• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.1826-1829
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• 2005

Recent advancement in wireless communications and electronics has enabled the development of low power sensor network. Wireless sensor network are often used in remote monitoring control applications, health care, security and environmental monitoring. Wireless sensor networks are an emerging technology consisting of small, low-power, and low-cost devices that integrate limited computation, sensing, and radio communication capabilities. Sensor network platform for health care has been designed, fabricated and tested. This system consists of an embedded micro-controller, Radio Frequency (RF) transceiver, power management, I/O expansion, and serial communication (RS-232). The hardware platform uses Atmel ATmega128L 8-bit ultra low power RISC processor with 128KB flash memory as the program memory and 4KB SRAM as the data memory. The radio transceiver (Chipcon CC1000) operates in the ISM band at 433MHz or 916MHz with a maximum data rate of 76.8kbps. Also, the indoor radio range is approximately 20-30m. When many sensors have to communicate with the controller, standard communication interfaces such as Serial Peripheral Interface (SPI) or Integrated Circuit ($I^{2}C$) allow sharing a single communication bus. With its low power, the smallest and low cost design, the wireless sensor network system and wireless sensing electronics to collect health-related information of human vitality and main physiological parameters (ECG, Temperature, Perspiration, Blood Pressure and some more vitality parameters, etc.)

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.94-97
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• 2003

A precise fabrication technology of glass is increasingly demanded fer the latest Industrial applications of spherical lenses. micro-optical components, laser applications and so on. Most of cases, the surface roughness of glass is required to be minute for improving the optical characteristics. Then. the machining characteristics of SF-5 glass and quarts glass were studied by using the ELID grinding process to get mirror surface and productivity compared with a general lapping process. A rotary type grinder with ELID generator was used to make the mirror surface of glass and a Mitutoyo surface tester and a nano-hardness tester were also used to measure the grinded surface or glass. As the results of experiments. they showed that the surface roughness(Ra) of SF-5 glass was under 7.8 nm and that of quartz glass was under 3.0 nm using the # 8000 grinder. So, the possibility of highly efficient and accurate surface for optical components can be achieved by the ELID grinding process.

• 소성∙가공
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• 제16권1호
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• pp.48-53
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• 2007

LCD-BLU(Liquid Crystal Display - Back Light Unit) consists of several optical sheets: LGP(Light Guiding Plate), light source and mold frame. The LGP of LCD-BLU is usually manufactured by etching process and forming numerous dots with $50{\mu}m$ in diameter on the surface. But the surface roughness of LGP with etched dots is very high, so there is much loss of light. In order to overcome the limit of current etched dot patterned LGP, optical pattern design with microlens of $50{\mu}m$ diameter was applied in the present study. The microlens pattern fabricated by modified LiGA with thermal reflow process was applied to the optical design of LGP and optical simulation was carried out to know tendency of microlens patterned LGP simultaneously. The attention was paid to the effects of different aspect ratio(i.e. $0.2\sim0.5$) of optical pattern conditions to the brightness distribution of BLU with microlens patterned LGP. Finally, high aspect ratio microlens patterned LGP showed superior results to the one made by low aspect ratio in average luminance.

• 한국전기전자재료학회논문지
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• 제20권8호
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• pp.661-665
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• 2007

This paper presents the electrical properties of SiGe HBTs designed with bottom collector and single metal layer structure for RF power amplifier. Base layer was formed with graded-SiGe/Si structures and the collector place to the bottom of the device. Bottom collector and single metal layer structures could significantly simplify the fabrication process. We studied about the influence of SiGe base thickness, number of emitter fingers and temperature dependence $(<200^{\circ}C)$ on electrical properties. The feasible application in $1{\sim}2GHz$ frequency from measured data $BV_{CEO}{\sim}10V,\;f_T{\sim}14GHz,\;{\beta}{\simeq}110,\;NF{\sim}1dB$ using packaged SiGe HBTs. We will discuss the temperature dependent current flow through the e-b, b-c junctions to understand stability and performance of the device.

