• 제목/요약/키워드: Metallic film

검색결과 316건 처리시간 0.025초

이온빔 스퍼터링법에 의한 다층막의 표면특성변화 (The surface propery change of multi-layer thin film on ceramic substrate by ion beam sputtering)

  • 이찬영;이재상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.259-259
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    • 2008
  • The LTCC (Low Temperature Co-fired Ceramic) technology meets the requirements for high quality microelectronic devices and microsystems application due to a very good electrical and mechanical properties, high reliability and stability as well as possibility of making integrated three dimensional microstructures. The wet process, which has been applied to the etching of the metallic thin film on the ceramic substrate, has multi process steps such as lithography and development and uses very toxic chemicals arising the environmental problems. The other side, Plasma technology like ion beam sputtering is clean process including surface cleaning and treatment, sputtering and etching of semiconductor devices, and environmental cleanup. In this study, metallic multilayer pattern was fabricated by the ion beam etching of Ti/Pd/Cu without the lithography. In the experiment, Alumina and LTCC were used as the substrate and Ti/Pd/Cu metallic multilayer was deposited by the DC-magnetron sputtering system. After the formation of Cu/Ni/Au multilayer pattern made by the photolithography and electroplating process, the Ti/Pd/Cu multilayer was dry-etched by using the low energy-high current ion-beam etching process. Because the electroplated Au layer was the masking barrier of the etching of Ti/Pd/Cu multilayer, the additional lithography was not necessary for the etching process. Xenon ion beam which having the high sputtering yield was irradiated and was used with various ion energy and current. The metallic pattern after the etching was optically examined and analyzed. The rate and phenomenon of the etching on each metallic layer were investigated with the diverse process condition such as ion-beam acceleration energy, current density, and etching time.

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Electrical breakdown free SWCNT thin film transistors on flexible polyimide substrate

  • 박재현;하정숙
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.58-58
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    • 2010
  • Carbon nanotubes (CNTs) have been extensively studied owing to its superior electrical properties, especially high electron mobility, which can be applied to various nano-electronic devices. However, synthesized CNTs have a mixture of metallic and semiconducting tubes so that their separation has been a tremendous obstacle to the practical application in electronic device structures. Among the different separation methods, electrical breakdown process to selectively burn out the metallic tubes has been quite successful though it needs additional process in the fabrication of device structures. Here, we report on the selective but not perfect growth of semiconducting nanotubes via use of diluted ferritin catalyst. SWCNTs were grown on ferritin catalyst, where the concentration of the ferritin solution was changed. In this way, we could fabricate the electrical breakdown free SWCNT thin film transistors on the flexible polyimide (PI) substrate. When we used the ferritin diluted by 1/2000, ~ 60 % of the SWCNT thin film transistors showed a perfect p-type behavior with an on/off current ratio higher than $10^5$ and on-current greater than $10^{-7}$ A. We will also discuss the photo-response of such formed thin film transistors over both visible and UV light.

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Selenization 온도가 Cu2ZnSnSe4 박막의 특성에 미치는 영향 (Influence of Selenization Temperature on the Properties of Cu2ZnSnSe4 Thin Films)

  • 여수정;강명길;문종하;김진혁
    • Current Photovoltaic Research
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    • 제3권3호
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    • pp.97-100
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    • 2015
  • The kesterite $Cu_2ZnSnSe_4$ (CZTSe) thin film solar cells were synthesized by selenization of sputtered Cu/Sn/Zn metallic precursors on Mo coated soda lime glass substrate in Ar atmosphere. Cu/Sn/Zn metallic precursors were deposited by DC magnetron sputtering process with 30 W power at room temperature. As-deposited metallic precursors were placed in a graphite box with Se pellets and selenized using rapid thermal processing furnace at various temperature ($480^{\circ}C{\sim}560^{\circ}C$) without using a toxic $H_2Se$ gas. Effects of Selenization temperature on the morphological, crystallinity, electrical properties and cell efficiency were investigated by field emission scanning electron microscope (FE-SEM) and X-ray diffraction (XRD), J-V measurement system and solar simulator. Further details about effects of selenization temperature on CZTSe thin films will be discussed.

