• Journal of the Korean Society for Precision Engineering
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• v.21 no.5
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• pp.32-37
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• 2004

Polishing processes are widely used in the glass, optical, die and semiconductor industries. Chemical Mechanical Polishing (CMP) especially is becoming one of the most important ULSI processes for the 0.25m generation and beyond. CMP is conventionally carried out using abrasive slurry and a polishing pad. But the surface of the pad has irregular pores, so there is non-uniformity of slurry flow and of contact area between wafer and the pad, and glazing occurs on the surface of the pad. This paper introduces the basic concept and fabrication technique of the next generation CMP pad using micro-molding method to obtain uniform protrusions and pores on the pad surface.

• Journal of Computational Design and Engineering
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• v.3 no.3
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• pp.179-190
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• 2016

A kind of modified epoxy resin sheet molding compounds of the impeller has been designed. Through the test, the non-metal impeller has a better environmental aging performance, but must do the waterproof processing design. In order to improve the stability of the impeller vibration design, the influence of uncertainty factors is considered, and a multi-objective robust optimization method is proposed to reduce the weight of the impeller. Firstly, based on the fluid-structure interaction, the analysis model of the impeller vibration is constructed. Secondly, the optimal approximate model of the impeller is constructed by using the Latin hypercube and radial basis function, and the fitting and optimization accuracy of the approximate model is improved by increasing the sample points. Finally, the micro multi-objective genetic algorithm is applied to the robust optimization of approximate model, and the Monte Carlo simulation and Sobol sampling techniques are used for reliability analysis. By comparing the results of the deterministic, different sigma levels and different materials, the multi-objective optimization of the SMC molding impeller can meet the requirements of engineering stability and lightweight. And the effectiveness of the proposed multi-objective robust optimization method is verified by the error analysis. After the SMC molding and the robust optimization of the impeller, the optimized rate reached 42.5%, which greatly improved the economic benefit, and greatly reduce the vibration of the ventilation system.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.176-179
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• 2009

Injection molding is one of the most general manufacturing processes of polymers. The deformation of final molded parts occurs because of the change of temperature and pressure during injection molding process. The deformation of injection molded parts depends on many operational conditions, such as, melt temperature, injection speed, mold temperature, packing pressure, and the structure of mold. In the present paper, injection molding experiments were performed to find the process conditions to affect the average shrinkage in thickness direction and the replication ratio of fine patterns on the surface for the final injection-molded LGP samples. As a results, in the cases of PC(Polycarbonate), when the melt temperature was under $285^{\circ}C$, both average shrinkage and replication ratios were mainly influenced by packing pressure. However, the replication ratio was more influenced by melt temperature than packing pressure for the cases of higher melt temperature.

• Design & Manufacturing
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• v.13 no.2
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• pp.30-36
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• 2019

Traditional cell culture(2-dimensional) is the method that provide a nutrient and environment on a flat surface to cultivate cells into a single layer. Since the cell characteristics of 2D culture method is different from the characteristics of the cells cultured in the body, attempts to cultivate the cells in an environment similar to the body environment are actively proceeding in the industry, academy, and research institutes. In this study, we will develop a technology to fabricate micro-structures capable of culturing cells on surfaces with various curvatures, surface shapes, and characteristics. In order to fabricate the hemispheric plastic structure(thickness $50{\mu}m$), plastic preform mold (hereinafter as "preform mold") corresponding to the hemisphere was first prepared by injection molding in order to fabricate a two - layer structure to be combined with a flat plastic film. Then, thermoplastic polymer dissolved in an organic solvent was solidified on a preform mold. As a preliminary study, we proposed injection molding conditions that can minimize X/Y/Z axis deflection value. The effects of the following conditions on the preform mold were analyzed through injection molding CAE, [(1) coolant inlet temperature, (2) injection time, (3) packing pressure, (4) volume-pressure (V/P). As a result, the injection molding process conditions (cooling water inlet temperature, injection time, holding pressure condition (V / P conversion point and holding pressure size)) which can minimize the deformation amount of the preform mold were derived through CAE without applying the experimental design method. Also, the derived injection molding process conditions were applied during actual injection molding and the degree of deformation of the formed preform mold was compared with the analysis results. It is expected that plastic film having various shapes in addition to hemispherical shape using the preform mold produced through this study will be useful for the molding preform molding technology and cast molding technology.

• Journal of the Optical Society of Korea
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• v.13 no.1
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• pp.75-79
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• 2009

A four beam interference optical system for laser micro structuring using a pulse laser was demonstrated. The four beam interference optical system using a pulse laser(picosecond laser) can fabricate micro structure on mold material(NAK80) directly. Micro structure on the polymer can be reproduced economically by injection molding of the micro structure on the mold material. The four beam interference optical system was composed by the DOE(Diffractive Optical Element) and two lenses. The laser intensity distribution of four beam interference was explained by an interference optics point of view and by the image optics point of view. We revealed that both views showed the same result. The laser power distribution of a $1{\mu}m$ peak pattern was made by the four beam interference optical system and measured by the objective lens and CCD. A $1{\mu}m$ pitch dot pattern on the mold material was fabricated and measured by SEM(Scanning Electron Microscopy).

• Design & Manufacturing
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• v.2 no.3
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• pp.6-9
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• 2008

This paper describes the process of structure analysis and injection molding analysis to manufacture the forming injection dies for huge glass insert. Factors such as filling time, filling pressure, material temperature, shrinkage, warpage were investigated by using the analysis software, Moldflow. Runner system and cavity structure were designed and manufactured through the results of deformation analysis data for glass insert. Filling time and filling pressure were analyzed in 3.756sec and 43.37MPa.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.37.1-37.1
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• 2011

Miniaturization of lenses has been widely researched by various scientific and engineering techniques. As a result, micro scaled lens structure could be easily achieved from various fabrication techniques; nevertheless it is still challenging to make nano scaled lenses. This paper reports a novel fabrication method of silicon nanotemplate for nanolens array. The inverse structure of nanolens array was fabricated on silicon substrate by reactive ion etching (RIE) process. This technique has a flexibility to produce different tip shapes using different pattern masks. Once the silicon nano-tip array structure is well-defined using an optimized recipe, it is followed by polymer molding to duplicate nanolens array from the template. Finally, the nanostructures formed on silicon nanotemplate and polymer replica were investigated using FE-SEM and AFM measurements. The nano scaled lens can be manufactured from the same template, also using other replication techniques such as imprinting, injection molding and so on.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.165-172
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• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.356-357
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• 2005

Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials at their surfaces. Especially, polishing pad is considered as one of the most important consumables because of its properties. Subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure pad. Microstructure pad is designed to have uniform structure on its surface and fabricated by micro-molding technology. And then STI CMP performances such as oxide dishing and nitride corner rounding are evaluated.

• Electrical & Electronic Materials
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• v.10 no.6
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.