• 한국세라믹학회지
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• 제50권6호
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• pp.378-383
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• 2013

Continuous fiber-reinforced ceramic matrix composites (CFCCs) have a complex distribution of porosity, consisting of interfiber micro pores and interbundle/interply macro pores. Owing to the complex geometry of the pores and fiber architecture, it is difficult to obtain representative microstructural features throughout the specimen volume with conventional, destructive ceramographic approaches. In this study, we introduce X-ray computed microtomography (X-ray ${\mu}CT$) to nondestructively analyze the microstructures of disk shaped and tubular $SiC_f$/SiC composites fabricated by the chemical vapor infiltration (CVI) method. The disk specimen made by stacking plain-woven SiC fabrics exhibited periodic, large fluctuation of porosity in the stacking direction but much less variation of porosity perpendicular to the fabric planes. The X-ray ${\mu}CT$ evaluation of the microstructure was also effectively utilized to improve the fabrication process of the triple-layered tubular SiC composite.

• 한국분무공학회지
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• 제13권1호
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• pp.34-41
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• 2008

Molecular dynamic simulations have been carried out to study the effect of the nano-structure substrate and its temperature on cluster laminating. The interaction between substrate molecules and liquid molecules was modeled in the molecular scale and simulated by the molecular dynamics method in order to understand behaviors of the liquid cluster on nano-structure substrate. In the present model, the Lennard-Jones potential is applied to mono-atomic molecules of argon as liquid and platinum as nano-structure substrate to perform simulations of molecular dynamics. The effect of wettability on a substrate was investigated for the various beta of Lennard-Jones potential. The behavior of the liquid cluster and nano-structure substrate depends on interface wettability and function of molecules force, such as attraction and repulsion, in the collision progress. Furthermore, nano-structure substrate temperature and beta of Lennard-Jones potential have effect on the accumulation ratio. These results of simulation will be the foundation of coating application technology for micro fabrication manufacturing.

• Journal of Information Display
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• 제4권1호
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.185-188
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• 2001

Chemical mechanical polishing(CMP) process is widely used for global planarization of inter-metal dielectric (IMD) layer and inter-layer dielectric (ILD) for deep sub-micron technology. However, as the IMD and ILD layer gets thinner, defects such as micro-scratch lead to severe circuit failure, which affect yield. In this paper, for the improvement of CMP Process, deionized water (DIW) pressure, purified $N_2$ (P$N_2$) gas, slurry filter and high spray bar were installed. Our experimental results show that DIW pressure and P$N_2$ gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. Also, the filter installation in CMP polisher could reduce defects after CMP process, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. However, the slurry filter is impossible to prevent defect-causing particles perfectly. Thus, we suggest that it is necessary to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of slurry filter. Finally, we could expect the improvements of throughput, yield and stability in the ULSI fabrication process.

• 센서학회지
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• 제10권1호
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• pp.80-85
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• 2001

$Hg_{1-x}Cd_xTe$(MCT)박막을 $CdSO_4$, $TeO_2$, 및 $HgCl_2$이 혼합된 수용액을 사용하여 음극 전착법으로 ITO 유리와 티타늄기판 위에 성장하였다. 주된 박막의 성장 조건 변수로 전착전위와 성장 온도를 고려하였다. 전착된 MCT 박막은 SEM사진과 XRD 및 EPMA측정을 통하여 박막의 성장 조건이 결정 구조와 성분 조성비에 미치는 영향을 분석 연구하였다. XRD 분석으로부터 전착된 MCT 박막은 cubic zinc blonde 구조임을 알 수 있었고, EPMA에 의한 성분조성비의 분석결과로부터 전착전위를 변화시키므로서 MCT의 성분 조성비를 조절할 수 있음을 알 수 있었다.

• 센서학회지
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• 제21권2호
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• pp.114-120
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• 2012

This paper describes the design, fabrication and testing of a micromachined resonant accelerometer consisting of a symmetrical pair of proof masses and double-ended tuning fork(DETF) oscillators. Under the external acceleration along the input axis, the proof mass applies forces to the oscillators, which causes a change in their resonant frequency. This frequency change is measured to indicate the applied acceleration. Pivot anchor and leverage mechanisms are adopted in the accelerometer to generate larger force from a proof mass under certain acceleration, which enables increasing its scale factor. Finite element method analyses have been conducted to design the accelerometer and a silicon on insulator(SOI) wafer with a substrate glass wafer was used for fabricating it. The fabricated accelerometer has a scale factor of 188 Hz/g, which is shown to be in agreement with analysis results.