• Title/Summary/Keyword: Micro Punch

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A Microstructural Study on Firing Process of Korean Traditional Ceramics;Punch'ong from Ch'unghyodong, Kwangju (한국 전통 도자기의 번조 공정에 관한 미세구조 연구;광주 충효동 분청사기를 중심으로)

  • Lee, Yeong Eun;Go, Gyeong Sin
    • Journal of the Korean Chemical Society
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    • v.46 no.2
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    • pp.125-138
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    • 2002
  • The kiln at Chollanamdo Kwangjusi Ch'unghyodong, which produced punch'ong and white wares for a period of 70 to 80 years in the 15th century, is examined for their scientific technological param-eters. Punch'ong sherds were divided into seven different groups according to the location and the layer of the waste mounds from which they were excavated. Optical and scanning electron microscope were used for microstructural observations and X-ray diffraction and polarized microscope for mineral characteristics. For determining the firing temperature, sherds were refired at different temperatures and their micro-structural changes were observed. Some wares such as the group CHE2 was high quality wares fired at high emperature around 1200$^{\circ}C$ for palace use, but as the ceramics ware became more widely used and the white wares increasingly preferred over punch'ong, lower quality wares of rougher raw materials were firedat lower temperatures around 1100-1150$^{\circ}C$ in quantity. They used local raw materials of several types, all available locally.

A Study on Evaluation of Shear Strength for Pb-free Solder Joint with Ni-P/Au UBM (Ni-P/Au UBM을 갖는 Pb-free 솔더 접합부의 전단강도 평가에 관한 연구)

  • Cho, Seong-Keun;Yang, Sung-Mo;Yu, Hyo-Sun
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.2
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    • pp.187-192
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    • 2011
  • UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

Characteristics of Symmetric-Shape Parts Shearing on Micro NCT (마이크로 NCT에 의한 대칭형상구멍의 전단특성)

  • Hong N. P.;Kim B. H.;Chang I. B.;Kim H. Y.;Oh S. I.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2002.02a
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    • pp.285-291
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    • 2002
  • The shearing process for the sheet metal is normally used in the precision elements such as a frame of TFT-LCD or lead frame of If chips. In these precision elements, the burr formation prevents the system assembly and needs the additional burr removing process. In this paper, we developed the small size NC punching system which has an aligning kinematics between the rectangular shaped punch and die. The punch is driven by an ai cylinder and the sheet metal is moving on the X-Y table system which is driven by two stewing motors. The microprocessor control the whole system and communicate with the monitoring PC by RS232C serial communication protocol. The graphic user interface program in PC monitors nil control the punching system. The cross shaped joint hinge supports the punching die and positioned by two differential screws, whose are installed in perpendicular directions. The aligning between the punch and die is performed using the sheets of half thickness(0.1mm Brass) of the real process for the frame of the TFT-LCD. Using half thickness Brass, the burr formation is magnified and we can decide the aligning direction more easily then using the real thickness(0.2mm) Aluminum. In this paper, the aligning results are measured manually using the SEM photographs and we hope to make the automated aligning procedures using some kinds of image processing techniques.

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A Study on Fracture Behavior in Shear Band during Micro Hole Punching Process (미세 홀 펀칭시 전단 파괴 거동 연구)

  • 유준환;임성한;주병윤;오수익
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.05a
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    • pp.230-235
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    • 2003
  • In the micro hole punching, the size and shape of burr and burnish zone are very important factors to evaluate quality of micro holes which depend on punch-die clearance, stain rate, workpiece material and etc. To get micro holes with small burr and wide burnish zone for industrial demands, not only the parametric study but also a study on fracture behavior in shear band are necessary. In this study, 100 $\mu\textrm{m}$, 25 $\mu\textrm{m}$ micro holes in diameter were fabricated on brass (Cu63/Zn37) and SUS 316 foils as aspect ratio 1:1, and the characteristics of micro holes was investigated comparing with man holes over several mm by scanning electron microscopic views and section views. Like macro hole, micro hole is also composed of 4 portions, rollover, burnish zone, fracture zone and it shows similar fracture behavior in shear band, but? by high strain rate (10$^2$∼ 10$^3$s$\^$-1/) unlike macro hole fabrication and increment of relative grain size several different results are shown.

