• 제목/요약/키워드: Micro behavior

검색결과 1,056건 처리시간 0.022초

Effective mechanical properties of micro/nano-scale porous materials considering surface effects

  • Jeong, Joonho;Cho, Maenghyo;Choi, Jinbok
    • Interaction and multiscale mechanics
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    • 제4권2호
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    • pp.107-122
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    • 2011
  • Mechanical behavior in nano-sized structures differs from those in macro sized structures due to surface effect. As the ratio of surface to volume increases, surface effect is not negligible and causes size-dependent mechanical behavior. In order to identify this size effect, atomistic simulations are required; however, it has many limitations because too much computational resource and time are needed. To overcome the restrictions of the atomistic simulations and graft the well-established continuum theories, the continuum model considering surface effect, which is based on the bridging technique between atomistic and continuum simulations, is introduced. Because it reflects the size effect, it is possible to carry out a variety of analysis which is intractable in the atomistic simulations. As a part of the application examples, the homogenization method is applied to micro/nano thin films with porosity and the homogenized elastic coefficients of the nano scale thickness porous films are computed in this paper.

Co-sputtering법으로 제조한 InSb 박막의 미세구조와 전자거동 (Micro structures and electronic behavior of InSb using by co-sputtering method)

  • 김태형;소병문;송민종;박춘배
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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    • pp.782-784
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    • 2002
  • Many compound semiconductors which have high carrier mobility and small band gap have attentive in application of various practical a field. Especially, InSb served for Hall device and magnetic resistor such as magnetic sensor because InSb thin film has high mobility. Many studies on InSb thin film deposition because In and Sb has been very different feature of vapor pressure($10^4$ times) When In and Sb deposited. In this paper studied it In and Sb deposited simultaneously using by method of co-sputtering deposotion. This process, get to effects of manufacture process simplification. After that this paper observed micro structure and electronic behavior of InSb thin film using by co-sputtering.

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금형 표면 거칠기의 방향성이 판재의 마찰 특성에 미치는 영향 연구 (Study of Tool Surface Texture Directionality Effect on Frictional Behavior of Sheet Metal Forming)

  • 한수식
    • 소성∙가공
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    • 제29권2호
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    • pp.113-117
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    • 2020
  • Various parameters are involved in the frictional behavior of steel sheet during stamping. We performed various tests in order to investigate the influence of tool surface texture directionality upon the resulting friction in sheet forming processes. Four different tools were manufactured which gave us a range of roughness for both parallel and transverse texture directions. Each of the tools was examined in flat type friction tests under identical test conditions. The tool with the transverse surface texture produces significantly lower levels of friction than the tool with parallel texture direction. Considering the lubrication mechanism associated with transverse texture, one can imagine the lubricant being constantly supplied from the reservoir of the micro valley to the point of contact and hence producing the lower levels of friction seen.

코팅된 실리콘웨이퍼의 Microtribological 특성 (Micro-tribological Properties of Coated Silicon Wafer)

  • 차금환;김대은
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 1998년도 제27회 춘계학술대회
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    • pp.91-96
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    • 1998
  • In recent years, the tribological behavior of coated ceramic material has been the topic of much interest. Particularly, the understanding of the tribological performance of thin film under light load is important for potential applications in MEMS. In this work under light load and low speed, the tribological behavior of coated silicon was investigated. The results show that both adhesive and abrasive wear occur depending on the sliding condition. Also the effect of humidity on friction was influenced by the apparent ares of contact between the two surfaces. Finally, undulations on the silicon wafer were found to be effective in trapping wear particles.

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공기정압 stage의 초정밀위치결정을 위한 기본특성 (A Study on the Ultraprecision Positioning Characteristic of Aerostatic Stage)

  • 황주호;김중천;이재형;박천홍
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 추계학술대회 논문집
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    • pp.175-178
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    • 2000
  • An aerostatic stage has frictionless behavior, so it has a advantage of investigation into positioning characteristics. A one-dimensional aemstatic ceramic stage with ballscrew driven and laser scale feedback system is manufactured. aiming at investigating positioning characteristic of aerostatic stage, especially position error and repeatability, we analyze positioning behavior with other factors such as angular error, temperature. Experimemal results show that the aerostatic stage has a l0nm micro step response. Comparing experimental results and calculated abbe's error, we confirm that mean of position error is owing to angular error. And, also we confirm the temperature is dominant factor of repeatability in ten nm order.

