• Journal of Welding and Joining
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• v.26 no.2
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• pp.12-15
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• 2008

• Proceedings of the Korean Society of Laser Processing Conference
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• 2005.06a
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• pp.121-125
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• 2005

• Proceedings of the Korean Society of Laser Processing Conference
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• 2001.05a
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• pp.92-95
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• 2001

• Proceedings of the Korean Society of Laser Processing Conference
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• 2005.11a
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• pp.132-136
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• 2005

• Proceedings of the Korean Vacuum Society Conference
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• 2006.08a
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• pp.183-183
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• 2006

• Proceedings of the Korean Society of Laser Processing Conference
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• 2000.06a
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• pp.47-50
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• 2000

• Journal of Institute of Convergence Technology
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• v.2 no.2
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• pp.25-29
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• 2012

Micro machining technologies have been required to satisfy various conditions in a high-technology industry. Micro electrochemical process is one of the most precision machining methods. Micro electrochemical process has been divided into electrochemical etching through protective layer and electrochemical machining using ultrashort voltage pulses. Micro shaft can be fabricated by electrochemical etching. The various protective layers such as photo-resist, oxide layer and oxidized recast layer have been used to protect metal surface during electrochemical etching. Micro patterning on metal surface can be machined by electrochemical etching through protective layer. Micro hole, groove and structures can be easily machined by electrochemical machining using ultrashort voltage pulses. Recently, the groove with subnanometer was machined using AFM.

• International Journal of Precision Engineering and Manufacturing
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• v.6 no.4
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• pp.49-54
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• 2005

In this paper, micro structuring technique using localized electrochemical deposition (LECD) with ultra short pulses was investigated. Electric field in electrochemical cell was localized near the tool tip end region by applying pulses of a few hundreds of nano second duration, Pt-Ir tip was used as a counter electrode and copper was deposited on the copper substrate in mixed electrolyte of 0.5 M $CuSO_4$ and 0.5 M $H_2SO_4$, The effectiveness of this technique was verified by comparison with ECD using DC voltage. The deposition characteristics such as size, shape, surface, and structural density according to applied voltage and pulse duration were investigated. The proper condition was selected based on the results of the various experiments. Micro columns less than $10{\mu}m$ in diameter were fabricated using this technique. The real 3D micro structures such as micro spring and micro pattern were made by the presented method.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.8
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• pp.134-139
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• 2000

In order to understand the removal mechanism and seek the optimal conditions. KrF excimer laser ablation of Cr films on glass substrates is investigated. The surface morphology of the laser-irradiated spot is examined by SEM. The measured single-shot ablation rate is found to be about two times the result of numerical analysis based on a surface vaporization model and heat conduction theory. Surface morphology examination indicates that the Cr film is removed by the sequence of melting-surface vaporization-,melt expulsion by plasma recoil and that the outmost ripple of the diffraction pattern gives a strong effect on the morphology of molten Cr during the melting and vaporization processes. To seek the optimal process parameters for micro patterning morphological investigation is carried out experimentally on samples having different chromium film thicknesses. Optimal processing conditions are determined to enhance the accuracy and quality of thin film removal for micro patterning.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.199-204
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• 2007

Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C$ to $150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.