• Journal of Welding and Joining
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• v.21 no.1
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• pp.99-106
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• 2003

This research was aimed to evaluate the material degradation with various microstructures of X20CrMoV121 steel weldment by Advanced Small Punch(ASP) test. Due to the regional limitation on constitutive structures, the minimized loading ball(${\varphi}1.5mm$) and bore diameter of lower die(${\varphi}3mm$) were designed for the ASP test. The micro-hardness test was also performed to assess the mechanical properties with artificial aging heat treatment. Material degradation was estimated by ductile-brittle transition temperature(DBTT). The results obtained from the ASP test were compared with those from conventional small punch(CSP) test and CVN impact test for several weldment microstructures. It was found that the ASP test clearly showed the microstructural dependance on the material degradation in the weldment.

• Journal of Welding and Joining
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• v.21 no.4
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• pp.25-30
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• 2003

There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.

• Transactions of Materials Processing
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• v.19 no.3
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• pp.179-184
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• 2010

The present study is focused on the deep drawability and product qualities of ultra thin beryllium copper sheet metal. The goal of this research is to investigate the limit drawing ratio in deep drawing of ultra thin beryllium copper metal. For the experiment, beryllium copper(C1720, $50{\mu}m$ in thickness) is used. Tensile test are also carried out to find out the material properties. Deep drawing experiments are carried out in Universal Testing Machine(UTM) to obtain limit drawing ratio. Deep drawing tests are carried out for various specimen sizes. Teflon film is used as a lubricant and constant blank holding force is imposed. Sheet thickness and surface hardness are measured along radial direction after deep drawing. Thickness is measured using optical microscope. For beryllium copper(C1720), the maximum LDR of 2.4 is obtained when the die shoulder radius is 20 or 30 times of sheet thickness.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.6 no.3
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• pp.16-23
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• 2007

An experimental investigation with diode laser system was carried out to study the effect of surface heat treatment on the die materials(SM45C, SKD11, SK3). The surface heat treatment characteristics of the laser beam are evaluated using hardness tests, optical microscopy, X-ray diffraction and energy dispersive X-ray spectroscopy(EDS). Results indicated that the beam size, focal length, feed rates are changed surface hardened characteristics. SM45C is higher hardness than other materials and composed to martensite grain at hardened zone, whereas other materials(SKD11, SK3)are low hardness than expected and composed to austenite and allayed martensite at hardened zone. The intensive X-ray diffraction patterns of (110)-(200)-(211) is detected hardened surface and the hardened surface distributed plenty of carbon density than metal zone.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.494-497
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• 2000

This paper presents the fine-shearing experimental investigation using brass sheets. Shearing including blanking, trimming, piercing, etc is one of the most frequently used processes in sheet metal manufacturing. In this study, an individual set of tooling was designed and fabricated to carry out experiment for shearing process. In order to investigate the effect of shearing surface correspond to die clearance, the profile of shearing surface was examined by using microscope. Futhermore, the relationship between shearing force and the profile of shearing surface was considered.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.6
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• pp.1474-1486
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• 1990

The frictional characteristics of galvanized sheet steels(GA, EG, EGF, EGN) for automobiles were studied and compared with that of cold rolled sheet steel. A draw bead tester which simulates metal flow through a draw bead in stamping die face was used to measure coefficients of friction of galvanized sheet steels for four kinds of lubricants. Stamping formability of galvanized sheet steels for quarter outer panel was examined. The results show that stamping formability and friction characteristics were mainly influenced by the nature of zinc coating, surface roughness and micro hardness of coated layer, and proved to be very sensitive to the lubricant used.

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.873-878
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• 2000

Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.186-189
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• 2005

This paper was designed to assess the adhesive properties of hard coatings on non-nitrided and nitrided various tool steels. Estimations of adhesion were done to scratch test which is mainly used in hard coating. The critical load(Lc) between coating and substrate is defined through analysis of frictional load vs. normal load curve, signals of acoustic emission and optical observations. Coatings employed in this study are TiN, CrN and TiAlN, tools as substrates are STD11, STD61 and SKH51. It was classified to substrates with/without nitrided layer and hard coatings on substrate were deposited by arc PVD. Results showed that harder substrates and coatings give higher values of critical loads.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.5
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• pp.59-66
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• 2003

This study suggests the new ultraprecision finishing techniques for micro die and mold parts using magnetic field-assisted polishing. Conventional magnetic abrasives have several disadvantages, which are missing of abrasive particle and inequal mixture between magnetic particle and abrasive particle. Therefore, bonded magnetic abrasive particles are fabricated by several method. For example, plasma melting and direct bonding. Carbonyl iron powder is used as magnetic particle there silicon carbide and alumina are abrasive particles. Developed magnetic abrasives are analyzed using SEM. Feasibility of magnetic abrasive and polishing performance of this magnetic abrasive particles also have been investigated. After polishing, surface roughness of workpiece is reduced from 85.4 ㎚ Ra to 9 ㎚ RA.