of Bi-Te-Sb powder was fabricated by screen printing method and baked at the optimized conditions. The thermal conductivity, the electrical resistivity and Seeback coefficient of thick film were measured and the thermoelectric performance was analyzed in terms of film characteristics and its microstructure. Finally, the feasibility of thermoelectric thick film into micro cooling device on CPU chip was discussed in this study.

• 센서학회지
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• 제9권3호
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• pp.171-176
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• 2000

반응성 스퍼터링과 고주파 마그네트론 스퍼터링으로 각각 증착된 MgO 박막과 그 위에 증착된 백금박막의 열처리 온도 및 시간에 따른 물리적, 전기적 특성을 4침 탐침기, 주사전자현미경 및 X선 회절법을 이용하여 분석하였다. $1000^{\circ}C$, 2시간의 열처리 조건하에서 MgO 박막은 백금박막과 화학적 반응없이 백금박막의 열산화막에 대한 부착특성을 개선시켰으며, 그 위에 증착된 백금박막의 면저항 및 비저항은 각각 $0.1288\;{\Omega}/{\square}$, $12.88\;{\mu}{\Omega}{\cdot}cm$이었다. Lift-off 방법을 이용하여 $SiO_2$/Si기판상에 백금 저항체를 만들었으며, 백금 와이어, 백금 페이스트 그리고 SOG를 이용하여 마이크로 열 센서용 박막형 Pt-RTD를 제작하였다. $25{\sim}400^{\circ}C$의 온도범위에서 $1.0{\mu}m$의 두께를 갖는 제작된 Pt-RTD의 저항온도계수는 벌크 백금에 가까운 $3927ppm/^{\circ}C$로 측정되었다. 측정온도범위내에서 저항값은 선형적인 변화를 보였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.434-436
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• 2013

Ga-doped ZnO (GZO) was substitutes of the SnO2:F films on soda lime glass substrate in the photovoltaic devices such as CIGS, CdTe and DSSC due to good properties and low cost. However, it was reported that the electrical resistivity of GZO is unstable above $300^{\circ}C$ in air atmosphere. To improve thermal stability of GZO thin films at high temperature above $300^{\circ}C$ an $TiO_2$ thin film was deposited on the top of GZO thin films as a barrier layer by Pulsed Laser Deposition (PLD) method. $TiO_2$ thin films were deposited at various thicknesses from 25 nm to 100 nm. Subsequently, these films were annealed at temperature of $300^{\circ}C$, $400^{\circ}C$, $500^{\circ}C$ in air atmosphere for 20 min. The XRD measurement results showed all the films had a preferentially oriented ( 0 0 2 ) peak, and the intensity of ( 0 0 2 ) peak nearly did not change both GZO (300 nm) single layer and $TiO_2$ (50 nm)/GZO (300 nm) double layer. The resistivity of GZO (300 nm) single layer increased from $7.6{\times}10^{-4}{\Omega}m$ (RT) to $7.7{\times}10^{-2}{\Omega}m$ ($500^{\circ}C$). However, in the case of the $TiO_2$ (50 nm)/GZO (300 nm) double layer, resistivity showed small change from $7.9{\times}10^{-4}{\Omega}m$ (RT) to $5.2{\times}10^{-3}{\Omega}m$ ($500^{\circ}C$). Meanwhile, the average transmittance of all the films exceeded 80% in the visible spectrum, which suggests that these films will be suitable for photovoltaic devices.

• 한국연소학회지
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• 제6권1호
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• pp.14-19
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• 2001

Interests and importance of down-scale combustor is increasing with the emerging need for miniaturized power source which is now a bottleneck of micro system development. But in down scaled combustor increased heat loss compared to thermal energy generation inhibits the usability and application of the device, so as a preliminary work of down scaled combustor fabrication. Modeling tool for the device should be established, in this study modeling approach of closed vessel combustion phenomena that can express heat loss effect and resulting quenching is proposed and the result is compared with experiment data. From this model heat loss effect following combustor scale down can be further understood, and further more design parameter and analysis tool can be obtained.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.655-659
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• 2006

This paper presents a novel electrostatic drop-on-demand inkjet device featured by a MEMS fabricated pole-type and hole-type nozzle with tube shaped orifice and investigates the feasibility of applying the inkjet device to display fabrication process. The electric voltage signal applied to the ring shaped upper electrode plate, against the hole-shaped ground or pole-shaped ground, referred here pole-type and hole-type nozzle respectively, allows ejection of small droplet to take place: That is, a tiny droplet is taken away from the peak of the mountain shaped liquid meniscus formed at the nozzle orifice. It is verified experimentally that the use of the pole type nozzle allows a stable and sustainable micro-dripping mode of droplet ejection for a wider range of applied voltages and of liquid viscosities. This demonstrates a feasibility of electrostatic drop-on-demand inkjet device as a disruptive alternative to conventional print heads such as thermal bubble or piezoelectric inkjet heads.

