• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1526-1531
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• 2007

Data transmission capacity that is required in 2010 is forecasted that increase by optical communication capacity more than present centuple, and is doing increased demand of optical communication related industry product present. Specially, Lid glass' application that is one of optical communication parts is used in optical communication parts manufacture of Fiber array, Ferrule array, Fanout Black, Silica optical waveguide chip and splitter etc. Also, it is used widely for communication network system, CATV, ATM-PON, FTTH and system. But, Lid glass need much processing times and becomes cause in rising prices of optical communication parts because production cost is expensive. The objectives, of this work is to suggest the micro concave and convex pattern manufacturing technology on borosilicate plate using high temperature and compression molding method. As a result, could developed micro pattern Mold more than 5 pattern, and reduce Lid Glass manufacture cycle time.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1535-1538
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• 2008

Carbon nanotube arrays were fabricated using micro molding in capillary (MIMIC) process. Patterns remained on the surface in the pattern complementary to that present in the mold. CNTs were selectively grown on the MIMIC patterned sites with a triode PECVD. And turn on field for $10\;{\mu}A/cm^2$ electron emission current was $2.2\;V/{\mu}m$ turn on field.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1215-1219
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• 2003

Light Guide Panel(LGP) is a key part of backlight unit(BLU) which transforms line-light of lamp to surface-light. Dot pattern is formed on the injected LGP surface by screen printing. This dot pattern is composed of several ten thousands micro dots of diameter 150-180$\mu\textrm{m}$ or so. The dot patterning by screen printing causes low productivity and low performance of TFT-LCD. This research develops the micromachining technology for LGP mould which could form micro dot pattern by injection molding, removing the existing screen printing process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.661-662
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• 2006

This research is on a laser soldering using the micro solder-balls used in flip chip packaging process. A laser source used in laser soldering is Nd:YAG laser(250W and 60W). Solder-balls of 100, 300, $500{\mu}m$ size are used in experiments. The laser head to deliver a laser beam and the nozzle to transfer solder-balls are manufactured to bump solder-balls. After soldering solder-balls the shear test is carried out to determine the wetting at the interface between the surface and a solder-balls With the results of solder bumping tests a laminated molding is accomplished for manufacturing the three dimensional molding.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.710-713
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• 2005

In this study, waffle type barrier ribs for counter electrode discharge cells were prepared via micro-molding process. The master mold was prepared by UV lithography and working mold was manufactured by replicating the master mold. The UV paste used in this study consisted of ceramic powders for the barrier ribs, binder, hardener, and dispersant was filled into cavities of a polymeric mold by action of capillary pressure developed between mold and paste. The results demonstrated a possibility of one-step process for the manufacturing of waffle type barrier ribs embedded with sustaining electrodes.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.41-42
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• 2006

Small powder size is very useful in achieving detailed structures. STS 316 nanopowders with an average diameter of 100 nm and $5{\mu}m$ were utilized to produce feedstock. The mixing behavior of the feedstock indicated that the nanoparticle feedstock produced the highest mixing torque at various powder loading compared to the micropowder feedstock. The nanoparticles feedstocks showed that elastic properties are dominant in flow behavior and high viscosity. Conversely the micropowders feedstocks, viscous properties are dominant in flow behavior and less viscosity, nanopowders feedstock perform lower flow activation energy than feedstock with bigger particles.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.272-274
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• 2005

A simple method for fabricating micro/nanoscale hierarchical structures is presented using a two-step temperature-directed capillary molding technique. This lithographic method involves a sequential application of molding process in which a uniform polymer-coated surface is molded with a patterned mold by means of capillary force above the glass transition temperature of the polymer. Using this approach, multiscale hierarchical structures for biomimetic functional surfaces can be fabricated with precise control over geometrical parameters and the wettability of a solid surface can be designed in a controllable manner.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.315-318
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• 1999

As low-cost optical waveguides of optical interconnects, we fabricate multimode optical waveguides using a molding process The core size of a optical waveguide is 47 ${\mu}{\textrm}{m}$ $\times$ 41 ${\mu}{\textrm}{m}$. We use the photoresist AZ9260 as a master, polydimethyl-siloxane (PDMS) as a mold. In transferring process to polymeric material, we employ a modified micro-transfer molding process. All processes are simple and low-cost.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.241-244
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• 2004

Microlens patterned micro-mold fabrication method for Light Guiding Plate(LGP), kernel part of LCD-BLU(Back Light Unit), was presented. Instead of erosion dot pattern for LCP optical design, microlens pattern, fabricated by LIGA-reflow process, was applied. Optical pattern design method was also developed not only for negative pattern LGP, but also positive pattern LGP. In order to achieve flow balance during the micro-injection molding process and dimensional accuracy, two LGP pattern was made in one micro-mold.

• Journal of Institute of Convergence Technology
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• v.5 no.1
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• pp.13-17
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• 2015

In wafer level molding progress, the thermal releasing failure phenomenon is shown up as the important problem. This phenomenon can cause the problem including the warpage, crack of the molded wafer. The thermal releasing failure is due to the insufficiency of adhesion strength degradation of the molding tape. To solve this problem, we studied experimental method increasing the release property of the molding tape through the plasma surface treatment on the wafer substrate. In this research, the vacuum plasma treatment system is used for release property improvement of the molding tape and controls the operating condition of the hydrophilic($O_2$, 100kW, 10min) and hydrophobic($C_2F_6$, 200kW, 10min). In order to perform the peeling test for measuring the releasing force precisely, we remodel the micro scale material property evaluation system developed by Korea institute of industrial technology. In case of hydrophilic surface treatment on the wafer substrate, we can figure out the releasing property of molding tape increase. In order to grasp the effect that it reaches to the release property increase when repeating the hydrophilic treatment, we make an experiment with twice treatment and get the result to increase about 12%. We find out the hydrophilic surface treatment method using plasma can improve releasing property of molding tape in the wafer level molding process.