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Mg-4%Zn 주조 합금의 부식 거동에 미치는 Sn 첨가의 영향 (Effect of Sn Addition on Corrosion Behavior of Mg-4%Zn Casting Alloy)

  • 한진구;전중환
    • 한국주조공학회지
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    • 제37권3호
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    • pp.63-70
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    • 2017
  • In the present study, effects of an addition of Sn on the microstructure and corrosion behavior were investigated in Mg-4%Zn-(0-3)%Sn casting alloys. With an increase in the Sn content, the ${\alpha}-(Mg)$ dendritic cell size was reduced, whereas the total amount of precipitates increased due to the formation of the $Mg_2Sn$ phase. It was found in immersion and electrochemical corrosion tests that the addition of Sn has a detrimental effect on the corrosion resistance of the Mg-4%Zn alloy. Microstructural examinations of the corrosion product and the corroded surface indicated that an accelerated micro-galvanic effect by the $Mg_2Sn-phase$ particles and a less protective corrosion product on the surface were responsible for the increased corrosion rate at a higher Sn content.

미세 비아홀 펀칭 공정 중 이종 재료 두께에 따른 버 생성 (Thickness Effect of Double Layered Sheet on Burr Formation during Micro-Via Hole Punching Process)

  • 신승용;임성한;주병윤;오수익
    • 소성∙가공
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    • 제13권1호
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    • pp.65-71
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    • 2004
  • Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

A new mindlin FG plate model incorporating microstructure and surface energy effects

  • Mahmoud, F.F.;Shaat, M.
    • Structural Engineering and Mechanics
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    • 제53권1호
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    • pp.105-130
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    • 2015
  • In this paper, the classical continuum mechanics is adopted and modified to be consistent with the unique behavior of micro/nano solids. At first, some kinematical principles are discussed to illustrate the effect of the discrete nature of the microstructure of micro/nano solids. The fundamental equations and relations of the modified couple stress theory are derived to illustrate the microstructural effects on nanostructures. Moreover, the effect of the material surface energy is incorporated into the modified continuum theory. Due to the reduced coordination of the surface atoms a residual stress field, namely surface pretension, is generated in the bulk structure of the continuum. The essential kinematical and kinetically relations of nano-continuums are derived and discussed. These essential relations are used to derive a size-dependent model for Mindlin functionally graded (FG) nano-plates. An analytical solution is derived to show the feasibility of the proposed size-dependent model. A parametric study is provided to express the effect of surface parameters and the effect of the microstructure couple stress on the bending behavior of a simply supported FG nano plate.

축소모델 휨부재의 재료거동에 관한 연구 (A Study on Behavior of materials for Flexural member of Reduced-Scale Models)

  • 배성용
    • 한국해양공학회지
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    • 제14권2호
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    • pp.84-88
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    • 2000
  • The main objectives of this study are to compare the obtained mechanical characteristics of reduced-scale model materials with those of the prototype and to provide the information on the best selection of materials. Manufacturing techniques on the micro-concrete and reduced reinforcement are introduced. The test results of these materials are shown to be satisfactory with regard to the similitude requirement. The simple beam tests were performed to verify similitude in the bond behavior between micro-concrete and reduced reinforcement. Those results also prove that these manufacturing and experimental techniques are useful and reliable for reduced-scale model tests.

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일정응력 및 과대과소응력하에서의 피로크랙 발생전파거동 (Fatigue crack behavior under constant stress and periodic overstressing)

  • 송삼홍;이경노
    • 오토저널
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    • 제13권1호
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    • pp.57-65
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    • 1991
  • It is experimented under rotary bending stress that the spacing of two micro hole flaws is adjacent and that it is distant. In order to observe the behavior of fatigue crack propagation, two kinds of specimens are tested under constant stress and periodic overstressing. Although the crack occurs faster when two micro-hole flaws are adjacent than when they are distant, but there is no difference of the number of fracture cycles between two. The crack propagates slower under low-high block stress than under high-constant stress, and it propagates faster under high-low block stress than under low-constant stress. The influence of two-step block stress is serious right after the stress varies.

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