• 한국공작기계학회논문집
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• 제10권4호
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• pp.97-103
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• 2001

The study on the high-speed machine tool is very important for the improvement of productivity since it can shortens cutting and non-cutting time. Especially, high speed of feed drive system is the major research field. In the industries of the advanced countries, the feed drive systems at the speed of 60 m/min have been already developed based on the high lead ball screws. In this study, a high speed feed drive system at the speed of 60 m/ min has been developed, and its movements characteris-tics are investigated. As the movement characteristics, positioning accuracy, angular accuracy, straightness and micro step-response are measured. Thermal characteristics of the system is also discussed. For measuring the movement characteris-tics, a laser interferometer, a memory-based Hi-coder and a cooling device are used. The experimental results confirm that the movement characteristics and the thermal behavior of the system are satisfactory in the aspect of accuracy and stability.

• 한국정밀공학회지
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• 제31권5호
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• pp.441-449
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• 2014

Thermoplastic fusion bonding is widely used to seal polymer microfluidic devices and optimal bonding protocol is required to obtain a successful bonding, strong bonding force without channel deformation. Besides, UV modification of the PMMA (poly-methyl methacrylate) is commonly used for chemical or biological application before the bonding process. However, study of thermal bonding for the UV modified PMMA was not reported yet. Unlike pristine PMMA, the optimal bonding parameters of the UV modified PMMA were $103^{\circ}C$, 71 kPa, and 35 minutes. A very low aspect ratio micro channel (AR=1:100, $20{\mu}m$ depth and $2000{\mu}m$ width) was successfully bonded (over 95%, n>100). Moreover, thermal bonding of multi stack PMMA chips was successfully demonstrated in this study. The results may applicable to fabricate a complex 3 dimensional microchannel networks.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 G
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• pp.3325-3327
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• 1999

A microgripper driven by E-T (electro-thermal) actuators has been designed and fabricated by surface micromachining. This microgripper consists of two E-T actuators. Each actuator has two arms with different widths joined at the end to form a 'U' shape. The wider 'cold' arm has a narrow flexure at the end (anchor or electrode side) for easy bending, This actuator can be fabricated with only two masks - one for the sacrificial layer and the other for the poly-Si structure layer. An E-T actuator bends its arm due to unequal thermal expansion between the 'cold' arm and the 'hot' arm, This actuator tip moves laterally in an arcing motion towards the cold arm side when the structure is unevenly heated by the applied current. Therefore each microgripper is actuated inwards and can hold a micro object. The fabricated E-T actuator was operated in the range of $2{\sim}12V$ and $1{\sim}5mA$. and maximum tip displacement was $13.6{\mu}m$. This device may become useful in many applications because an E-T actuator can be designed and fabricated easily, and obtain large displacement.

• 한국재료학회지
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• 제8권8호
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• pp.744-750
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• 1998

마이크로 머신 소자는 일반전자 소자와 달리 소자 자체에 미세한 기계적 구조물을 갖고 있으며, 이의 구동을 통하여 센서 또는 엑츄에이터의 기능을 갖게 된다. 이 소자들은 그 작동 요구특성에 따라 패키지의 기계적, 환경적 격리를 요구하거나 분위기조절이 요구되는 등 까다로운 패키지 특성을 필요로 한다. 또한 미세한 작동소자들로 인하여 열 및 열응력에 매우 민감하며, 패키지방법에 따라 구동부위의 작동 특성이 크게 변화할 수 있다. 본 연구에서는 마이크로 머신 소자가 패키지 상에 접촉되어 패키지 될 때, 소자의 접촉 재료 및 공정온도, 크기 등이 마이크로 머신 소자에 미치는 열응력을 연구하였다. 유한요소해석법을 사용하여 소자에 미치는 열응력과 이로 인한 마이크로머신 소자의 물리적 변형을 예측하고, 이를 통하여 마이크로 머신 소자 패키지에 최소한의 열응력을 미치는 소자접속 재료의 선별과 패키지 설계의 최적화를 이루고자 하였다.