• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2007년도 추계학술대회 논문집
• /
• pp.13-14
• /
• 2007

• 대한화학회지
• /
• 제46권2호
• /
• pp.125-138
• /
• 2002

15세기 전반에 70-80년 동안 분청과 백자를 생산한 전라남도 광주시 충효동 가마터에 대하여 여러 가지 과학기술적 상황들을 조사하였다. 발굴된 위치와 퇴적층의 층위에 따라 일곱 그룹으로 나눈 분청사기의 태토와 유약 원료에 대하여 광물성분의 특징을 조사하고, 미세구조와 번조온도를 분석하여 제작 당시의 원료선택과 처리과정, 그리고 번조공정 등의 제작기술의 변화과정을 살펴보았다. 도편의 미세구조는 광학현미경과 전자현미분석장치로, 그리고 광물성분은 X-선 회절분석기와 편광현미경으로 관찰하였다. 번조온도 측정은 재번조한 후의 미세구조 변화를 관찰하는 방법을 이용하였다. CHE2그룹과 같이 왕실을 위한 최상급의 제품들도 있었지만 대중화되고 백자에 대한 선호도가 증가하면서 분청의 질이 많이 떨어진 것을 볼 수 있었다. 모두 이 지역 여러 종류의 흙을 태토와 유약원료로 사용하였으며 1100와 1225$^{\circ}C$사이에서 번조한 것으로 추정되었다.

• 한국생산제조학회지
• /
• 제20권2호
• /
• pp.187-192
• /
• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2002년도 금형가공 심포지엄
• /
• pp.285-291
• /
• 2002

The shearing process for the sheet metal is normally used in the precision elements such as a frame of TFT-LCD or lead frame of If chips. In these precision elements, the burr formation prevents the system assembly and needs the additional burr removing process. In this paper, we developed the small size NC punching system which has an aligning kinematics between the rectangular shaped punch and die. The punch is driven by an ai cylinder and the sheet metal is moving on the X-Y table system which is driven by two stewing motors. The microprocessor control the whole system and communicate with the monitoring PC by RS232C serial communication protocol. The graphic user interface program in PC monitors nil control the punching system. The cross shaped joint hinge supports the punching die and positioned by two differential screws, whose are installed in perpendicular directions. The aligning between the punch and die is performed using the sheets of half thickness(0.1mm Brass) of the real process for the frame of the TFT-LCD. Using half thickness Brass, the burr formation is magnified and we can decide the aligning direction more easily then using the real thickness(0.2mm) Aluminum. In this paper, the aligning results are measured manually using the SEM photographs and we hope to make the automated aligning procedures using some kinds of image processing techniques.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2003년도 춘계학술대회논문집
• /
• pp.230-235
• /
• 2003

In the micro hole punching, the size and shape of burr and burnish zone are very important factors to evaluate quality of micro holes which depend on punch-die clearance, stain rate, workpiece material and etc. To get micro holes with small burr and wide burnish zone for industrial demands, not only the parametric study but also a study on fracture behavior in shear band are necessary. In this study, 100 $\mu\textrm{m}$, 25 $\mu\textrm{m}$ micro holes in diameter were fabricated on brass (Cu63/Zn37) and SUS 316 foils as aspect ratio 1:1, and the characteristics of micro holes was investigated comparing with man holes over several mm by scanning electron microscopic views and section views. Like macro hole, micro hole is also composed of 4 portions, rollover, burnish zone, fracture zone and it shows similar fracture behavior in shear band, but？ by high strain rate (10$^2$∼ 10$^3$s$\^$-1/) unlike macro hole fabrication and increment of relative grain size several different results are shown.