Sputtering effect on chemical state changes in amorphous Ga-In-Zn-O thin film

  • 이미지;강세준;백재윤;김형도;정재관;이재철;이재학;신현준
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.134-134
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    • 2010
  • Ga-In-Zn-O 물질은 비정질상태에서 높은 전하 운동성을 가지고 있으며 차세대 투명전극 thin film transistor 대안 소재로 각광받고 있다. 그런데 이 물질은 ion sputtering에 따라 전기적인 특성에 큰 변화가 관찰되고 있으며, 이는 표면에서의 화학적 상태가 전기적 특성을 좌우할 것이라는 것을 의미한다. 또한 보다 안정적이고 신뢰적인 소자를 구현하기 위해서는 ion sputtering에 의한 표면에서의 화학적 특성 변화를 이해하는 것이 매우 중요하다는 것을 의미한다. 본 연구에서는 $Ga_2O_3:In_2O_3$:ZnO의 비율이 각각 1:1:1, 2:2:1, 3:2:1 그리고 4:2:1인 시료를 $Ne^+$이온을 이용하여 sputtering하면서 표면에 민감한 분광분석 기법인 x-ray photoelectron spectroscopy와 x-ray absorption spectroscopy를 이용하여 분광정보의 변화들을 연구하였다. 실험에 의하면, Ga 3d의 양에 비해서 In 4d, Zn 3d의 양은 sputtering 시간에 따라서 각 각 양이 줄어들었으며, 전체적으로 보다 산화가가 높은 경향을 보였으며, valence band maximum 근처에 subgap state를 형성하는 것을 관찰하였다. 또한 sputtering을 계속하는 경우 In 3d, In 4d, 및 Fermi energy 근처에 metallic state가 형성되는 것을 관찰하였다. 이러한 subgap state와 metallic state의 관측은 각기 sputtering에 따라서, 아직 명확하지는 않지만, surface state의 형성 및/혹은 oxygen interstitial의 형성 그리고 metallic In의 형성 및/혹은 oxygen defect의 형성이 이루어지는 것을 의미한다.

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Squeeze Casting법에 의해 제조된 A356/coated SiC복합재료의 미세조직과 기계적 특성에 관한 연구 (A Study on Microstructures and Mechanical Properties of A356/coated SiC Composites Fabricated by Squeeze Casting)

  • 이경구;이도재
    • 한국주조공학회지
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    • 제14권5호
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    • pp.429-437
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    • 1994
  • Influence of interfacial structure between matrix and particle in A356/coated SiC composite fabricated by squeeze casting method was studied. Experimental variables are types of coated metallic film on SiC particles such as Cu, Ni-P, and applied pressure for squeeze casting. It was found that coating treatment on SiC particles improves the wetting of liquid A356 alloy on SiC particles. SiC particle distribution is very homogeneous in A356 matrix alloy which is fabricated by squeeze casting. Analysing the surface morphology of fractured A356/coated SiC, it was concluded that metallic thin film by coating treatment on SiC particle improves the interfacial bonding between particle and matrix, and so does on mechanical properties such as tensile strength. However, there was on significant difference in hardness between those composite made of as-received SiC particle and coated SiC particle.

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금속 프리커서의 셀렌화에 의한 $Cu_2ZnSnSe_4$ 박막의 특성 (Characterization of $Cu_2ZnSnSe_4$ thin film produced by selenization of metallic precursor)

  • 아말 무하마드;힐미 무함마드;장윤정;김규호
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.85.2-85.2
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    • 2010
  • $Cu_2ZnSnSe_4$ (CZTSe) is one of candidate to alternate $Cu(In,Ga)Se_2$ as solar absorber material for solar cell. The expensive elements of In and Ga are replaced by Zn and Sn, respectively to lower the material cost. In this study we fabricated CZTSe thin film by selenization of single precursor layer consisted metallic constituent. Precursor compositions ratio were selected to have Cu-poor and Zn-rich content and prepared by RF magnetron sputtering. Thermal processing was applied to introduce selenium into as-deposited films at temperatures ranging from 350 to 500 for time up to 120 minutes. Single precursor films showed amorphous structure and consist of individual elements of Cu, Zn, and Sn. It was confirmed by XRD analysis that synthesis of CZTSe compound is occurred from lower temperature process, although concurrently additional phases such as binary cooper selenides are also existed. The quality of CZTSe crystal was improved as temperature increased. We also investigated the optical and electrical properties of as-selenized CZTSe as well.

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금속 표면결함 검출용 자기유도 마이크로 박막 센서 (Inductive Micro Thin Film Sensor for Metallic Surface Crack Detection)

  • 김기현
    • 비파괴검사학회지
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    • 제28권5호
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    • pp.395-400
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    • 2008
  • 비자성 및 자성 금속 시편의 표면 결함을 검출하기 위하여 교류자기장을 이용하였다. 비파괴 센서 프로브는 자성 박막 요크와 박막형 코일로 구성된 신호 검출부와 시편에 교류자기장을 인가하기 위한 단일 직선을 이용한 여기 코일로 이루어져 있다. 박막형 유도 코일 센서는 스퍼터, 전기도금, 건식 식각과 사진식각 공정을 이용하여 제작되었다. 시편에 교류자기장을 인가하기 위하여 0.7 MHz-1.8 MHz 주파수 영역에서 0.1A-1.0A의 교류전류를 여기코일에 인가하였다. 센서의 특성은 최소 0.5 mm의 깊이와 폭을 가진 인위적인 슬릿 형태 비자성체 Al과 자성체 FeC 결함 시편을 이용하여 측정하였다. 측정된 신호는 높은 감도를 갖고 결함 시편위의 슬릿결함의 위치와 일치함을 알 수 있었다. 또한 박막형 유도 코일 센서를 이용하여 마이크론 크기의 표면 결함을 가진 자성체 FeC의 시편을 비접촉 스캔하여 측정된 유도전압의 변화를 이미지화 하였으며 그 결과를 광학적 이미지와 비교하였다.