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A Study on Shear Fracture Behavior of Metal in Micro Hole Punching Process (금속 소재의 미세 홀 펀칭 시 전단 파괴 거동 연구)

  • 유준환;임성한;주병윤;오수익
    • Transactions of Materials Processing
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    • v.12 no.4
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    • pp.314-319
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    • 2003
  • In the micro hole punching, the size and shape of burr and burnish zone are very important factors to evaluate quality of micro holes which depend on punch-die clearance, strain rate, workpiece material and etc. To get micro holes with small burr and wide burnish zone for industrial demands, not only the parametric study but also a study on fracture behavior in shear band are necessary. In this study, 100 $\mu$m, 25 $\mu$m micro holes in diameter were fabricated on brass (Cu63/Zn37) and SUS 316 foils as aspect ratio 1:1, and the characteristics of micro holes was investigated comparing with those of macro holes over several mm by scanning electron microscopic views and section views. Like macro hole, micro hole is also composed of 4 portions, rollover. burnish zone, fracture zone and burr, and it shows similar fracture behavior in shear band. But by high strain rate (10$^2$∼10$^3$s$^{-1}$ ) condition unlike that of macro hole fabrication and by the increment of relative grain size in the direction of the workpiece thickness, fracture zone is not observed.

The Development of Burrless Shearing System for Straightened Wire (직선화된 와이어의 버 없는 전단기 개발에 관한 연구)

  • Cho, Joon-Won;Kim, Woong-Kyum;Kim, Heon-Young;Kim, Byeong-Hee
    • Journal of Industrial Technology
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    • v.25 no.B
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    • pp.121-126
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    • 2005
  • Micro wires manufactured by the straightening process are used in the BT(Bio-Technology), IT(Information-Technology), NT(Nano-Technology). We have developed a novel wire straightener which uses the direct heating method(DHM) for straightening the micro wire and shearing device for burr-less cutting. In this study, we confirm the tendency of micro wire after the shearing process. It is impossible to remove the burr in the shearing process. However, the embodiment of minimum burr size after the shearing process is the best in-process method. In order to minimize the burr size, we have accomplished the various experiment condition such as the U-groove, the effect of the counter punch, the shear angle, clearance.

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The Development of Micro NCT for Micro Blanking/Punching of Thin Plates (미세박판가공을 위한 마이크로 NCT 제작에 관한 연구)

  • 홍남표;신용승;최근형;김병희;장인배;김헌영;오수익
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.10a
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    • pp.1084-1087
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    • 1997
  • In this paper, we developed the micro NCT system for punching the thin plates, which is driven is driven by the standalone type microprocessor. In order to adjust the alignment between the punch and die in-situ punching procedures, the non-contact type laser sensor for measuring the burr and micro-driving system for punching die with using the differential screw are developed. The height of burr in four directions in the punched hole of test specimen are measured, and the measured data are transferred to the personal computer by RS232C serial communication technology. In the personal computer, by using the graphic user interface type monitoring program and data handling procedures which includes the filtering algorithms, the direction and length of movement of the die position is decided and these data are transferred back to the microprocessor. The microprocessor drives the micro positioning stage based on these data. Even if this method is not a perfect solution for the in-situ alignment in micro punching, but this alignment methodology is accomplished in the same stage just after the punching that we hope to solve the alignment problem in the punching system based on this technology.

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Highly Complex Green Parts in Excellent Quality

  • Nies, Norbert;Peters, Detlef
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.747-749
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    • 2006
  • SMS Meer GmbH, formerly Mannesmann and today part of the SMS Group, has been building powder presses since the early 1950s. The patents developed here in this field have long since documented the pioneering work carried out for the PM industry. The paper focuses on the challenge of reconciling the contradictory demands in the production of highly complex and crack-free PM parts. The process employed with the patented Controlled Punch Adapter (CPA) [1] counters possible cracking reliably and directly at the source. In this way is it possible to develop new and highly complex parts to series production maturity in a minimum of time even without simulation of the press cycle [2]. The quality data achieved in the production series, almost 100% crack and micro crack-free green parts with optimum density distribution over all press levels is unrivalled and thus gives the user a clear lead over the competition.

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Forming of Metallic Bipolar Plates by Dynamic Loading (Dynamic Load를 이용한 박막 금속 분리판 성형기술)

  • Koo, J.Y.;Kang, C.G.
    • Transactions of Materials Processing
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    • v.21 no.1
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    • pp.5-12
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    • 2012
  • The weight of the bipolar plate is one of the crucial aspects of improving power density in PEMFC stacks. Aluminum alloys have good mechanical properties such as density, electrical resistivity, and thermal conductivity. Furthermore, using aluminum in a bipolar plate instead of graphite reduces the bipolar plate cost and makes machining easier. Therefore in this study, an aluminum alloy was selected as the appropriate material for a bipolar plate. Results from feasibility experiments with the aim of developing fuel cells consisting of Al bipolar plates with multiple channels are presented. Dynamic loading was applied and the formability of micro channels was estimated as a function of punch pressure and die radius. Sheets of Al5052 with a thickness of 0.3mm were used. For a die radius of 0.1mm the formability was optimized with a sine wave dynamic load of 90kN at maximum pressure and 5 cycles of a sine wave punch travel. The experimental results demonstrate the feasibility of the proposed manufacturing technique for producing bipolar plates.