• 소성∙가공
• /
• 제12권4호
• /
• pp.314-319
• /
• 2003

In the micro hole punching, the size and shape of burr and burnish zone are very important factors to evaluate quality of micro holes which depend on punch-die clearance, strain rate, workpiece material and etc. To get micro holes with small burr and wide burnish zone for industrial demands, not only the parametric study but also a study on fracture behavior in shear band are necessary. In this study, 100 $\mu$m, 25 $\mu$m micro holes in diameter were fabricated on brass (Cu63/Zn37) and SUS 316 foils as aspect ratio 1:1, and the characteristics of micro holes was investigated comparing with those of macro holes over several mm by scanning electron microscopic views and section views. Like macro hole, micro hole is also composed of 4 portions, rollover. burnish zone, fracture zone and burr, and it shows similar fracture behavior in shear band. But by high strain rate (10$^2$∼10$^3$s$^{-1}$ ) condition unlike that of macro hole fabrication and by the increment of relative grain size in the direction of the workpiece thickness, fracture zone is not observed.

• 산업기술연구
• /
• 제25권B호
• /
• pp.121-126
• /
• 2005

Micro wires manufactured by the straightening process are used in the BT(Bio-Technology), IT(Information-Technology), NT(Nano-Technology). We have developed a novel wire straightener which uses the direct heating method(DHM) for straightening the micro wire and shearing device for burr-less cutting. In this study, we confirm the tendency of micro wire after the shearing process. It is impossible to remove the burr in the shearing process. However, the embodiment of minimum burr size after the shearing process is the best in-process method. In order to minimize the burr size, we have accomplished the various experiment condition such as the U-groove, the effect of the counter punch, the shear angle, clearance.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1997년도 추계학술대회 논문집
• /
• pp.1084-1087
• /
• 1997

In this paper, we developed the micro NCT system for punching the thin plates, which is driven is driven by the standalone type microprocessor. In order to adjust the alignment between the punch and die in-situ punching procedures, the non-contact type laser sensor for measuring the burr and micro-driving system for punching die with using the differential screw are developed. The height of burr in four directions in the punched hole of test specimen are measured, and the measured data are transferred to the personal computer by RS232C serial communication technology. In the personal computer, by using the graphic user interface type monitoring program and data handling procedures which includes the filtering algorithms, the direction and length of movement of the die position is decided and these data are transferred back to the microprocessor. The microprocessor drives the micro positioning stage based on these data. Even if this method is not a perfect solution for the in-situ alignment in micro punching, but this alignment methodology is accomplished in the same stage just after the punching that we hope to solve the alignment problem in the punching system based on this technology.

• 한국분말야금학회:학술대회논문집
• /
• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
• /
• pp.747-749
• /
• 2006

SMS Meer GmbH, formerly Mannesmann and today part of the SMS Group, has been building powder presses since the early 1950s. The patents developed here in this field have long since documented the pioneering work carried out for the PM industry. The paper focuses on the challenge of reconciling the contradictory demands in the production of highly complex and crack-free PM parts. The process employed with the patented Controlled Punch Adapter (CPA) [1] counters possible cracking reliably and directly at the source. In this way is it possible to develop new and highly complex parts to series production maturity in a minimum of time even without simulation of the press cycle [2]. The quality data achieved in the production series, almost 100% crack and micro crack-free green parts with optimum density distribution over all press levels is unrivalled and thus gives the user a clear lead over the competition.

• 소성∙가공
• /
• 제21권1호
• /
• pp.5-12
• /
• 2012

The weight of the bipolar plate is one of the crucial aspects of improving power density in PEMFC stacks. Aluminum alloys have good mechanical properties such as density, electrical resistivity, and thermal conductivity. Furthermore, using aluminum in a bipolar plate instead of graphite reduces the bipolar plate cost and makes machining easier. Therefore in this study, an aluminum alloy was selected as the appropriate material for a bipolar plate. Results from feasibility experiments with the aim of developing fuel cells consisting of Al bipolar plates with multiple channels are presented. Dynamic loading was applied and the formability of micro channels was estimated as a function of punch pressure and die radius. Sheets of Al5052 with a thickness of 0.3mm were used. For a die radius of 0.1mm the formability was optimized with a sine wave dynamic load of 90kN at maximum pressure and 5 cycles of a sine wave punch travel. The experimental results demonstrate the feasibility of the proposed manufacturing technique for producing bipolar plates.